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James L. Drewniak - Publications

Affiliations: 
University of Missouri-Rolla, Rolla, MO, United States 
Area:
Electronics and Electrical Engineering
Website:
https://emclab.mst.edu/members/emeritus-faculty/james-drewniak/
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105 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Zheng Y, Weng Z, Qi Y, Fan J, Li F, Yang Z, Drewniak JL. Calibration Loop Antenna for Multiple Probe Antenna Measurement System Ieee Transactions On Instrumentation and Measurement. 69: 5745-5754. DOI: 10.1109/Tim.2019.2963507  0.464
2020 Li J, Qi Y, Yu W, Li F, Fan J, Yang Z, Wu S, Drewniak JL. Total Isotropic Sensitivity Measurement in Switched Beam Antenna Systems Ieee Transactions On Instrumentation and Measurement. 69: 5458-5467. DOI: 10.1109/Tim.2019.2958472  0.443
2020 Liu Y, Yong S, Gao H, Hinaga S, Padilla D, Yanagawa D, Drewniak JL, Khilkevich V. S -Parameter De-Embedding Error Estimation Based on the Statistical Circuit Models of Fixtures Ieee Transactions On Electromagnetic Compatibility. 62: 1459-1467. DOI: 10.1109/Temc.2020.2992553  0.334
2020 Makharashvili T, Bai S, Maghlakelidze G, Connor S, Ruehli AE, Berger P, Drewniak JL, Beetner DG. Accurate Inductance Models of Mounted Two-Terminal Decoupling Capacitors Ieee Transactions On Electromagnetic Compatibility. 1-9. DOI: 10.1109/Temc.2020.2987995  0.319
2020 Yong S, Khilkevich V, Liu Y, Gao H, Hinaga S, De S, Padilla D, Yanagawa D, Drewniak J. Dielectric Loss Tangent Extraction Using Modal Measurements and 2-D Cross-Sectional Analysis for Multilayer PCBs Ieee Transactions On Electromagnetic Compatibility. 62: 1278-1292. DOI: 10.1109/Temc.2019.2949021  0.375
2020 Talebzadeh A, Vuppunutala PK, Koo K, Li H, Nadolny J, Liu Q, Li J, Ghosh K, Sochoux PC, Khilkevich V, Drewniak JL, Pommerenke D. Coupling Path Visualization and EMI Mitigation for Flyover QSFP Connectors Ieee Transactions On Electromagnetic Compatibility. 62: 1037-1044. DOI: 10.1109/Temc.2019.2943290  0.375
2020 Zhao B, Bai S, Connor S, Becker WD, Cocchini M, Cho J, Ruehli A, Archambeault B, Drewniak JL. Physics-Based Circuit Modeling Methodology for System Power Integrity Analysis and Design Ieee Transactions On Electromagnetic Compatibility. 62: 1266-1277. DOI: 10.1109/Temc.2019.2927742  0.406
2020 Kim H, Cho J, Yoon C, Achkir B, Drewniak J, Fan J. Modeling and Analysis of On-Chip Power Noise Induced by an On-Chip Linear Voltage Regulator Module With a High-Speed Output Buffer Ieee Transactions On Electromagnetic Compatibility. 62: 880-893. DOI: 10.1109/Temc.2019.2921008  0.478
2020 Makharashvili T, Bai S, Connor S, Ruehli AE, Berger P, Drewniak JL, Beetner DG. Circuit Models for the Inductance of Eight-Terminal Decoupling Capacitors Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 142-150. DOI: 10.1109/Tcpmt.2019.2952138  0.399
2020 Chi L, Weng Z, Meng S, Qi Y, Fan J, Zhuang W, Drewniak JL. Rugged Linear Array for IoT Applications Ieee Internet of Things Journal. 7: 5078-5087. DOI: 10.1109/Jiot.2020.2976857  0.459
2018 Hardin KB, Cao YS, Hosseinbeig A, Zhao B, Dikhaminjia N, Kratzer ZCN, Fessler JT, Drewniak JL. Z-Directed Component (ZDC) Technology for Power Integrity Applications Ieee Transactions On Electromagnetic Compatibility. 60: 1948-1956. DOI: 10.1109/Temc.2018.2810853  0.389
2018 Chada A, Mutnury B, Dikhaminjia N, Tsiklauri M, Fan J, Drewniak JL. Improved Transmitter Jitter Modeling for Accurate Bit Error Rate (BER) Eye Contours Using Transient Simulation of Short Bit Patterns Ieee Transactions On Electromagnetic Compatibility. 60: 1520-1528. DOI: 10.1109/Temc.2017.2776080  0.415
2018 Qi Y, Wu J, Gong G, Fan J, Orlandi A, Yu W, Ma J, Drewniak JL. Notice of Retraction: Review of the EMC Aspects of Internet of Things Ieee Transactions On Electromagnetic Compatibility. 60: 1152-1160. DOI: 10.1109/Temc.2017.2775651  0.422
2018 Yang S, Cao YS, Ma H, Cho J, Ruehli AE, Drewniak JL, Li E. PCB PDN Prelayout Library for Top-Layer Inductance and the Equivalent Model for Decoupling Capacitors Ieee Transactions On Electromagnetic Compatibility. 60: 1898-1906. DOI: 10.1109/Temc.2017.2768226  0.397
2018 Koo K, Luevano GR, Wang T, Ozbayat S, Michalka T, Drewniak JL. Fast Algorithm for Minimizing the Number of decap in Power Distribution Networks Ieee Transactions On Electromagnetic Compatibility. 60: 725-732. DOI: 10.1109/Temc.2017.2746677  0.309
2018 Patnaik A, De S, Zhang Y, Drewniak JL, Wang C, Jackson C, Pommerenke D. EMI Analysis of DVI Link Connectors Ieee Transactions On Electromagnetic Compatibility. 60: 149-156. DOI: 10.1109/Temc.2017.2702707  0.319
2018 Chen Y, Deng H, Chen B, Zai R, Hsu J, Ye X, Fan J, Drewniak J. Signal-signal D-probe and unified launch pad designs Ieee Electromagnetic Compatibility Magazine. 7: 101-106. DOI: 10.1109/Memc.2018.8479348  0.713
2017 Paulis Fd, Piersanti S, Wang Q, Cho J, Erickson N, Achkir B, Fan J, Drewniak J, Orlandi A. TEM-Like Launch Geometries and Simplified De-embedding for Accurate Through Silicon Via Characterization Ieee Transactions On Instrumentation and Measurement. 66: 792-801. DOI: 10.1109/Tim.2017.2654068  0.468
2017 Zhang L, Li X, Jiao X, Li J, Toor SS, Bhobe AU, Pommerenke DJ, Drewniak JL. EMI Coupling Paths and Mitigation in Optical Transceiver Modules Ieee Transactions On Electromagnetic Compatibility. 59: 1848-1855. DOI: 10.1109/Temc.2017.2697761  0.35
2017 Cao YS, Wang Y, Jiang L, Ruehli AE, Fan J, Drewniak JL. Quantifying EMI: A Methodology for Determining and Quantifying Radiation for Practical Design Guidelines Ieee Transactions On Electromagnetic Compatibility. 59: 1424-1432. DOI: 10.1109/Temc.2017.2677199  0.468
2017 Piersanti S, Paulis Fd, Orlandi A, Connor S, Archambeault B, Dixon P, Khorrami MA, Drewniak JL. Electric Dipole Equations in Very-Near-Field Conditions for Electromagnetic Shielding Assessment—Part II: Wave Impedance, Reflection, and Transmission Ieee Transactions On Electromagnetic Compatibility. 59: 1203-1210. DOI: 10.1109/Temc.2017.2674183  0.301
2017 Piersanti S, Paulis Fd, Orlandi A, Connor S, Archambeault B, Dixon P, Khorrami M, Drewniak JL. Electric Dipole Equations in Very Near Field Conditions for Electromagnetic Shielding Assessment. Part I: Radiation Equations Ieee Transactions On Electromagnetic Compatibility. 59: 1196-1202. DOI: 10.1109/Temc.2017.2674179  0.317
2017 Shringarpure K, Pan S, Kim J, Fan J, Achkir B, Archambeault B, Drewniak JL. Sensitivity Analysis of a Circuit Model for Power Distribution Network in a Multilayered Printed Circuit Board Ieee Transactions On Electromagnetic Compatibility. 59: 1993-2001. DOI: 10.1109/Temc.2017.2673851  0.518
2017 Cao YS, Makharashvili T, Cho J, Bai S, Connor S, Archambeault B, Jiang L, Ruehli AE, Fan J, Drewniak JL. Inductance Extraction for PCB Prelayout Power Integrity Using PMSR Method Ieee Transactions On Electromagnetic Compatibility. 59: 1339-1346. DOI: 10.1109/Temc.2017.2672726  0.518
2017 Piersanti S, Paulis Fd, Orlandi A, Connor SR, Liu Q, Archambeault B, Dixon P, Khorrami MA, Drewniak JL. Near-Field Shielding Performances of EMI Noise Suppression Absorbers Ieee Transactions On Electromagnetic Compatibility. 59: 654-661. DOI: 10.1109/Temc.2016.2626299  0.333
2016 Wei L, Li L, Shringarpure K, Ruehli AE, Wheeler E, Fan J, Archambeault B, Drewniak JL. Plane-Pair PEEC Model for Power Distribution Networks With Sub-Meshing Techniques Ieee Transactions On Microwave Theory and Techniques. DOI: 10.1109/Tmtt.2016.2518164  0.507
2016 Shringarpure K, Pan S, Kim J, Fan J, Achkir B, Archambeault B, Drewniak JL. Formulation and Network Model Reduction for Analysis of the Power Distribution Network in a Production-Level Multilayered Printed Circuit Board Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2016.2535459  0.517
2016 Halligan MS, Tian X, Li X, Connor S, Beetner DG, Drewniak JL. Quantifying High-Density Connector Radiation in a Lossy Multisignal Environment Ieee Transactions On Electromagnetic Compatibility. 58: 270-277. DOI: 10.1109/Temc.2015.2502267  0.384
2015 Chada A, Mutnury B, Fan J, Drewniak JL. Crosstalk Impact of Periodic-Coupled Routing on Eye Opening of High-Speed Links in PCBs Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2015.2476700  0.465
2015 Chada A, Mutnury B, Fan J, Drewniak JL. Quantifying the Impact of FEXT on Eye Margin for Coupled Lines in Inhomogeneous Media Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2015.2476696  0.471
2015 Sui C, Ren L, Gao X, Pan J, Drewniak JL, Beetner DG. Predicting Statistical Characteristics of Jitter Due to Simultaneous Switching Noise Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2015.2474124  0.338
2015 Dikhaminjia N, Rogava J, Tsiklauri M, Zvonkin M, Fan J, Drewniak JL. Fast Approximation of Sine and Cosine Hyperbolic Functions for the Calculation of the Transmission Matrix of a Multiconductor Transmission Line Ieee Transactions On Electromagnetic Compatibility. 57: 1698-1704. DOI: 10.1109/Temc.2015.2470176  0.412
2015 Tian X, Halligan MS, Gui L, Li X, Kim K, Connor S, Archambeault B, Cracraft M, Ruehli A, Li Q, Pommerenke D, Drewniak JL. Quantifying Radiation and Physics from Edge-Coupled Signal Connectors Ieee Transactions On Electromagnetic Compatibility. 57: 780-787. DOI: 10.1109/Temc.2015.2440372  0.75
2015 Li J, Li X, Toor S, Fan H, Bhobe AU, Fan J, Drewniak JL. EMI Coupling Paths and Mitigation in a Board-to-Board Connector Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2015.2439687  0.488
2015 Jing S, Zhang Y, Li J, Liu D, Koledintseva MY, Pommerenke DJ, Fan J, Drewniak JL. Extraction of Permittivity and Permeability for Ferrites and Flexible Magnetodielectric Materials Using a Genetic Algorithm Ieee Transactions On Electromagnetic Compatibility. 57: 349-356. DOI: 10.1109/Temc.2015.2389332  0.452
2015 Yoon C, Tsiklauri M, Zvonkin M, Chen QB, Razmadze A, Aflaki A, Kim J, Fan J, Drewniak JL. Design Criteria and Error Sensitivity of Time-Domain Channel Characterization (TCC) for Asymmetry Fixture De-Embedding Ieee Transactions On Electromagnetic Compatibility. 57: 836-846. DOI: 10.1109/Temc.2014.2379627  0.419
2015 Rakov AV, De S, Koledintseva MY, Hinaga S, Drewniak JL, Stanley RJ. Quantification of conductor surface roughness profiles in printed circuit boards Ieee Transactions On Electromagnetic Compatibility. 57: 264-273. DOI: 10.1109/Temc.2014.2375274  0.312
2014 Koledintseva MY, Rakov AV, Koledintsev AI, Drewniak JL, Hinaga S. Improved Experiment-Based Technique to Characterize Dielectric Properties of Printed Circuit Boards Ieee Transactions On Electromagnetic Compatibility. 56: 1559-1566. DOI: 10.1109/Temc.2014.2317812  0.331
2014 Guo X, Jackson DR, Koledintseva MY, Hinaga S, Drewniak JL, Chen J. An Analysis of Conductor Surface Roughness Effects on Signal Propagation for Stripline Interconnects Ieee Transactions On Electromagnetic Compatibility. 56: 707-714. DOI: 10.1109/Temc.2013.2294958  0.365
2014 Ren L, Li T, Chandra S, Chen X, Bishnoi H, Sun S, Boyle P, Zamek I, Fan J, Beetner DG, Drewniak JL. Prediction of power supply noise from switching activity in an FPGA Ieee Transactions On Electromagnetic Compatibility. 56: 699-706. DOI: 10.1109/Temc.2013.2293872  0.494
2014 Paulis Fd, Nisanci MH, Orlandi A, Koledintseva MY, Drewniak JL. Design of Homogeneous and Composite Materials From Shielding Effectiveness Specifications Ieee Transactions On Electromagnetic Compatibility. 56: 343-351. DOI: 10.1109/Temc.2013.2280463  0.312
2013 Archambeault B, Connor S, Halligan MS, Drewniak JL, Ruehli AE. Electromagnetic Radiation Resulting From PCB/High-Density Connector Interfaces Ieee Transactions On Electromagnetic Compatibility. 55: 614-623. DOI: 10.1109/Temc.2013.2261736  0.339
2012 Koledintseva MY, Huang J, Drewniak JL, DuBroff RE, Archambeault B. Modeling of Metasheets Embedded in Dielectric Layers Progress in Electromagnetics Research B. 44: 89-116. DOI: 10.2528/Pierb12070910  0.314
2012 Kim J, Li L, Wu S, Wang H, Takita Y, Takeuchi H, Araki K, Fan J, Drewniak JL. Closed-Form Expressions for the Maximum Transient Noise Voltage Caused by an IC Switching Current on a Power Distribution Network Ieee Transactions On Electromagnetic Compatibility. 54: 1112-1124. DOI: 10.1109/Temc.2012.2194786  0.437
2012 Koul A, Koledintseva MY, Hinaga S, Drewniak JL. Differential Extrapolation Method for Separating Dielectric and Rough Conductor Losses in Printed Circuit Boards Ieee Transactions On Electromagnetic Compatibility. 54: 421-433. DOI: 10.1109/Temc.2010.2087341  0.372
2012 Rimolo-Donadio R, Selli G, De Paulis F, Gu X, Kwark YH, Drewniak JL, Bruens HD, Schuster C. Signal integrity: Efficient, physics-based via modeling: Integration of striplines Ieee Electromagnetic Compatibility Magazine. 1: 74-81. DOI: 10.1109/Memc.2012.6244976  0.356
2012 Koledintseva MY, Khilkevich VV, Razmadze AG, Gafarov AG, De S, Drewniak JL. Evaluation of absorptive properties and permeability of thin sheet magneto-dielectric materials Journal of Magnetism and Magnetic Materials. 324: 3389-3392. DOI: 10.1016/J.Jmmm.2012.02.049  0.32
2011 Koledintseva M, Razmadze AG, Gafarov AY, Khilkevich V, Drewniak JL, Tsutaoka T. Attenuation In Extended Structures Coated With Thin Magneto-Dielectric Absorber Layer Progress in Electromagnetics Research-Pier. 118: 441-459. DOI: 10.2528/Pier11053012  0.374
2011 Kim J, Fan J, Ruehli AE, Kim J, Drewniak JL. Inductance Calculations for Plane-Pair Area Fills With Vias in a Power Distribution Network Using a Cavity Model and Partial Inductances Ieee Transactions On Microwave Theory and Techniques. 59: 1909-1924. DOI: 10.1109/Tmtt.2011.2156807  0.497
2011 Koledintseva MY, Xu J, De S, Drewniak JL, He Y, Johnson R. Systematic Analysis and Engineering of Absorbing Materials Containing Magnetic Inclusions for EMC Applications Ieee Transactions On Magnetics. 47: 317-323. DOI: 10.1109/Tmag.2010.2084991  0.347
2011 Paulis Fd, Nisanci M, Koledintseva MY, Drewniak JL, Orlandi A. From Maxwell Garnett to Debye Model for Electromagnetic Simulation of Composite Dielectrics—Part II: Random Cylindrical Inclusions Ieee Transactions On Electromagnetic Compatibility. 53: 933-942. DOI: 10.1109/Temc.2011.2158217  0.35
2011 Hu K, Weng H, Beetner DG, Pommerenke D, Drewniak J. Unbalanced Currents in Integrated Circuits and Their Effect on TEM Cell Emissions Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/Temc.2011.2118214  0.376
2011 Kim J, Shringarpure K, Fan J, Kim J, Drewniak JL. Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays Ieee Microwave and Wireless Components Letters. 21: 62-64. DOI: 10.1109/Lmwc.2010.2100079  0.517
2010 Zhang J, Koledintseva MY, Antonini G, Drewniak JL, Orlandi A, Rozanov KN. Planar Transmission Line Method For Characterization Of Printed Circuit Board Dielectrics Progress in Electromagnetics Research-Pier. 102: 267-286. DOI: 10.2528/Pier10012807  0.381
2010 Xu J, Koledintseva MY, Zhang Y, He Y, Matlin B, Dubroff RE, Drewniak JL, Zhang J. Complex permittivity and permeability measurements and finite-difference time-domain simulation of ferrite materials Ieee Transactions On Electromagnetic Compatibility. 52: 878-887. DOI: 10.1109/Temc.2010.2050693  0.365
2010 Zhang J, Drewniak JL, Pommerenke DJ, Koledintseva MY, DuBroff RE, Cheng W, Yang Z, Chen QB, Orlandi A. Causal RLGC ( $f$ ) Models for Transmission Lines From Measured $S$ -Parameters Ieee Transactions On Electromagnetic Compatibility. 52: 189-198. DOI: 10.1109/Temc.2009.2035055  0.343
2010 Lian K, Eliacin M, Lempkowski R, Chason M, O'Keefe M, Drewniak JL. RF-MEMS Switches on a Printed Circuit Board Platform Circuit World. 36: 12-17. DOI: 10.1108/03056121011087186  0.321
2009 Koledintseva MY, Drewniak JL, DuBroff RE, Rozanov KN, Archambeault B. Modeling of Shielding Composite Materials and Structures for Microwave Frequencies Progress in Electromagnetics Research B. 15: 197-215. DOI: 10.2528/Pierb09050410  0.319
2009 Koledintseva M, Drewniak JL, Zhang Y, Lenn JA, Thoms M. Modeling of ferrite-based materials for shielding enclosures Journal of Magnetism and Magnetic Materials. 321: 730-733. DOI: 10.1016/J.Jmmm.2008.11.037  0.335
2008 Koledintseva MY, Drewniak JL, Doren TPV, Pommerenke DJ, Cocchini M, Hockanson DM. Mutual External Inductance in Stripline Structures Progress in Electromagnetics Research-Pier. 80: 349-368. DOI: 10.2528/Pier07111503  0.313
2008 Koledintseva MY, Drewniak JL, Doren TPV, Pommerenke DJ, Cocchini M, Hockanson DM. Method of edge currents for calculating mutual external inductance in a microstrip structure Progress in Electromagnetics Research-Pier. 80: 197-224. DOI: 10.2528/Pier07101504  0.335
2008 Zhang J, Koledintseva MY, Drewniak JL, Pommerenke DJ, DuBroff RE, Yang Z, Cheng W, Rozanov KN, Antonini G, Orlandi A. Reconstruction of Dispersive Dielectric Properties for PCB Substrates Using a Genetic Algorithm Ieee Transactions On Electromagnetic Compatibility. 50: 704-714. DOI: 10.1109/Temc.2008.927923  0.344
2007 Koledintseva MY, DuBroff RE, Schwartz RW, Drewniak JL. Double Statistical Distribution of Conductivity and Aspect Ratio of Inclusions in Dielectric Mixtures at Microwave Frequencies Progress in Electromagnetics Research-Pier. 77: 193-214. DOI: 10.2528/Pier07073103  0.323
2007 Sun S, Liu G, Drewniak JL, Pommerenke DJ. Hand-assembled cable bundle modeling for crosstalk and common-mode radiation prediction Ieee Transactions On Electromagnetic Compatibility. 49: 708-718. DOI: 10.1109/Temc.2007.897142  0.365
2007 Wang T, Chen S, Tsai C, Wu S, Drewniak JL, Wu T. Modeling Noise Coupling Between Package and PCB Power/Ground Planes With an Efficient 2-D FDTD/Lumped Element Method Ieee Transactions On Advanced Packaging. 30: 864-871. DOI: 10.1109/Tadvp.2007.901764  0.402
2006 Koledintseva M, Ravva PC, Huang J, Drewniak JL, Sabirov MM, Bodrov VV, Sourkova IV, Sourkov VI. Power Absorption of Near Field of Elementary Radiators in Proximity of a Composite Layer Piers Online. 2: 15-21. DOI: 10.2529/Piers050907200828  0.307
2006 Wang C, Mao J, Selli G, Luan S, Zhang L, Fan J, Pommerenke DJ, DuBroff RE, Drewniak JL. An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances Ieee Transactions On Advanced Packaging. 29: 320-334. DOI: 10.1109/Tadvp.2006.871202  0.512
2005 Koledintseva MY, Drewniak JL, Pommerenke DJ, Antonini G, Orlandi A, Rozanov KN. Wide-band Lorentzian media in the FDTD algorithm Ieee Transactions On Electromagnetic Compatibility. 47: 392-399. DOI: 10.1109/Temc.2005.847406  0.343
2005 Wang C, Leone M, Drewniak JL, Orlandi A. Coupling between differential signals and the dc power-bus in multilayer PCBs Ieee Transactions On Advanced Packaging. 28: 337-345. DOI: 10.1109/Tadvp.2005.846938  0.374
2004 Murano K, Sanpei T, Xiao F, Wang C, Kami Y, Drewniak JL. Susceptibility characterization of a cavity with an aperture by using slowly rotating EM fields: FDTD analysis and measurements Ieee Transactions On Electromagnetic Compatibility. 46: 169-177. DOI: 10.1109/Temc.2004.826870  0.379
2004 Sudo T, Sasaki H, Masuda N, Drewniak JL. Electromagnetic interference (EMI) of system-on-package (SOP) Ieee Transactions On Advanced Packaging. 27: 304-314. DOI: 10.1109/Tadvp.2004.828817  0.435
2003 Orlandi A, Drewniak JL. Electromagnetic compatibility issues in mobile computing Ieee Transactions On Mobile Computing. 2: 273-274. DOI: 10.1109/Tmc.2003.1255642  0.377
2003 Cui W, Fan J, Ren Y, Shi H, Drewniak JL, DuBroff RE. DC power-bus noise isolation with power-plane segmentation Ieee Transactions On Electromagnetic Compatibility. 45: 436-443. DOI: 10.1109/Temc.2003.811296  0.453
2003 Wang K, Pommerenke D, Chundru R, Van Doren T, Drewniak JL, Shashindranath A. Numerical modeling of electrostatic discharge generators Ieee Transactions On Electromagnetic Compatibility. 45: 258-271. DOI: 10.1109/Temc.2003.810817  0.315
2003 Fan J, Drewniak JL, Knighten JL. Lumped-circuit model extraction for vias in multilayer substrates Ieee Transactions On Electromagnetic Compatibility. 45: 272-280. DOI: 10.1109/Temc.2003.810808  0.523
2003 Xu M, Hubing TH, Chen J, Van Doren TP, Drewniak JL, DuBroff RE. Power-bus decoupling with embedded capacitance in printed circuit board design Ieee Transactions On Electromagnetic Compatibility. 45: 22-30. DOI: 10.1109/Temc.2002.808075  0.402
2002 Antonini G, Drewniak JL, Orlandi A, Ricchiuti V. Eye pattern evaluation in high-speed digital systems analysis by using MTL modeling Ieee Transactions On Microwave Theory and Techniques. 50: 1807-1815. DOI: 10.1109/Tmtt.2002.800443  0.381
2002 Araneo R, Wang C, Gu X, Drewniak J, Celozzi S. Efficient modeling of discontinuities and dispersive media in printed transmission lines Ieee Transactions On Magnetics. 38: 765-768. DOI: 10.1109/20.996198  0.389
2002 Ye X, Drewniak JL. FDTD modeling incorporating a two-port network for I/O line EMI filtering design Ieee Transactions On Electromagnetic Compatibility. 44: 175-181. DOI: 10.1109/15.990724  0.703
2002 Ye X, Drewniak JL, Nadolny J, Hockanson DM. High-performance inter-PCB connectors: analysis of EMI characteristics Ieee Transactions On Electromagnetic Compatibility. 44: 165-174. DOI: 10.1109/15.990723  0.743
2001 Ye X, Drewniak JL. Incorporating two-port networks with S-parameters into FDTD Ieee Microwave and Wireless Components Letters. 11: 77-79. DOI: 10.1109/7260.914308  0.7
2001 Fan J, Drewniak JL, Knighten JL, Smith NW, Orlandi A, Van Doren TP, Hubing TH, DuBroff RE. Quantifying SMT decoupling capacitor placement in dc power-bus design for multilayer PCBs Ieee Transactions On Electromagnetic Compatibility. 43: 588-599. DOI: 10.1109/15.974639  0.513
2001 Ye X, Koledintseva MY, Li M, Drewniak JL. DC power-bus design using FDTD modeling with dispersive media and surface mount technology components Ieee Transactions On Electromagnetic Compatibility. 43: 579-587. DOI: 10.1109/15.974638  0.744
2001 Ye X, Hockanson DA, Li M, Ren Y, Cui W, Drewniak JL, DuBroff RE. EMI mitigation with multilayer power-bus stacks and via stitching of reference planes Ieee Transactions On Electromagnetic Compatibility. 43: 538-548. DOI: 10.1109/15.974633  0.731
2001 Fan J, Drewniak JL, Shi H, Knighten JL. DC power-bus modeling and design with a mixed-potential integral-equation formulation and circuit extraction Ieee Transactions On Electromagnetic Compatibility. 43: 426-436. DOI: 10.1109/15.974622  0.52
2001 Li M, Drewniak JL, Radu S, Nuebel J, Hubing TH, DuBroff RE, Van Doren TP. An EMI estimate for shielding-enclosure evaluation Ieee Transactions On Electromagnetic Compatibility. 43: 295-304. DOI: 10.1109/15.942602  0.323
2001 Huang Y, Butler JE, De Sorgo M, DuBroff RE, Hubing TH, Drewniak JL, Van Doren TP. EMI considerations in selecting heat-sink-thermal-gasket materials Ieee Transactions On Electromagnetic Compatibility. 43: 254-260. DOI: 10.1109/15.942598  0.366
2001 Hockanson DM, Ye X, Drewniak JL, Hubing TH, Van Doren TP, DuBroff RE. FDTD and experimental investigation of EMI from stacked-card PCB configurations Ieee Transactions On Electromagnetic Compatibility. 43: 1-10. DOI: 10.1109/15.917923  0.738
2000 Tichenor JL, Sudhoff SD, Drewniak JL. Behavioral IGBT modeling for predicting high frequency effects in motor drives Ieee Transactions On Power Electronics. 15: 354-360. DOI: 10.1109/63.838108  0.303
2000 Li M, Nuebel J, Drewniak JL, DuBroff RE, Hubing TH, Van Doren TP. EMI from airflow aperture arrays in shielding enclosures - experiments, FDTD, and MoM modeling Ieee Transactions On Electromagnetic Compatibility. 42: 265-275. DOI: 10.1109/15.865333  0.39
2000 Li M, Luo X, Drewniak JL. FDTD modeling of lumped ferrites Ieee Transactions On Electromagnetic Compatibility. 42: 142-151. DOI: 10.1109/15.852408  0.344
2000 Li M, Nuebel J, Drewniak JL, DuBroff RE, Hubing TH, Van Doren TP. EMI from cavity modes of shielding enclosures - FDTD modeling and measurements Ieee Transactions On Electromagnetic Compatibility. 42: 29-38. DOI: 10.1109/15.831702  0.389
1999 Sudhoff SD, Tichenor JK, Drewniak JL. Wide-bandwidth multiresolutional analysis of a surface-mounted PM synchronous machine Ieee Power Engineering Review. 19: 52. DOI: 10.1109/60.815021  0.358
1997 Shi H, Sha F, Drewniak JL, Van Doren TP, Hubing TH. An experimental procedure for characterizing interconnects to the DC power bus on a multilayer printed circuit board Ieee Transactions On Electromagnetic Compatibility. 39: 279-285. DOI: 10.1109/15.649812  0.393
1997 Li M, Ma KP, Hockanson DM, Drewniak JL, Hubing TH, Van Doren TP. Numerical and experimental corroboration of an FDTD thin-slot model for slots near corners of shielding enclosures Ieee Transactions On Electromagnetic Compatibility. 39: 225-232. DOI: 10.1109/15.618050  0.391
1997 Ma KP, Li M, Drewniak JL, Hubing TH, Van Doren TP. Comparison of FDTD algorithms for subcellular modeling of slots in shielding enclosures Ieee Transactions On Electromagnetic Compatibility. 39: 147-155. DOI: 10.1109/15.584937  0.34
1996 Drewniak JL, Dunn F. An experimentally obtainable heat source due to absorption of ultrasound in biological media. The Journal of the Acoustical Society of America. 100: 1250-3. PMID 8759972 DOI: 10.1121/1.415974  0.699
1996 Shi H, Drewniak JL. Dispersion comparison for DSI- and tensor-based nonorthogonal FDTD Ieee Microwave and Guided Wave Letters. 6: 193-195. DOI: 10.1109/75.491502  0.307
1996 Hockanson DM, Drewniak JL, Hubing TH, Van Doren TP, Sha F, Wilhelm MJ. Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cables Ieee Transactions On Electromagnetic Compatibility. 38: 557-566. DOI: 10.1109/15.544310  0.346
1996 Hockanson DM, Drewniak JL, Hubing TH, Van Doren TP. FDTD modeling of common-mode radiation from cables Ieee Transactions On Electromagnetic Compatibility. 38: 376-387. DOI: 10.1109/15.536068  0.438
1995 Hubing TH, Drewniak JL, Van Doren TP, Hockanson DM. Power Bus Decoupling on Multilayer Printed Circuit Boards Ieee Transactions On Electromagnetic Compatibility. 37: 155-166. DOI: 10.1109/Memc.2020.9133248  0.37
1991 Carnes KI, Drewniak JL, Dunn F. In utero measurement of ultrasonically induced fetal mouse temperature increases. Ultrasound in Medicine & Biology. 17: 373-82. PMID 1949349 DOI: 10.1016/0301-5629(91)90137-L  0.698
1991 Drewniak JL, Mayes PE. The synthesis of patterns using a series-fed array of annular sector radiating line (ANSERLIN) elements: Low-profile, circularly polarized radiators Ieee Transactions On Antennas and Propagation. 39: 184-189. DOI: 10.1109/8.68180  0.339
1989 Drewniak JL, Carnes KI, Dunn F. In vitro ultrasonic heating of fetal bone. The Journal of the Acoustical Society of America. 86: 1254-8. PMID 2681313 DOI: 10.1121/1.398739  0.694
1989 Drewniak JL, Mayes PE. ANSERLIN. a broad-band, low-profile, circularly polarized antenna Ieee Transactions On Antennas and Propagation. 37: 281-288. DOI: 10.1109/8.18723  0.345
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