| Year |
Citation |
Score |
| 2021 |
Kim BK, Kim MJ, Kim JJ. Impact of Surface Hydrophilicity on Electrochemical Water Splitting. Acs Applied Materials & Interfaces. PMID 33650852 DOI: 10.1021/acsami.0c22409 |
0.54 |
|
| 2021 |
Byun J, Bae K, Kwon O, Myong KK, Lim T, Kim JJ. Effect of Complexing Agents on Surface Composition for Co Post-CMP Cleaning Process Ecs Journal of Solid State Science and Technology. 10: 024011. DOI: 10.1149/2162-8777/ABE7A6 |
0.522 |
|
| 2021 |
Kim TY, Lee MH, Byun J, Jeon H, Choe S, Kim JJ. Influence of Reducing Agent on Chemical Decomposition of Bis(3- sulfopropyl) Disulfide (SPS) in Cu Plating Bath Journal of the Electrochemical Society. 168: 032501. DOI: 10.1149/1945-7111/ABE727 |
0.337 |
|
| 2021 |
Jeon Y, Choi I, Kim JJ. Facile electrochemical fabrication of Ag/Cu bi-metallic catalysts and the dependence of their selectivity for electrochemical CO2 reduction on the surface composition Thin Solid Films. 726: 138674. DOI: 10.1016/J.TSF.2021.138674 |
0.36 |
|
| 2021 |
Myong KK, Byun J, Choo M, Kim H, Kim JY, Lim T, Kim JJ. Direct and quantitative study of ceria–SiO2 interaction depending on Ce3+ concentration for chemical mechanical planarization (CMP) cleaning Materials Science in Semiconductor Processing. 122: 105500. DOI: 10.1016/j.mssp.2020.105500 |
0.508 |
|
| 2021 |
Lee MH, Kim MJ, Kim JJ. Competitive adsorption between bromide ions and bis(3-sulfopropyl)-disulfide for Cu microvia filling Electrochimica Acta. 370: 137707. DOI: 10.1016/j.electacta.2020.137707 |
0.31 |
|
| 2020 |
Kwon O, Bae K, Byun J, Lim T, Kim JJ. Study on effect of complexing agents on Co oxidation/dissolution for chemical-mechanical polishing and cleaning process Microelectronic Engineering. 227: 111308. DOI: 10.1016/J.Mee.2020.111308 |
0.534 |
|
| 2020 |
Kim TY, Choe S, Kim JJ. Decomposition of polyethylene glycol (PEG) at Cu cathode and insoluble anode during Cu electrodeposition Electrochimica Acta. 357: 136803. DOI: 10.1016/j.electacta.2020.136803 |
0.43 |
|
| 2020 |
Kim H, Baek S, Lim T, Kim JJ. Electrochemical reduction of nitrous oxide in 1-butyl-3-methylimidazolium tetrafluoroborate ionic liquid electrolyte Electrochemistry Communications. 113: 106688. DOI: 10.1016/j.elecom.2020.106688 |
0.54 |
|
| 2020 |
Baek S, Kim K, Kwon OS, Kim H, Han JW, Kwon OJ, Kim JJ. Pd–Cu alloy catalyst synthesized by citric acid-assisted galvanic displacement reaction for N2O reduction Journal of Applied Electrochemistry. 50: 395-405. DOI: 10.1007/S10800-019-01396-X |
0.327 |
|
| 2019 |
Byun J, Kim KH, Kim BK, Chang JW, Cho SK, Kim JJ. Gravimetric analysis of the autocatalytic growth of copper microparticles in aqueous solution. Rsc Advances. 9: 37895-37900. PMID 35541779 DOI: 10.1039/c9ra06842b |
0.608 |
|
| 2019 |
Sung M, Lee A, Kim T, Yoon Y, Lim T, Kim JJ. Sulfur-Containing Additives for Mitigating Cu Protrusion in Through Silicon via (TSV) Journal of the Electrochemical Society. 166. DOI: 10.1149/2.1251912Jes |
0.679 |
|
| 2019 |
Ahn SH, Choi I, Kwon OJ, Lim T, Kim JJ. Electrochemical Preparation of Pt-Based Catalyst on Carbon Paper Treated by Sn Sensitization and Pd Activation Ecs Transactions. 41: 1105-1108. DOI: 10.1149/1.3635643 |
0.552 |
|
| 2019 |
Choi I, Lim T, Ahn SH, Kwon OJ, Kim JJ. Synthesis of Pt-Based Electrocatalysts with Core-Shell Structure through Electrochemical Reduction for Oxygen Reduction in PEMFC Ecs Transactions. 41: 1051-1054. DOI: 10.1149/1.3635637 |
0.537 |
|
| 2019 |
Lee HJ, Kim MJ, Lim T, Park KJ, Kim JJ, Kwon OJ. Electrodeposition of Cu-Ag Film in Cyanide-Based Electrolyte Ecs Transactions. 33: 5-10. DOI: 10.1149/1.3557565 |
0.688 |
|
| 2019 |
Kim YJ, Bae JH, Kim JJ. Effect of Functional Groups of Complexing Agents on the Performance of Cu CMP Slurry Ecs Transactions. 25: 55-63. DOI: 10.1149/1.3390658 |
0.305 |
|
| 2019 |
Lim T, Koo H, Kim JJ. Optimization of Pd Activation on Ta Substrate for Cu Electroless Deposition Using Electrochemical Method Ecs Transactions. 16: 93-102. DOI: 10.1149/1.3115655 |
0.651 |
|
| 2019 |
Ahn SH, Kim S, Kwon OJ, Hwang S, Kim JJ. Preparation of Pt-Ru-Co Ternary Catalyst on Carbon Paper for PEMFC with Electrodeposition and Galvanic Displacement Ecs Transactions. 16: 1111-1116. DOI: 10.1149/1.2981952 |
0.524 |
|
| 2019 |
Kim JJ, Lee CH, Kim AR, Kim SY, Kim S, Koo H. Electroless Deposition of Cu and Ag For ULSI Interconnect Fabrication Ecs Transactions. 2: 29-41. DOI: 10.1149/1.2408861 |
0.421 |
|
| 2019 |
Ham YS, Park YS, Jo A, Jang JH, Kim S, Kim JJ. Proton-exchange membrane CO2 electrolyzer for CO production using Ag catalyst directly electrodeposited onto gas diffusion layer Journal of Power Sources. 437: 226898. DOI: 10.1016/J.JPOWSOUR.2019.226898 |
0.522 |
|
| 2019 |
Jeon Y, Choe S, Kim HC, Kim MJ, Kim JJ. Electrodeposition of Cu-Ag films in ammonia-based electrolyte Journal of Alloys and Compounds. 775: 639-646. DOI: 10.1016/J.JALLCOM.2018.10.023 |
0.416 |
|
| 2019 |
Sung M, Kim S, Lee H, Lim T, Kim JJ. Working mechanism of iodide ions and its application to Cu microstructure control in through silicon via filling Electrochimica Acta. 295: 224-229. DOI: 10.1016/J.Electacta.2018.10.141 |
0.678 |
|
| 2019 |
Kim M, Choi I, Kim JJ. Facile electrochemical synthesis of heterostructured amorphous-Sn@CuxO nanowire anode for Li-ion batteries with high stability and rate-performance Applied Surface Science. 479: 225-233. DOI: 10.1016/J.Apsusc.2019.02.081 |
0.572 |
|
| 2019 |
Lee A, Kim MJ, Choe S, Kim JJ. High strength Cu foil without self-annealing prepared by 2M5S-PEG-SPS Korean Journal of Chemical Engineering. 36: 981-987. DOI: 10.1007/s11814-019-0279-x |
0.304 |
|
| 2019 |
Kwon OS, Baek S, Kim H, Choi I, Kwon OJ, Kim JJ. Optimization of Solution Condition for an Effective Electrochemical Reduction of N2O Electroanalysis. 31: 739-745. DOI: 10.1002/Elan.201800442 |
0.463 |
|
| 2018 |
Yoon Y, Ham YS, Kim TY, Choe S, Kim JJ. Cyclic Voltammetry Stripping Analysis to Determine Iodide Ion Concentration in Cu Plating Bath Journal of the Electrochemical Society. 165: H213-H218. DOI: 10.1149/2.0471805Jes |
0.328 |
|
| 2018 |
Kang J, Kim CM, Yu DY, Ham YS, Cho SK, Kim JJ. Octylphenol ethoxylate surfactant as a suppressor in copper electrodeposition Transactions of the Imf. 97: 22-27. DOI: 10.1080/00202967.2019.1551276 |
0.317 |
|
| 2018 |
Shen H, Kim HC, Sung M, Lim T, Kim JJ. Thermodynamic aspects of bis(3‑sulfopropyl) disulfide and 3‑mercapto‑1‑propanesulfonic acid in Cu electrodeposition Journal of Electroanalytical Chemistry. 816: 132-137. DOI: 10.1016/J.Jelechem.2018.03.048 |
0.661 |
|
| 2018 |
Ham YS, Kim MJ, Lim T, Kim D, Kim S, Kim JJ. Direct formation of dendritic Ag catalyst on a gas diffusion layer for electrochemical CO2 reduction to CO and H2 International Journal of Hydrogen Energy. 43: 11315-11325. DOI: 10.1016/J.Ijhydene.2017.12.067 |
0.702 |
|
| 2018 |
Kim BK, Kim S, Cho SK, Kim JJ. Enhanced catalytic activity of electrodeposited Ni-Cu-P toward oxygen evolution reaction Applied Catalysis B-Environmental. 237: 409-415. DOI: 10.1016/J.Apcatb.2018.05.082 |
0.639 |
|
| 2017 |
Lim T, Kim JJ. Effect of Surface Pretreatment on Film Properties Deposited by Electro-/Electroless Deposition in Cu Interconnection Journal of the Korean Electrochemical Society. 20: 1-6. DOI: 10.5229/JKES.2017.20.1.1 |
0.686 |
|
| 2017 |
Lee W, Byun J, Cho SK, Kim JJ. Effect of Halides on Cu Electrodeposit Film: Potential-Dependent Impurity Incorporation Journal of the Electrochemical Society. 164: D493-D497. DOI: 10.1149/2.1541707JES |
0.413 |
|
| 2017 |
Sung M, Kim HC, Lim T, Kim JJ. Effects of Organic Additives on Grain Growth in Electrodeposited Cu Thin Film during Self-Annealing Journal of the Electrochemical Society. 164. DOI: 10.1149/2.0481713Jes |
0.675 |
|
| 2017 |
Min YJ, Kim KH, Lim T, Kim JJ. Investigation of Working Mechanism of Bis-(3-sulfopropyl) Disulfide (SPS) during Cu Electroless Deposition Using Real-Time Observation Method Journal of the Electrochemical Society. 164. DOI: 10.1149/2.0111802Jes |
0.667 |
|
| 2017 |
Hwang HS, Yoon T, Jang J, Kim JJ, Ryu JH, Oh SM. Carbon fabric as a current collector for electroless-plated Cu6Sn5 negative electrode for lithium-ion batteries Journal of Alloys and Compounds. 692: 583-588. DOI: 10.1016/J.Jallcom.2016.09.073 |
0.315 |
|
| 2017 |
Baek S, Kim KH, Choi I, Kwon OJ, Kim JJ. N 2 O dissolution with Couette-Taylor flow mixer for the effective electrochemical N 2 O reduction reaction Chemical Engineering Journal. 335: 915-920. DOI: 10.1016/J.Cej.2017.11.042 |
0.491 |
|
| 2017 |
Ham YS, Choe S, Kim MJ, Lim T, Kim S, Kim JJ. Electrodeposited Ag catalysts for the electrochemical reduction of CO2 to CO Applied Catalysis B-Environmental. 208: 35-43. DOI: 10.1016/J.Apcatb.2017.02.040 |
0.694 |
|
| 2017 |
Ham YS, Cho SK, Kim JJ. Cu seed layer damage caused by insoluble anode in Cu electrodeposition Korean Journal of Chemical Engineering. 34: 1490-1494. DOI: 10.1007/s11814-017-0054-9 |
0.404 |
|
| 2016 |
Kim MJ, Flowers PF, Stewart IE, Ye S, Baek S, Kim JJ, Wiley BJ. Ethylenediamine Promotes Cu Nanowire Growth by Inhibiting Oxidation of Cu (111). Journal of the American Chemical Society. PMID 27976885 DOI: 10.1021/Jacs.6B10653 |
0.763 |
|
| 2016 |
Cho SK, Kim JJ. A study on the deposit uniformity and profile of Cu electroplated in miniaturized, laboratory-scale through mask plating cell for printed circuit board (PCBs) fabrication Korean Chemical Engineering Research. 54: 108-113. DOI: 10.9713/kcer.2016.54.1.108 |
0.342 |
|
| 2016 |
Kim MJ, Kim HC, Kim JJ. The Influences of Iodide Ion on Cu Electrodeposition and TSV Filling Journal of the Electrochemical Society. 163: D434-D441. DOI: 10.1149/2.1111608JES |
0.346 |
|
| 2016 |
Choe S, Kim MJ, Lim T, Ham YS, Kim S, Kim JJ. Communication—Monitoring the Average Molecular Weight of Polyethylene Glycol in an Acidic Cu Plating Bath Journal of the Electrochemical Society. 163. DOI: 10.1149/2.0641614Jes |
0.732 |
|
| 2016 |
Choe S, Kim MJ, Kim KH, Kim HC, Jeon Y, Kim TY, Kim SK, Kim JJ. High accuracy concentration analysis of accelerator components in acidic Cu superfilling bath Journal of the Electrochemical Society. 163: D33-D39. DOI: 10.1149/2.0471602Jes |
0.623 |
|
| 2016 |
Lee SW, Bae KH, Kwon OJ, Kim JJ. The effect of TAD based cleaning solution on post Cu CMP process Microelectronic Engineering. 162: 17-22. DOI: 10.1016/j.mee.2016.04.019 |
0.398 |
|
| 2016 |
Kim S, Kim M, Choi I, Kim JJ. Quercetin as electrolyte additive for LiNi0.5Mn1.5O4 cathode for lithium-ion secondary battery at elevated temperature Journal of Power Sources. 336: 316-324. DOI: 10.1016/J.Jpowsour.2016.10.079 |
0.486 |
|
| 2016 |
Kim KH, Lim T, Kim MJ, Choe S, Baek S, Kim JJ. Porous indium electrode with large surface area for effective electroreduction of N2O Electrochemistry Communications. 62: 13-16. DOI: 10.1016/J.Elecom.2015.11.002 |
0.607 |
|
| 2016 |
Choi J, Kim MJ, Ahn SH, Choi I, Jang JH, Ham YS, Kim JJ, Kim SK. Electrochemical CO2 reduction to CO on dendritic Ag-Cu electrocatalysts prepared by electrodeposition Chemical Engineering Journal. 299: 37-44. DOI: 10.1016/J.Cej.2016.04.037 |
0.75 |
|
| 2016 |
Kim M, Lee MJ, Choi I, Kim JJ. Sawtooth‐ or Pyramidal‐patterned Si Negative Electrode Fabricated by Micro‐Electro‐Mechanical Systems for Li‐Ion Secondary Battery Bulletin of the Korean Chemical Society. 37: 1747-1753. DOI: 10.1002/Bkcs.10961 |
0.483 |
|
| 2015 |
Kim MJ, Choe S, Kim HC, Cho SK, Kim SK, Kim JJ. Electrochemical behavior of citric acid and its influence on Cu electrodeposition for damascene metallization Journal of the Electrochemical Society. 162: D354-D359. DOI: 10.1149/2.0561508Jes |
0.625 |
|
| 2015 |
Kim HC, Choe S, Cho JY, Lee D, Jung I, Cho WS, Kim MJ, Kim JJ. Bottom-up filling of through silicon vias using galvanostatic Cu electrodeposition with the modified organic additives Journal of the Electrochemical Society. 162: D109-D114. DOI: 10.1149/2.0561503jes |
0.375 |
|
| 2015 |
Choe S, Kim MJ, Kim KH, Kim HC, Song JC, Kim SK, Kim JJ. Accuracy improvement in cyclic voltammetry stripping analysis of thiourea concentration in copper plating baths Journal of the Electrochemical Society. 162: H294-H300. DOI: 10.1149/2.0051506Jes |
0.551 |
|
| 2015 |
Kim KH, Lim T, Park KJ, Koo HC, Kim MJ, Kim JJ. Investigation of Cu growth phenomena on Ru substrate during electroless deposition using hydrazine as a reducing agent Electrochimica Acta. 151: 249-255. DOI: 10.1016/J.Electacta.2014.11.036 |
0.72 |
|
| 2014 |
Kim MJ, Kim JJ. Electrodeposition for the fabrication of copper interconnection in semiconductor devices Korean Chemical Engineering Research. 52: 26-39. DOI: 10.9713/kcer.2014.52.1.26 |
0.421 |
|
| 2014 |
Lim T, Kim KH, Kim K, Lee H, Kim HJ, Lee HN, Kim JJ, Kwon OJ. Pd seeding with the sonochemical method for application of Cu electroless deposition to Cu metallization Journal of the Electrochemical Society. 161. DOI: 10.1149/2.1081409Jes |
0.674 |
|
| 2014 |
Kim KH, Lim T, Kim MJ, Choe S, Park KJ, Ahn SH, Kwon OJ, Kim JJ. Direct Cu electrodeposition on electroless deposited NiWP barrier layer on SiO2 substrate for all-wet metallization process Journal of the Electrochemical Society. 161: D756-D760. DOI: 10.1149/2.0291414Jes |
0.661 |
|
| 2014 |
Lim T, Park KJ, Kim MJ, Koo HC, Kim KH, Choe S, Kim JJ. Real-time observation of cu electroless deposition: Synergetic suppression effect of 2,2'-dipyridyl and 3-N,N-dimethylaminodithiocarbamoyl-1- propanesulfonic acid Journal of the Electrochemical Society. 161: D135-D140. DOI: 10.1149/2.028404Jes |
0.632 |
|
| 2014 |
Kim HC, Kim MJ, Choe S, Lim T, Park KJ, Kim KH, Ahn SH, Kim S, Kim JJ. Electrodeposition of Cu Films with Low Resistivity and Improved Hardness Using Additive Derivatization Journal of the Electrochemical Society. 161. DOI: 10.1149/2.0271414Jes |
0.759 |
|
| 2014 |
Lim T, Kim MJ, Park KJ, Kim KH, Choe S, Lee YS, Kim JJ. The effect of inducing uniform Cu growth on formation of electroless Cu seed layer Thin Solid Films. 564: 299-305. DOI: 10.1016/J.Tsf.2014.06.023 |
0.704 |
|
| 2014 |
Park J, Jin K, Han B, Kim MJ, Jung J, Kim JJ, Lee W. Atomic layer deposition of copper nitride film and its application to copper seed layer for electrodeposition Thin Solid Films. 556: 434-439. DOI: 10.1016/J.Tsf.2014.01.034 |
0.379 |
|
| 2014 |
Kim HC, Kim MJ, Lim T, Park KJ, Kim KH, Choe S, Kim S, Kim JJ. Effects of nitrogen atoms of benzotriazole and its derivatives on the properties of electrodeposited Cu films Thin Solid Films. 550: 421-427. DOI: 10.1016/J.Tsf.2013.10.124 |
0.761 |
|
| 2014 |
Park KJ, Lim T, Kim MJ, Kim KH, Hwang SM, Kim JJ. In-situ transmittance measurement for characterization of organic additives in Cu electroless deposition Journal of Electroanalytical Chemistry. 731: 157-162. DOI: 10.1016/J.Jelechem.2014.08.019 |
0.71 |
|
| 2014 |
Choe S, Kim MJ, Kim HC, Lim T, Park KJ, Kim KH, Ahn SH, Lee A, Kim SK, Kim JJ. Degradation of poly(ethylene glycol-propylene glycol) copolymer and its influences on copper electrodeposition Journal of Electroanalytical Chemistry. 714: 85-91. DOI: 10.1016/J.Jelechem.2013.12.023 |
0.766 |
|
| 2014 |
Choi I, Ahn SH, Kim MH, Kwon OJ, Kim JJ. Synthesis of an active and stable Ptshell-Pdcore/C catalyst for the electro-oxidation of methanol International Journal of Hydrogen Energy. 39: 3681-3689. DOI: 10.1016/J.Ijhydene.2013.12.118 |
0.5 |
|
| 2014 |
Kim MJ, Choe S, Kim HC, Lee SJ, Kim SH, Kwon OJ, Kim JJ. Cu direct electrodeposition using step current for superfilling on Ru-Al2O3 layer Electrochimica Acta. 147: 371-379. DOI: 10.1016/j.electacta.2014.09.142 |
0.366 |
|
| 2014 |
Park J, Choi I, Lee MJ, Kim MH, Lim T, Park KH, Jang J, Oh SM, Cho SK, Kim JJ. Effect of fluoroethylene carbonate on electrochemical battery performance and the surface chemistry of amorphous MoO2 lithium-ion secondary battery negative electrodes Electrochimica Acta. 132: 338-346. DOI: 10.1016/J.Electacta.2014.03.173 |
0.674 |
|
| 2014 |
Ahn SH, Choi I, Kwon OJ, Kim JJ. Hydrogen production through the fuel processing of liquefied natural gas with silicon-based micro-reactors Chemical Engineering Journal. 247: 9-15. DOI: 10.1016/J.Cej.2014.02.108 |
0.454 |
|
| 2013 |
Kim MJ, Kim HC, Choe S, Cho JY, Lee D, Jung I, Cho W, Kim JJ. Cu Bottom-Up Filling for Through Silicon Vias with Growing Surface Established by the Modulation of Leveler and Suppressor Journal of the Electrochemical Society. 160: D3221-D3227. DOI: 10.1149/2.037312jes |
0.347 |
|
| 2013 |
Choe S, Kim MJ, Kim HC, Cho SK, Ahn SH, Kim S, Kim JJ. Degradation of Bis(3-sulfopropyl) Disulfide and Its Influence on Copper Electrodeposition for Feature Filling Journal of the Electrochemical Society. 160. DOI: 10.1149/2.032312Jes |
0.59 |
|
| 2013 |
Kim KH, Lim T, Choe S, Choi I, Ahn SH, Kim MJ, Park KJ, Lee MH, Kim JJ, Kwon OJ. Direct Cu electrodeposition on ta using Pd Nanocolloids: Effect of allyl alcohol on the formation of seed layer Journal of the Electrochemical Society. 160. DOI: 10.1149/2.028312Jes |
0.759 |
|
| 2013 |
Choe S, Kim MJ, Kim HC, Lim T, Park KJ, Cho SK, Kim S, Kim JJ. Seed Repair by Electrodeposition in Pyrophosphate Solution for Acid Cu Superfilling Journal of the Electrochemical Society. 160. DOI: 10.1149/2.028306Jes |
0.757 |
|
| 2013 |
Lim T, Park KJ, Kim MJ, Koo H, Kim KH, Choe S, Kim JJ. Real-Time Observation of Cu Electroless Deposition: Effect of EDTA on Removing of Cu Oxide and Adsorption of Formaldehyde Journal of the Electrochemical Society. 160. DOI: 10.1149/2.022312Jes |
0.689 |
|
| 2013 |
Kim MJ, Park KJ, Lim T, Kwon OJ, Kim JJ. Fabrication of Cu-Ag Interconnection Using Electrodeposition: The Mechanism of Superfilling and the Properties of Cu-Ag Film Journal of the Electrochemical Society. 160. DOI: 10.1149/2.020312Jes |
0.69 |
|
| 2013 |
Kim MJ, Lim T, Park KJ, Kim S, Kim JJ. Pulse-Reverse Electrodeposition of Cu for the Fabrication of Metal Interconnection II. Enhancement of Cu Superfilling and Leveling Journal of the Electrochemical Society. 160. DOI: 10.1149/2.016312Jes |
0.764 |
|
| 2013 |
Kim MJ, Lim T, Park KJ, Kim S, Kim JJ. Pulse-Reverse Electrodeposition of Cu for the Fabrication of Metal Interconnection I. Effects of Anodic Steps on the Competitive Adsorption of the Additives Used for Superfilling Journal of the Electrochemical Society. 160. DOI: 10.1149/2.015312Jes |
0.743 |
|
| 2013 |
Kim MJ, Kim HC, Kim S, Yeo S, Kwon OJ, Kim JJ. Direct Electrodeposition of Cu on Ru-Al2O3Layer Journal of the Electrochemical Society. 160: D3057-D3062. DOI: 10.1149/2.011312JES |
0.417 |
|
| 2013 |
Lim T, Park KJ, Kim MJ, Koo H, Kim KH, Choe S, Lee Y, Kim JJ. Real-Time Observation of Cu Electroless Deposition: Adsorption Behavior of PEG during Cu Electroless Deposition Journal of the Electrochemical Society. 160. DOI: 10.1149/2.004312Jes |
0.689 |
|
| 2013 |
Hong TE, Cheon T, Kim S, Kim J, Park Y, Kwon OJ, Kim MJ, Kim JJ. Effects of AlOx incorporation into atomic layer deposited Ru thin films: Applications to Cu direct plating technology Journal of Alloys and Compounds. 580: 72-81. DOI: 10.1016/J.JALLCOM.2013.05.035 |
0.358 |
|
| 2012 |
Cho S, Kim M, Koo H, Kim S, Kim J. An Empirical Relation between the Plating Process and Accelerator Coverage in Cu Superfilling Bulletin of the Korean Chemical Society. 33: 1603-1607. DOI: 10.5012/Bkcs.2012.33.5.1603 |
0.74 |
|
| 2012 |
Kim MJ, Lee HJ, Yong SH, Kwon OJ, Kim S, Kim JJ. Facile Formation of Cu-Ag Film by Electrodeposition for the Oxidation-Resistive Metal Interconnect Journal of the Electrochemical Society. 159. DOI: 10.1149/2.104204Jes |
0.646 |
|
| 2012 |
Lim T, Park KJ, Kim MJ, Koo H, Kim JJ. Real-Time Observation of Cu Electroless Deposition Using OCP Measurement Assisted by QCM Journal of the Electrochemical Society. 159. DOI: 10.1149/2.056212Jes |
0.678 |
|
| 2012 |
Kim MJ, Yong SH, Ko HS, Lim T, Park KJ, Kwon OJ, Kim JJ. Superfilling of Cu-Ag using electrodeposition in cyanide-based electrolyte Journal of the Electrochemical Society. 159. DOI: 10.1149/2.051211Jes |
0.67 |
|
| 2012 |
Kim MJ, Lim T, Park KJ, Kwon OJ, Kim S, Kim JJ. Characteristics of Pulse-Reverse Electrodeposited Cu Thin Film II. Effects of Organic Additives Journal of the Electrochemical Society. 159. DOI: 10.1149/2.046209Jes |
0.754 |
|
| 2012 |
Kim MJ, Lim T, Park KJ, Cho SK, Kim S, Kim JJ. Characteristics of Pulse-Reverse Electrodeposited Cu Thin Films I. Effects of the Anodic Step in the Absence of an Organic Additive Journal of the Electrochemical Society. 159. DOI: 10.1149/2.045209Jes |
0.761 |
|
| 2012 |
Kim MJ, Park KJ, Lim T, Choe S, Yu T, Kim JJ. One-Pot Synthesis of PdAu-Au Core-Shell Bimetallic Nanoparticles Using Electrodeposition and Their Optical Property Journal of the Electrochemical Society. 160: E1-E4. DOI: 10.1149/2.033301Jes |
0.504 |
|
| 2012 |
Park KJ, Kim MJ, Lim T, Koo H, Kim JJ. Conformal Cu Seed Layer Formation by Electroless Deposition in Non-Bosch through Silicon Vias Electrochemical and Solid State Letters. 15. DOI: 10.1149/2.009206Esl |
0.661 |
|
| 2012 |
Ahn SH, Hwang SJ, Yoo SJ, Choi I, Kim HJ, Jang JH, Nam S, Lim TH, Lim T, Kim SK, Kim JJ. Electrodeposited Ni dendrites with high activity and durability for hydrogen evolution reaction in alkaline water electrolysis Journal of Materials Chemistry. 22: 15153-15159. DOI: 10.1039/C2Jm31439H |
0.764 |
|
| 2012 |
Ahn SH, Choi I, Kwon OJ, Lim T, Kim JJ. Electrochemical preparation of Pt-based catalysts on carbon paper treated with Sn sensitization and Pd activation International Journal of Hydrogen Energy. 37: 41-50. DOI: 10.1016/J.Ijhydene.2011.09.074 |
0.686 |
|
| 2012 |
Choi I, Lee MJ, Oh SM, Kim JJ. Fading mechanisms of carbon-coated and disproportionated Si/SiOx negative electrode (Si/SiOx/C) in Li-ion secondary batteries: Dynamics and component analysis by TEM Electrochimica Acta. 85: 369-376. DOI: 10.1016/J.Electacta.2012.08.098 |
0.459 |
|
| 2012 |
Ahn SH, Choi I, Kwon OJ, Kim JJ. One-step co-electrodeposition of Pt–Ru electrocatalysts on carbon paper for direct methanol fuel cell Chemical Engineering Journal. 181: 276-280. DOI: 10.1016/J.Cej.2011.11.079 |
0.519 |
|
| 2012 |
Choi I, Lee KG, Ahn SH, Kim DH, Kwon OJ, Kim JJ. Sonochemical synthesis of Pt-deposited SiO2 nanocomposite and its catalytic application for polymer electrolyte membrane fuel cell under low-humidity conditions Catalysis Communications. 21: 86-90. DOI: 10.1016/J.Catcom.2012.02.005 |
0.502 |
|
| 2011 |
Park KJ, Koo H, Lim T, Kim MJ, Kwon OJ, Kim JJ. Evaluation of Stability and Reactivity of Cu Electroless Deposition Solution by In-Situ Transmittance Measurement Journal of the Electrochemical Society. 158. DOI: 10.1149/1.3606532 |
0.666 |
|
| 2011 |
Lim T, Koo H, Kim KH, Park KJ, Kim MJ, Kwon OJ, Kim JJ. Room-Temperature Electroless Deposition of CoB Film and its Application as In Situ Capping during Buffing Process Electrochemical and Solid State Letters. 14. DOI: 10.1149/1.3600759 |
0.573 |
|
| 2011 |
Hwang S, Bonevich JE, Kim JJ, Moffat TP. Formic Acid Oxidation on Pt100−xPbx Thin Films Electrodeposited on Au Journal of the Electrochemical Society. 158: B1019. DOI: 10.1149/1.3599913 |
0.567 |
|
| 2011 |
Hwang S, Bonevich JE, Kim JJ, Moffat TP. Electrodeposition of Pt100−xPbx Metastable Alloys and Intermetallics Journal of the Electrochemical Society. 158: D307. DOI: 10.1149/1.3572049 |
0.571 |
|
| 2011 |
Kim YJ, Kwon OJ, Kang MC, Kim JJ. Effects of the Functional Groups of Complexing Agents and Cu Oxide Formation on Cu Dissolution Behaviors in Cu CMP Process Journal of the Electrochemical Society. 158: H190. DOI: 10.1149/1.3522811 |
0.4 |
|
| 2011 |
Cho SK, Kim MJ, Lim T, Kwon OJ, Kim JJ. Deposit profiles characterized by the seed layer in Cu pulse-reverse plating on a patterned substrate Journal of Vacuum Science & Technology B. 29: 11004. DOI: 10.1116/1.3521508 |
0.666 |
|
| 2011 |
Kwon OJ, Kang MS, Ahn SH, Choi I, Lee KU, Jeong JH, Han I, Yang JC, Kim JJ. Development of flow field design of polymer electrolyte membrane fuel cell using in-situ impedance spectroscopy International Journal of Hydrogen Energy. 36: 9799-9804. DOI: 10.1016/J.Ijhydene.2010.10.040 |
0.438 |
|
| 2011 |
Choi I, Ahn SH, Kim JJ, Kwon OJ. Preparation of Ptshell–Pdcore nanoparticle with electroless deposition of copper for polymer electrolyte membrane fuel cell Applied Catalysis B-Environmental. 102: 608-613. DOI: 10.1016/J.Apcatb.2010.12.047 |
0.569 |
|
| 2010 |
Kim MJ, Cho SK, Koo H, Lim T, Park KJ, Kim JJ. Pulse Electrodeposition for Improving Electrical Properties of Cu Thin Film Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3481564 |
0.696 |
|
| 2010 |
Park KJ, Koo HC, Lim T, Kim JJ. Evaluation of stability and reactivity of solutions by in situ transmittance in electroless deposition Ecs Transactions. 25: 145-153. DOI: 10.1149/1.3390667 |
0.635 |
|
| 2010 |
Cho SK, Lim T, Lee H, Kim JJ. A Study on Seed Damage in Plating Electrolyte and Its Repairing in Cu Damascene Metallization Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3291985 |
0.683 |
|
| 2010 |
Ahn SH, Kwon OJ, Kim S, Choi I, Kim JJ. Electrochemical preparation of Pt-based ternary alloy catalyst for direct methanol fuel cell anode International Journal of Hydrogen Energy. 35: 13309-13316. DOI: 10.1016/J.Ijhydene.2010.09.035 |
0.67 |
|
| 2010 |
Hwang S, Lee CH, Kim JJ, Moffat TP. Oxygen reduction reaction on electrodeposited Pt100−x−yNixPdy thin films Electrochimica Acta. 55: 8938-8946. DOI: 10.1016/J.Electacta.2010.08.013 |
0.559 |
|
| 2009 |
Kang MC, Kim YJ, Koo H, Cho SK, Kim JJ. Local Corrosion of the Oxide Passivation Layer during Cu Chemical Mechanical Polishing Electrochemical and Solid-State Letters. 12: H433. DOI: 10.1149/1.3236391 |
0.317 |
|
| 2009 |
Koo H, Cho SK, Kwon OJ, Suh M, Im Y, Kim JJ. Improvement in the Oxidation Resistance of Cu Films by an Electroless Co-Alloy Capping Process Journal of the Electrochemical Society. 156: D236. DOI: 10.1149/1.3133219 |
0.353 |
|
| 2009 |
Lee CH, Kim AR, Koo H, Kim JJ. Effect of 2-Mercapto-5-benzimidazolesulfonic Acid in Superconformal Cu Electroless Deposition Journal of the Electrochemical Society. 156: D207. DOI: 10.1149/1.3117343 |
0.413 |
|
| 2009 |
Ahn J, Kim H, Koo H, Kim JJ, Kim J. Characterization and Cu electroless plating of laser-drilled through-wafer via-holes in GaN/Al2O3 Thin Solid Films. 517: 3841-3843. DOI: 10.1016/J.TSF.2009.01.160 |
0.322 |
|
| 2009 |
Ahn SH, Kwon OJ, Choi I, Kim JJ. Synergetic effect of combined use of Cu–ZnO–Al2O3 and Pt–Al2O3 for the steam reforming of methanol Catalysis Communications. 10: 2018-2022. DOI: 10.1016/J.Catcom.2009.07.023 |
0.466 |
|
| 2009 |
Seo J, Cho SK, Koo H, Kim S, Kwon OJ, Kim JJ. Thin film silver deposition by electroplating for ULSI interconnect applications Korean Journal of Chemical Engineering. 26: 265-268. DOI: 10.1007/S11814-009-0045-6 |
0.598 |
|
| 2008 |
Koo H, Cho SK, Lee CH, Kim S, Kwon OJ, Kim JJ. Silver Direct Electrodeposition on Ru Thin Films Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2890394 |
0.572 |
|
| 2008 |
Kang MC, Nam H, Won HY, Jeong S, Jeong H, Kim JJ. Effects of OH Radicals on Formation of Cu Oxide and Polishing Performance in Cu Chemical Mechanical Polishing Electrochemical and Solid-State Letters. 11: H32. DOI: 10.1149/1.2817518 |
0.398 |
|
| 2008 |
Lee CH, Kim AR, Kim S, Koo H, Cho SK, Kim JJ. Two-Step Filling in Cu Electroless Deposition Using a Concentration-Dependent Effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic Acid Electrochemical and Solid State Letters. 11. DOI: 10.1149/1.2798877 |
0.644 |
|
| 2008 |
Kang MS, Kim S, Kim K, Kim JJ. The influence of thiourea on copper electrodeposition: Adsorbate identification and effect on electrochemical nucleation Thin Solid Films. 516: 3761-3766. DOI: 10.1016/J.Tsf.2007.06.069 |
0.694 |
|
| 2007 |
Kim S, Kang M, Koo H, Cho S, Kim J, Yeo J. Cu Metallization for Giga Level Devices Using Electrodeposition Journal of the Korean Chemical Society. 10: 94-103. DOI: 10.5229/Jkes.2007.10.2.094 |
0.727 |
|
| 2007 |
Kang MC, Cho SK, Kim JJ. In-situ formation of Ag capping layer in Cu chemical mechanical polishing Ecs Transactions. 6: 29-33. DOI: 10.1149/1.2790407 |
0.44 |
|
| 2007 |
Cho SK, Lee JK, Kim SK, Kim JJ. Acceleration effect of CuCN in Ag electrode position for metal interconnection Ecs Transactions. 11: 297-304. DOI: 10.1149/1.2778387 |
0.607 |
|
| 2007 |
Cho SK, Lee JK, Kim S, Kim JJ. Acceleration Effect of CuCN in Ag Electroplating for Ultralarge-Scale Interconnects Electrochemical and Solid State Letters. 10. DOI: 10.1149/1.2769103 |
0.596 |
|
| 2006 |
Cho SK, Kim JJ. Leveling with step potential in damascene Cu electrodeposition Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2354459 |
0.422 |
|
| 2006 |
Cho SK, Kim S, Kim JJ. Erratum: Superconformal Cu Electrodeposition Using DPS [ J. Electrochem. Soc. , 152 , C330 (2005) ] Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2246232 |
0.649 |
|
| 2006 |
Lee CH, Hwang S, Kim S, Kim JJ. Cu Electroless Deposition onto Ta Substrates Electrochemical and Solid-State Letters. 9: C157. DOI: 10.1149/1.2225726 |
0.432 |
|
| 2006 |
Kim S, Hwang S, Cho SK, Kim JJ. Leveling of Superfilled Damascene Cu Film Using Two-Step Electrodeposition Electrochemical and Solid State Letters. 9. DOI: 10.1149/1.2139976 |
0.623 |
|
| 2005 |
Lee CH, Cho SK, Kim JJ. Electroless Cu bottom-up filling using 3-N,N-dimethylaminodithiocarbamoyl- 1-propanesulfonic acid Electrochemical and Solid-State Letters. 8. DOI: 10.1149/1.2063291 |
0.374 |
|
| 2005 |
Cho SK, Kim SK, Kim JJ. Superconformal Cu electrodeposition using DPS a substitutive accelerator for Bis(3-sulfopropyl) disulfide Journal of the Electrochemical Society. 152. DOI: 10.1149/1.1891645 |
0.632 |
|
| 2005 |
Kim S, Cho SK, Kim JJ, Lee Y. Superconformal Cu Electrodeposition on Various Substrates Electrochemical and Solid State Letters. 8. DOI: 10.1149/1.1833687 |
0.703 |
|
| 2005 |
Kang MS, Kim S, Kim JJ. A Novel Process to Control the Surface Roughness and Resistivity of Electroplated Cu Using Thiourea Japanese Journal of Applied Physics. 44: 8107-8109. DOI: 10.1143/Jjap.44.8107 |
0.692 |
|
| 2005 |
Lee CH, Lee SC, Kim JJ. Bottom-up filling in Cu electroless deposition using bis-(3-sulfopropyl)-disulfide (SPS) Electrochimica Acta. 50: 3563-3568. DOI: 10.1016/J.ELECTACTA.2005.01.009 |
0.409 |
|
| 2004 |
Kim SK, Kim JJ. Additive-free superfilling in damascene Cu electrodeposition using microcontact printing Electrochemical and Solid-State Letters. 7. DOI: 10.1149/1.1778932 |
0.625 |
|
| 2004 |
Kim SK, Kim JJ. Superfilling evolution in Cu electrodeposition dependence on the aging time of the accelerator Electrochemical and Solid-State Letters. 7. DOI: 10.1149/1.1777552 |
0.652 |
|
| 2004 |
Kim JJ, Kim S, Kim YS. Direct Plating of Low Resistivity Bright Cu Film onto TiN Barrier Layer via Pd Activation Journal of the Electrochemical Society. 151. DOI: 10.1149/1.1633269 |
0.667 |
|
| 2004 |
Cho SK, Kim S, Han H, Kim JJ, Oh SM. Damascene Cu electrodeposition on metal organic chemical vapor deposition-grown Ru thin film barrier Journal of Vacuum Science & Technology B. 22: 2649-2653. DOI: 10.1116/1.1819911 |
0.706 |
|
| 2004 |
Kim JJ, Kim S, Lee CH, Kim YS. Errata: “Investigation of various copper seed layers for copper electrodeposition applicable to ultralarge-scale integration interconnection” [J. Vac. Sci. Technol. B 21, 33 (2003)] Journal of Vacuum Science & Technology B. 22: 1214-1214. DOI: 10.1116/1.1740765 |
0.579 |
|
| 2003 |
Kim JJ, Kim YS, Kim S. Oxidation resistive Cu films by room temperature surface passivation with thin Ag layer Electrochemical and Solid State Letters. 6. DOI: 10.1149/1.1534732 |
0.693 |
|
| 2003 |
Kim JJ, Kim S, Kim YS. A Novel Method for Cu Electrodeposition on Indium Tin Oxide Aided by Two-Step Sn-Pd Activation Japanese Journal of Applied Physics. 42: 1080. DOI: 10.1143/Jjap.42.L1080 |
0.633 |
|
| 2003 |
Kim JJ, Kim S, Lee CH, Kim YS. Investigation of various copper seed layers for copper electrodeposition applicable to ultralarge-scale integration interconnection Journal of Vacuum Science & Technology B. 21: 33-38. DOI: 10.1116/1.1529654 |
0.663 |
|
| 2003 |
Kim JJ, Kim S, Kim YS. Catalytic behavior of 3-mercapto-1-propane sulfonic acid on Cu electrodeposition and its effect on Cu film properties for CMOS device metallization Journal of Electroanalytical Chemistry. 542: 61-66. DOI: 10.1016/S0022-0728(02)01450-X |
0.667 |
|
| 2002 |
Kim JJ, Kim S, Bae J. Investigation of copper deposition in the presence of benzotriazole Thin Solid Films. 415: 101-107. DOI: 10.1016/S0040-6090(02)00529-1 |
0.617 |
|
| 2001 |
Kim JJ, Kim SK. Optimized surface pretreatments for copper electroplating Applied Surface Science. 183: 311-318. DOI: 10.1016/S0169-4332(01)00585-2 |
0.631 |
|
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