Year |
Citation |
Score |
2023 |
Li X, Lin Y, Cui L, Li C, Yang Z, Zhao S, Hao T, Wang G, Heo JY, Yu JC, Chang YW, Zhu J. Stretchable and Lithography-Compatible Interconnects Enabled by Self-Assembled Nanofilms with Interlocking Interfaces. Acs Applied Materials & Interfaces. PMID 37988740 DOI: 10.1021/acsami.3c11760 |
0.505 |
|
2023 |
Zhao S, Zhao Y, Li C, Wang W, Liu HY, Cui L, Li X, Yang Z, Zhang A, Wang Y, Lin Y, Hao T, Yin J, Kang J, Zhu J. Aramid Nanodielectrics for Ultraconformal Transparent Electronic Skins. Advanced Materials (Deerfield Beach, Fla.). e2305479. PMID 37705254 DOI: 10.1002/adma.202305479 |
0.535 |
|
2021 |
Zhao S, Liu HY, Cui L, Kang Y, Bian G, Yin J, Yu JC, Chang YW, Zhu J. Elastomeric Nanodielectrics for Soft and Hysteresis-Free Electronics. Advanced Materials (Deerfield Beach, Fla.). e2104761. PMID 34632640 DOI: 10.1002/adma.202104761 |
0.468 |
|
2020 |
Kang Y, Wang G, Zhao S, Li J, Di L, Feng Y, Yin J, Zhu J. High-Resolution Printable and Elastomeric Conductors from Strain-Adaptive Assemblies of Metallic Nanoparticles with Low Aspect Ratios. Small (Weinheim An Der Bergstrasse, Germany). e2004793. PMID 33230930 DOI: 10.1002/smll.202004793 |
0.458 |
|
2020 |
Wang Z, Kang Y, Zhao S, Zhu J. Nanoadditive Manufacturing: Self‐Limiting Assembly Approaches for Nanoadditive Manufacturing of Electronic Thin Films and Devices (Adv. Mater. 3/2020) Advanced Materials. 32: 2070021. DOI: 10.1002/Adma.202070021 |
0.494 |
|
2019 |
Wang CP, Liu HY, Bian G, Gao X, Zhao S, Kang Y, Zhu J, Bu XH. Metal-Layer Assisted Growth of Ultralong Quasi-2D MOF Nanoarrays on Arbitrary Substrates for Accelerated Oxygen Evolution. Small (Weinheim An Der Bergstrasse, Germany). e1906086. PMID 31762172 DOI: 10.1002/Smll.201906086 |
0.5 |
|
2019 |
Wang Z, Kang Y, Zhao S, Zhu J. Self-Limiting Assembly Approaches for Nanoadditive Manufacturing of Electronic Thin Films and Devices. Advanced Materials (Deerfield Beach, Fla.). e1806480. PMID 30907467 DOI: 10.1002/Adma.201806480 |
0.52 |
|
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