Igor Volov, Ph.D. - Publications
Affiliations: | 2013 | Chemical Engineering | Columbia University, New York, NY |
Area:
Chemical EngineeringYear | Citation | Score | |||
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2013 | Volov I, Sun X, Gadikota G, Shi P, West AC. Electrodeposition of copper-tin film alloys for interconnect applications Electrochimica Acta. 89: 792-797. DOI: 10.1016/J.Electacta.2012.11.102 | 0.507 | |||
2012 | Volov I, Swanson E, O'Brien B, Novak SW, Boom Rvd, Dunn K, West AC. Pulse-Plating of Copper-Silver Alloys for Interconnect Applications Journal of the Electrochemical Society. 159: D677-D683. DOI: 10.1149/2.066211Jes | 0.486 | |||
2011 | Volov I, Mann O, Hoenersch Y, Wahl B, West AC. Chromatography of bis-(3-sulfopropyl) disulfide and its breakdown products by HPLC coupled with electrochemical detection Journal of Separation Science. 34: 2385-2390. PMID 21812114 DOI: 10.1002/Jssc.201100352 | 0.453 | |||
2011 | Volov I, West AC. Interaction between SPS and MPS in the presence of ferrous and ferric ions Journal of the Electrochemical Society. 158. DOI: 10.1149/1.3593018 | 0.483 | |||
2011 | Volov I, Saito T, West AC. Investigation of copper plating and additive interactions in the presence of Fe3+/Fe2+ redox couple Journal of the Electrochemical Society. 158. DOI: 10.1149/1.3575638 | 0.46 | |||
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