Year |
Citation |
Score |
2021 |
Aksit A, Lalwani AK, Kysar JW, West AC. Simulation assisted design for microneedle manufacturing: Computational modeling of two-photon templated electrodeposition. Journal of Manufacturing Processes. 66: 211-219. PMID 34012359 DOI: 10.1016/j.jmapro.2021.04.023 |
0.779 |
|
2020 |
Aksit A, Rastogi S, Nadal ML, Parker AM, Lalwani AK, West AC, Kysar JW. Drug delivery device for the inner ear: ultra-sharp fully metallic microneedles. Drug Delivery and Translational Research. PMID 32488817 DOI: 10.1007/S13346-020-00782-9 |
0.777 |
|
2014 |
Vilinska A, Ponnurangam S, Chernyshova I, Somasundaran P, Eroglu D, Martinez J, West AC. Stabilization of Silicon Carbide (SiC) micro- and nanoparticle dispersions in the presence of concentrated electrolyte. Journal of Colloid and Interface Science. 423: 48-53. PMID 24703667 DOI: 10.1016/J.Jcis.2014.02.007 |
0.671 |
|
2013 |
Eroglu D, West AC. Mathematical modeling of Ni/SiC co-deposition in the presence of a cationic dispersant Journal of the Electrochemical Society. 160. DOI: 10.1149/2.052309Jes |
0.681 |
|
2013 |
Eroglu D, Vilinska A, Somasundaran P, West AC. Effect of a cationic polymer, polyethyleneimine, on Ni/SiC co-deposition Journal of the Electrochemical Society. 160. DOI: 10.1149/2.041302Jes |
0.7 |
|
2013 |
Eroglu D, Vilinska A, Somasundaran P, West AC. Use of dispersants to enhance incorporation rate of nano-particles into electrodeposited films Electrochimica Acta. 113: 628-634. DOI: 10.1016/J.Electacta.2013.09.113 |
0.675 |
|
2013 |
Volov I, Sun X, Gadikota G, Shi P, West AC. Electrodeposition of copper-tin film alloys for interconnect applications Electrochimica Acta. 89: 792-797. DOI: 10.1016/J.Electacta.2012.11.102 |
0.8 |
|
2012 |
Volov I, Swanson E, O'Brien B, Novak SW, Boom Rvd, Dunn K, West AC. Pulse-Plating of Copper-Silver Alloys for Interconnect Applications Journal of the Electrochemical Society. 159: D677-D683. DOI: 10.1149/2.066211Jes |
0.77 |
|
2012 |
Eroglu D, West AC. Modeling of reaction kinetics and transport in the positive porous electrode in a sodium-iron chloride battery Journal of Power Sources. 203: 211-221. DOI: 10.1016/J.Jpowsour.2011.11.007 |
0.69 |
|
2011 |
Volov I, Mann O, Hoenersch Y, Wahl B, West AC. Chromatography of bis-(3-sulfopropyl) disulfide and its breakdown products by HPLC coupled with electrochemical detection Journal of Separation Science. 34: 2385-2390. PMID 21812114 DOI: 10.1002/Jssc.201100352 |
0.782 |
|
2011 |
Volov I, West AC. Interaction between SPS and MPS in the presence of ferrous and ferric ions Journal of the Electrochemical Society. 158. DOI: 10.1149/1.3593018 |
0.803 |
|
2011 |
Volov I, Saito T, West AC. Investigation of copper plating and additive interactions in the presence of Fe3+/Fe2+ redox couple Journal of the Electrochemical Society. 158. DOI: 10.1149/1.3575638 |
0.785 |
|
2011 |
Liu Z, Wu J, West AC. Electrochemical quartz crystal microbalance studies of gold oxidation in cyanide baths Electrochemical and Solid-State Letters. 14. DOI: 10.1149/1.3501991 |
0.632 |
|
2011 |
Liu Z, West AC. Modeling of galvanostatic pulse and pulsed reverse electroplating of gold Electrochimica Acta. 56: 3328-3333. DOI: 10.1016/J.Electacta.2011.01.020 |
0.627 |
|
2011 |
Liu Z, Zheng M, Hilty RD, West AC. The effect of pulse reversal on morphology of cobalt hard gold Electrochimica Acta. 56: 2546-2551. DOI: 10.1016/J.Electacta.2010.11.031 |
0.683 |
|
2010 |
Emekli U, West AC. Simulation of the effect of additives on electrochemical nucleation Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3457433 |
0.789 |
|
2010 |
Liu Z, Zheng M, Hilty RD, West AC. Effect of morphology and hydrogen evolution on porosity of electroplated cobalt hard gold Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3430076 |
0.706 |
|
2010 |
Emekli U, West AC. Electrochemical nucleation of copper: The effect of poly(ethylene glycol) Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3327902 |
0.8 |
|
2010 |
Emekli U, West AC. Simulation of electrochemical nucleation in the presence of additives under galvanostatic and pulsed plating conditions Electrochimica Acta. 56: 977-984. DOI: 10.1016/J.Electacta.2010.10.002 |
0.798 |
|
2009 |
Gallaway JW, Willey MJ, West AC. Copper filling of 100 nm trenches using PEG, PPG, and a triblock copolymer as plating suppressors Journal of the Electrochemical Society. 156. DOI: 10.1149/1.3142422 |
0.802 |
|
2009 |
Gallaway JW, Willey MJ, West AC. Acceleration kinetics of PEG, PPG, and a triblock copolymer by SPS during copper electroplating Journal of the Electrochemical Society. 156. DOI: 10.1149/1.3078405 |
0.812 |
|
2009 |
Emekli U, West AC. Effect of additives and pulse plating on copper nucleation onto Ru Electrochimica Acta. 54: 1177-1183. DOI: 10.1016/J.Electacta.2008.08.065 |
0.798 |
|
2009 |
Shattuck KG, West AC. An investigation of phosphate based ECMP electrolyte performance on feature scale planarization Journal of Applied Electrochemistry. 39: 1719-1724. DOI: 10.1007/S10800-009-9865-7 |
0.797 |
|
2008 |
Crowther O, West AC. Effect of electrolyte composition on lithium dendrite growth Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2969424 |
0.778 |
|
2008 |
Willey MJ, Emekli U, West AC. Uniformity effects when electrodepositing Cu onto resistive substrates in the presence of organic additives Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2837857 |
0.797 |
|
2008 |
Shattuck KG, Lin JY, Cojocaru P, West AC. Characterization of phosphate electrolytes for use in Cu electrochemical mechanical planarization Electrochimica Acta. 53: 8211-8216. DOI: 10.1016/J.Electacta.2008.05.077 |
0.796 |
|
2007 |
Willey MJ, Reid J, West AC. Adsorption kinetics of polyvinylpyrrolidone during copper electrodeposition Electrochemical and Solid-State Letters. 10. DOI: 10.1149/1.2436653 |
0.815 |
|
2007 |
Willey MJ, West AC. SPS adsorption and desorption during copper electrodeposition and its impact on PEG adsorption Journal of the Electrochemical Society. 154. DOI: 10.1149/1.2431320 |
0.804 |
|
2007 |
Willey MJ, West AC. Nucleation on resistive substrates: Analysis of effect on film uniformity Electrochimica Acta. 52: 6484-6489. DOI: 10.1016/J.Electacta.2007.04.049 |
0.801 |
|
2006 |
Willey MJ, West AC. Microfluidic studies of adsorption and desorption of polyethylene glycol during copper electrodeposition Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2335587 |
0.806 |
|
2006 |
Willey MJ, West AC. A microfluidic device to measure electrode response to changes in electrolyte composition Electrochemical and Solid-State Letters. 9. DOI: 10.1149/1.2201253 |
0.813 |
|
2005 |
Chao PG, Tang Z, Angelini E, West AC, Costa KD, Hung CT. Dynamic osmotic loading of chondrocytes using a novel microfluidic device. Journal of Biomechanics. 38: 1273-81. PMID 15863112 DOI: 10.1016/J.Jbiomech.2004.06.016 |
0.774 |
|
2005 |
Zheng M, Willey M, West AC. Electrochemical nucleation of copper on ruthenium effect of Cl -, PEG, and SPS Electrochemical and Solid-State Letters. 8. DOI: 10.1149/1.2035701 |
0.799 |
|
2004 |
Zheng M, West AC. Simulation of the influence of reactant depletion on nucleation rate in electrodeposition Journal of the Electrochemical Society. 151. DOI: 10.1149/1.1758722 |
0.46 |
|
2003 |
Radisic A, Cao Y, Taephaisitphongse P, West AC, Searson PC. Direct copper electrodeposition on TaN barrier layers Journal of the Electrochemical Society. 150. DOI: 10.1149/1.1565137 |
0.787 |
|
2003 |
Leonard EF, Tang Z, West AC, Shapley NC. MEMBRANELESS DIALYSIS IN A MICROFLUIDIC CONFIGURATION Asaio Journal. 49: 222. DOI: 10.1097/00002480-200303000-00321 |
0.77 |
|
2002 |
Tang Z, Hong S, Djukic D, Modi V, West AC, Yardley J, Osgood RM. Electrokinetic flow control for composition modulation in a microchannel Journal of Micromechanics and Microengineering. 12: 870-877. DOI: 10.1088/0960-1317/12/6/319 |
0.784 |
|
2001 |
Cao Y, Taephaisitphongse P, Chalupa R, West AC. Three-Additive Model of Superfilling of Copper Journal of the Electrochemical Society. 148. DOI: 10.1149/1.1377898 |
0.792 |
|
2001 |
Taephaisitphongse P, Cao Y, West AC. Electrochemical and Fill Studies of a Multicomponent Additive Package for Copper Deposition Journal of the Electrochemical Society. 148. DOI: 10.1149/1.1376636 |
0.803 |
|
2001 |
Chalupa R, Chen M, Modi V, West AC. Limiting Current Density on a Line Electrode in Impinging Slot-Jet Flows Journal of the Electrochemical Society. 148. DOI: 10.1149/1.1342180 |
0.798 |
|
2001 |
Chalupa R, Chen M, Modi V, West AC. High Schmidt mass transfer in a turbulent impinging slot-jet flow International Journal of Heat and Mass Transfer. 44: 3775-3785. DOI: 10.1016/S0017-9310(01)00042-4 |
0.793 |
|
2000 |
Chen M, Chalupa R, West AC, Modi V. High Schmidt mass transfer in a laminar impinging slot jet flow International Journal of Heat and Mass Transfer. 43: 3907-3915. DOI: 10.1016/S0017-9310(00)00052-1 |
0.795 |
|
1992 |
Grimm RD, West AC, Landolt D. AC Impedance Study of Anodically Formed Salt Films on Iron in Chloride Solution Journal of the Electrochemical Society. 139: 1622-1629. DOI: 10.1149/1.2069467 |
0.519 |
|
1992 |
Matlosz M, Vallotton PH, West AC, Landolt D. Nonuniform Current Distribution and Thickness During Electrodeposition onto Resistive Substrates Journal of the Electrochemical Society. 139: 752-761. DOI: 10.1149/1.2069297 |
0.541 |
|
1992 |
West AC, Madore C, Matlosz M, Landolt D. Shape Changes During Through-Mask Electrochemical Micromachining of Thin Metal Films Journal of the Electrochemical Society. 139: 499-506. DOI: 10.1149/1.2069245 |
0.527 |
|
1992 |
West AC, Grimm RD, Landolt D, Deslouis C, Tribollet B. Electrohydrodynamic impedance study of anodically formed salt films on iron in chloride solutions Journal of Electroanalytical Chemistry. 330: 693-706. DOI: 10.1016/0022-0728(92)80337-4 |
0.52 |
|
1992 |
Madore C, West AC, Matlosz M, Landolt D. Design Considerations for a cylindrical hull cell with forced convection Electrochimica Acta. 37: 69-74. DOI: 10.1016/0013-4686(92)80013-C |
0.495 |
|
1992 |
West AC, Matlosz M, Landolt D. Primary current distribution in the Hull cell and related trapezoidal geometries Journal of Applied Electrochemistry. 22: 301-303. DOI: 10.1007/Bf01030192 |
0.456 |
|
1991 |
West AC, Newman J. Current Distributions on Recessed Electrodes Journal of the Electrochemical Society. 138: 1620-1625. DOI: 10.1149/1.2085844 |
0.431 |
|
1991 |
West AC, Matlosz M, Landolt D. Normalized and average current distributions on unevenly spaced patterns Journal of the Electrochemical Society. 138: 728-735. DOI: 10.1149/1.2085666 |
0.503 |
|
1990 |
West AC, Sukamto JH, Newman J. A Criterion to Verify Current Distribution Calculations Journal of the Electrochemical Society. 137: 2745-2752. DOI: 10.1149/1.2087051 |
0.429 |
|
1989 |
West AC, Newman J. Corrections to Kinetic Measurements Taken on a Disk Electrode Journal of the Electrochemical Society. 136: 139-143. DOI: 10.1149/1.2096573 |
0.429 |
|
1989 |
West AC, Newman J. Interpretation of Kinetic Rate Data Taken in a Channel Flow Cell Journal of the Electrochemical Society. 136: 3755-3759. DOI: 10.1149/1.2096542 |
0.44 |
|
1989 |
West AC, Newman J. Current Distribution near an Electrode Edge as a Primary Distribution Is Approached Journal of the Electrochemical Society. 136: 2935-2939. DOI: 10.1149/1.2096376 |
0.428 |
|
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