Alan C. West - Publications

Affiliations: 
1985-1989 Chemical Engineering University of California, Berkeley, Berkeley, CA 
 1991- Chemical Engineering Columbia University, New York, NY 
Area:
Electrochemical Engineering
Website:
http://columbia-electrochem-lab.org/

54 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2021 Aksit A, Lalwani AK, Kysar JW, West AC. Simulation assisted design for microneedle manufacturing: Computational modeling of two-photon templated electrodeposition. Journal of Manufacturing Processes. 66: 211-219. PMID 34012359 DOI: 10.1016/j.jmapro.2021.04.023  0.779
2020 Aksit A, Rastogi S, Nadal ML, Parker AM, Lalwani AK, West AC, Kysar JW. Drug delivery device for the inner ear: ultra-sharp fully metallic microneedles. Drug Delivery and Translational Research. PMID 32488817 DOI: 10.1007/S13346-020-00782-9  0.777
2014 Vilinska A, Ponnurangam S, Chernyshova I, Somasundaran P, Eroglu D, Martinez J, West AC. Stabilization of Silicon Carbide (SiC) micro- and nanoparticle dispersions in the presence of concentrated electrolyte. Journal of Colloid and Interface Science. 423: 48-53. PMID 24703667 DOI: 10.1016/J.Jcis.2014.02.007  0.671
2013 Eroglu D, West AC. Mathematical modeling of Ni/SiC co-deposition in the presence of a cationic dispersant Journal of the Electrochemical Society. 160. DOI: 10.1149/2.052309Jes  0.681
2013 Eroglu D, Vilinska A, Somasundaran P, West AC. Effect of a cationic polymer, polyethyleneimine, on Ni/SiC co-deposition Journal of the Electrochemical Society. 160. DOI: 10.1149/2.041302Jes  0.7
2013 Eroglu D, Vilinska A, Somasundaran P, West AC. Use of dispersants to enhance incorporation rate of nano-particles into electrodeposited films Electrochimica Acta. 113: 628-634. DOI: 10.1016/J.Electacta.2013.09.113  0.675
2013 Volov I, Sun X, Gadikota G, Shi P, West AC. Electrodeposition of copper-tin film alloys for interconnect applications Electrochimica Acta. 89: 792-797. DOI: 10.1016/J.Electacta.2012.11.102  0.8
2012 Volov I, Swanson E, O'Brien B, Novak SW, Boom Rvd, Dunn K, West AC. Pulse-Plating of Copper-Silver Alloys for Interconnect Applications Journal of the Electrochemical Society. 159: D677-D683. DOI: 10.1149/2.066211Jes  0.77
2012 Eroglu D, West AC. Modeling of reaction kinetics and transport in the positive porous electrode in a sodium-iron chloride battery Journal of Power Sources. 203: 211-221. DOI: 10.1016/J.Jpowsour.2011.11.007  0.69
2011 Volov I, Mann O, Hoenersch Y, Wahl B, West AC. Chromatography of bis-(3-sulfopropyl) disulfide and its breakdown products by HPLC coupled with electrochemical detection Journal of Separation Science. 34: 2385-2390. PMID 21812114 DOI: 10.1002/Jssc.201100352  0.782
2011 Volov I, West AC. Interaction between SPS and MPS in the presence of ferrous and ferric ions Journal of the Electrochemical Society. 158. DOI: 10.1149/1.3593018  0.803
2011 Volov I, Saito T, West AC. Investigation of copper plating and additive interactions in the presence of Fe3+/Fe2+ redox couple Journal of the Electrochemical Society. 158. DOI: 10.1149/1.3575638  0.785
2011 Liu Z, Wu J, West AC. Electrochemical quartz crystal microbalance studies of gold oxidation in cyanide baths Electrochemical and Solid-State Letters. 14. DOI: 10.1149/1.3501991  0.632
2011 Liu Z, West AC. Modeling of galvanostatic pulse and pulsed reverse electroplating of gold Electrochimica Acta. 56: 3328-3333. DOI: 10.1016/J.Electacta.2011.01.020  0.627
2011 Liu Z, Zheng M, Hilty RD, West AC. The effect of pulse reversal on morphology of cobalt hard gold Electrochimica Acta. 56: 2546-2551. DOI: 10.1016/J.Electacta.2010.11.031  0.683
2010 Emekli U, West AC. Simulation of the effect of additives on electrochemical nucleation Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3457433  0.789
2010 Liu Z, Zheng M, Hilty RD, West AC. Effect of morphology and hydrogen evolution on porosity of electroplated cobalt hard gold Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3430076  0.706
2010 Emekli U, West AC. Electrochemical nucleation of copper: The effect of poly(ethylene glycol) Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3327902  0.8
2010 Emekli U, West AC. Simulation of electrochemical nucleation in the presence of additives under galvanostatic and pulsed plating conditions Electrochimica Acta. 56: 977-984. DOI: 10.1016/J.Electacta.2010.10.002  0.798
2009 Gallaway JW, Willey MJ, West AC. Copper filling of 100 nm trenches using PEG, PPG, and a triblock copolymer as plating suppressors Journal of the Electrochemical Society. 156. DOI: 10.1149/1.3142422  0.802
2009 Gallaway JW, Willey MJ, West AC. Acceleration kinetics of PEG, PPG, and a triblock copolymer by SPS during copper electroplating Journal of the Electrochemical Society. 156. DOI: 10.1149/1.3078405  0.812
2009 Emekli U, West AC. Effect of additives and pulse plating on copper nucleation onto Ru Electrochimica Acta. 54: 1177-1183. DOI: 10.1016/J.Electacta.2008.08.065  0.798
2009 Shattuck KG, West AC. An investigation of phosphate based ECMP electrolyte performance on feature scale planarization Journal of Applied Electrochemistry. 39: 1719-1724. DOI: 10.1007/S10800-009-9865-7  0.797
2008 Crowther O, West AC. Effect of electrolyte composition on lithium dendrite growth Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2969424  0.778
2008 Willey MJ, Emekli U, West AC. Uniformity effects when electrodepositing Cu onto resistive substrates in the presence of organic additives Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2837857  0.797
2008 Shattuck KG, Lin JY, Cojocaru P, West AC. Characterization of phosphate electrolytes for use in Cu electrochemical mechanical planarization Electrochimica Acta. 53: 8211-8216. DOI: 10.1016/J.Electacta.2008.05.077  0.796
2007 Willey MJ, Reid J, West AC. Adsorption kinetics of polyvinylpyrrolidone during copper electrodeposition Electrochemical and Solid-State Letters. 10. DOI: 10.1149/1.2436653  0.815
2007 Willey MJ, West AC. SPS adsorption and desorption during copper electrodeposition and its impact on PEG adsorption Journal of the Electrochemical Society. 154. DOI: 10.1149/1.2431320  0.804
2007 Willey MJ, West AC. Nucleation on resistive substrates: Analysis of effect on film uniformity Electrochimica Acta. 52: 6484-6489. DOI: 10.1016/J.Electacta.2007.04.049  0.801
2006 Willey MJ, West AC. Microfluidic studies of adsorption and desorption of polyethylene glycol during copper electrodeposition Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2335587  0.806
2006 Willey MJ, West AC. A microfluidic device to measure electrode response to changes in electrolyte composition Electrochemical and Solid-State Letters. 9. DOI: 10.1149/1.2201253  0.813
2005 Chao PG, Tang Z, Angelini E, West AC, Costa KD, Hung CT. Dynamic osmotic loading of chondrocytes using a novel microfluidic device. Journal of Biomechanics. 38: 1273-81. PMID 15863112 DOI: 10.1016/J.Jbiomech.2004.06.016  0.774
2005 Zheng M, Willey M, West AC. Electrochemical nucleation of copper on ruthenium effect of Cl -, PEG, and SPS Electrochemical and Solid-State Letters. 8. DOI: 10.1149/1.2035701  0.799
2004 Zheng M, West AC. Simulation of the influence of reactant depletion on nucleation rate in electrodeposition Journal of the Electrochemical Society. 151. DOI: 10.1149/1.1758722  0.46
2003 Radisic A, Cao Y, Taephaisitphongse P, West AC, Searson PC. Direct copper electrodeposition on TaN barrier layers Journal of the Electrochemical Society. 150. DOI: 10.1149/1.1565137  0.787
2003 Leonard EF, Tang Z, West AC, Shapley NC. MEMBRANELESS DIALYSIS IN A MICROFLUIDIC CONFIGURATION Asaio Journal. 49: 222. DOI: 10.1097/00002480-200303000-00321  0.77
2002 Tang Z, Hong S, Djukic D, Modi V, West AC, Yardley J, Osgood RM. Electrokinetic flow control for composition modulation in a microchannel Journal of Micromechanics and Microengineering. 12: 870-877. DOI: 10.1088/0960-1317/12/6/319  0.784
2001 Cao Y, Taephaisitphongse P, Chalupa R, West AC. Three-Additive Model of Superfilling of Copper Journal of the Electrochemical Society. 148. DOI: 10.1149/1.1377898  0.792
2001 Taephaisitphongse P, Cao Y, West AC. Electrochemical and Fill Studies of a Multicomponent Additive Package for Copper Deposition Journal of the Electrochemical Society. 148. DOI: 10.1149/1.1376636  0.803
2001 Chalupa R, Chen M, Modi V, West AC. Limiting Current Density on a Line Electrode in Impinging Slot-Jet Flows Journal of the Electrochemical Society. 148. DOI: 10.1149/1.1342180  0.798
2001 Chalupa R, Chen M, Modi V, West AC. High Schmidt mass transfer in a turbulent impinging slot-jet flow International Journal of Heat and Mass Transfer. 44: 3775-3785. DOI: 10.1016/S0017-9310(01)00042-4  0.793
2000 Chen M, Chalupa R, West AC, Modi V. High Schmidt mass transfer in a laminar impinging slot jet flow International Journal of Heat and Mass Transfer. 43: 3907-3915. DOI: 10.1016/S0017-9310(00)00052-1  0.795
1992 Grimm RD, West AC, Landolt D. AC Impedance Study of Anodically Formed Salt Films on Iron in Chloride Solution Journal of the Electrochemical Society. 139: 1622-1629. DOI: 10.1149/1.2069467  0.519
1992 Matlosz M, Vallotton PH, West AC, Landolt D. Nonuniform Current Distribution and Thickness During Electrodeposition onto Resistive Substrates Journal of the Electrochemical Society. 139: 752-761. DOI: 10.1149/1.2069297  0.541
1992 West AC, Madore C, Matlosz M, Landolt D. Shape Changes During Through-Mask Electrochemical Micromachining of Thin Metal Films Journal of the Electrochemical Society. 139: 499-506. DOI: 10.1149/1.2069245  0.527
1992 West AC, Grimm RD, Landolt D, Deslouis C, Tribollet B. Electrohydrodynamic impedance study of anodically formed salt films on iron in chloride solutions Journal of Electroanalytical Chemistry. 330: 693-706. DOI: 10.1016/0022-0728(92)80337-4  0.52
1992 Madore C, West AC, Matlosz M, Landolt D. Design Considerations for a cylindrical hull cell with forced convection Electrochimica Acta. 37: 69-74. DOI: 10.1016/0013-4686(92)80013-C  0.495
1992 West AC, Matlosz M, Landolt D. Primary current distribution in the Hull cell and related trapezoidal geometries Journal of Applied Electrochemistry. 22: 301-303. DOI: 10.1007/Bf01030192  0.456
1991 West AC, Newman J. Current Distributions on Recessed Electrodes Journal of the Electrochemical Society. 138: 1620-1625. DOI: 10.1149/1.2085844  0.431
1991 West AC, Matlosz M, Landolt D. Normalized and average current distributions on unevenly spaced patterns Journal of the Electrochemical Society. 138: 728-735. DOI: 10.1149/1.2085666  0.503
1990 West AC, Sukamto JH, Newman J. A Criterion to Verify Current Distribution Calculations Journal of the Electrochemical Society. 137: 2745-2752. DOI: 10.1149/1.2087051  0.429
1989 West AC, Newman J. Corrections to Kinetic Measurements Taken on a Disk Electrode Journal of the Electrochemical Society. 136: 139-143. DOI: 10.1149/1.2096573  0.429
1989 West AC, Newman J. Interpretation of Kinetic Rate Data Taken in a Channel Flow Cell Journal of the Electrochemical Society. 136: 3755-3759. DOI: 10.1149/1.2096542  0.44
1989 West AC, Newman J. Current Distribution near an Electrode Edge as a Primary Distribution Is Approached Journal of the Electrochemical Society. 136: 2935-2939. DOI: 10.1149/1.2096376  0.428
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