Year |
Citation |
Score |
2021 |
Byun J, Bae K, Kwon O, Myong KK, Lim T, Kim JJ. Effect of Complexing Agents on Surface Composition for Co Post-CMP Cleaning Process Ecs Journal of Solid State Science and Technology. 10: 024011. DOI: 10.1149/2162-8777/ABE7A6 |
0.428 |
|
2021 |
Myong KK, Byun J, Choo M, Kim H, Kim JY, Lim T, Kim JJ. Direct and quantitative study of ceria–SiO2 interaction depending on Ce3+ concentration for chemical mechanical planarization (CMP) cleaning Materials Science in Semiconductor Processing. 122: 105500. DOI: 10.1016/j.mssp.2020.105500 |
0.414 |
|
2020 |
Lee D, Gok S, Kim Y, Sung YE, Lee E, Jang JH, Hwang JY, Kwon OJ, Lim T. Methanol Tolerant Pt-C Core-Shell Cathode Catalyst for Direct Methanol Fuel Cells. Acs Applied Materials & Interfaces. PMID 32924426 DOI: 10.1021/Acsami.0C07812 |
0.711 |
|
2020 |
Kwon O, Bae K, Byun J, Lim T, Kim JJ. Study on effect of complexing agents on Co oxidation/dissolution for chemical-mechanical polishing and cleaning process Microelectronic Engineering. 227: 111308. DOI: 10.1016/J.Mee.2020.111308 |
0.497 |
|
2020 |
Kim H, Baek S, Lim T, Kim JJ. Electrochemical reduction of nitrous oxide in 1-butyl-3-methylimidazolium tetrafluoroborate ionic liquid electrolyte Electrochemistry Communications. 113: 106688. DOI: 10.1016/j.elecom.2020.106688 |
0.452 |
|
2020 |
Hwang J, Kim Y, Karuppnan M, Lim T, Kwon OJ. Facile Synthesis of a Carbon-Encapsulated Pd Catalyst for Oxygen Reduction Reaction in Proton Exchange Membrane Fuel Cells Electrocatalysis. 11: 77-85. DOI: 10.1007/S12678-019-00567-W |
0.314 |
|
2019 |
Sung M, Lee A, Kim T, Yoon Y, Lim T, Kim JJ. Sulfur-Containing Additives for Mitigating Cu Protrusion in Through Silicon via (TSV) Journal of the Electrochemical Society. 166. DOI: 10.1149/2.1251912Jes |
0.647 |
|
2019 |
Ahn SH, Choi I, Kwon OJ, Lim T, Kim JJ. Electrochemical Preparation of Pt-Based Catalyst on Carbon Paper Treated by Sn Sensitization and Pd Activation Ecs Transactions. 41: 1105-1108. DOI: 10.1149/1.3635643 |
0.496 |
|
2019 |
Choi I, Lim T, Ahn SH, Kwon OJ, Kim JJ. Synthesis of Pt-Based Electrocatalysts with Core-Shell Structure through Electrochemical Reduction for Oxygen Reduction in PEMFC Ecs Transactions. 41: 1051-1054. DOI: 10.1149/1.3635637 |
0.465 |
|
2019 |
Lee HJ, Kim MJ, Lim T, Park KJ, Kim JJ, Kwon OJ. Electrodeposition of Cu-Ag Film in Cyanide-Based Electrolyte Ecs Transactions. 33: 5-10. DOI: 10.1149/1.3557565 |
0.619 |
|
2019 |
Lim T, Koo H, Kim JJ. Optimization of Pd Activation on Ta Substrate for Cu Electroless Deposition Using Electrochemical Method Ecs Transactions. 16: 93-102. DOI: 10.1149/1.3115655 |
0.586 |
|
2019 |
Karuppannan M, Kim Y, Gok S, Lee E, Hwang JY, Jang J, Cho Y, Lim T, Sung Y, Kwon OJ. A highly durable carbon-nanofiber-supported Pt–C core–shell cathode catalyst for ultra-low Pt loading proton exchange membrane fuel cells: facile carbon encapsulation Energy & Environmental Science. 12: 2820-2829. DOI: 10.1039/C9Ee01000A |
0.315 |
|
2019 |
Bae HE, Park YD, Kim T, Lim T, Kwon OJ. Carbon-caged palladium catalysts supported on carbon nanofibers for proton exchange membrane fuel cells Journal of Industrial and Engineering Chemistry. 79: 431-436. DOI: 10.1016/J.Jiec.2019.07.018 |
0.317 |
|
2019 |
Park J, Park H, Han S, Kwak D, Won J, Lim T, Park K. Organic ligand-free PtIr alloy nanostructures for superior oxygen reduction and evolution reactions Journal of Industrial and Engineering Chemistry. 77: 105-110. DOI: 10.1016/J.Jiec.2019.04.024 |
0.32 |
|
2019 |
Sung M, Kim S, Lee H, Lim T, Kim JJ. Working mechanism of iodide ions and its application to Cu microstructure control in through silicon via filling Electrochimica Acta. 295: 224-229. DOI: 10.1016/J.Electacta.2018.10.141 |
0.645 |
|
2018 |
Shen H, Kim HC, Sung M, Lim T, Kim JJ. Thermodynamic aspects of bis(3‑sulfopropyl) disulfide and 3‑mercapto‑1‑propanesulfonic acid in Cu electrodeposition Journal of Electroanalytical Chemistry. 816: 132-137. DOI: 10.1016/J.Jelechem.2018.03.048 |
0.631 |
|
2018 |
Kim Y, Karuppannan M, Sung Y, Lim T, Kwon OJ. Direct formation of Pt catalyst on gas diffusion layer using sonochemical deposition method for the application in polymer electrolyte membrane fuel cell International Journal of Hydrogen Energy. 43: 10431-10439. DOI: 10.1016/J.Ijhydene.2018.04.088 |
0.38 |
|
2018 |
Ham YS, Kim MJ, Lim T, Kim D, Kim S, Kim JJ. Direct formation of dendritic Ag catalyst on a gas diffusion layer for electrochemical CO2 reduction to CO and H2 International Journal of Hydrogen Energy. 43: 11315-11325. DOI: 10.1016/J.Ijhydene.2017.12.067 |
0.686 |
|
2017 |
Lee H, Kim MJ, Lim T, Sung YE, Kim HJ, Lee HN, Kwon OJ, Cho YH. A facile synthetic strategy for iron, aniline-based non-precious metal catalysts for polymer electrolyte membrane fuel cells. Scientific Reports. 7: 5396. PMID 28710499 DOI: 10.1038/S41598-017-05830-Y |
0.704 |
|
2017 |
Lim T, Kim JJ. Effect of Surface Pretreatment on Film Properties Deposited by Electro-/Electroless Deposition in Cu Interconnection Journal of the Korean Electrochemical Society. 20: 1-6. DOI: 10.5229/JKES.2017.20.1.1 |
0.621 |
|
2017 |
Hwang E, Kim H, Park H, Lim T, Kim Y, Ahn SH, Kim S. Pd–Sn Alloy Electrocatalysts for Interconversion Between Carbon Dioxide and Formate/Formic Acid Journal of Nanoscience and Nanotechnology. 17: 7547-7555. DOI: 10.1166/Jnn.2017.14823 |
0.552 |
|
2017 |
Sung M, Kim HC, Lim T, Kim JJ. Effects of Organic Additives on Grain Growth in Electrodeposited Cu Thin Film during Self-Annealing Journal of the Electrochemical Society. 164. DOI: 10.1149/2.0481713Jes |
0.643 |
|
2017 |
Min YJ, Kim KH, Lim T, Kim JJ. Investigation of Working Mechanism of Bis-(3-sulfopropyl) Disulfide (SPS) during Cu Electroless Deposition Using Real-Time Observation Method Journal of the Electrochemical Society. 164. DOI: 10.1149/2.0111802Jes |
0.637 |
|
2017 |
Lee H, Sung Y, Choi I, Lim T, Kwon OJ. Authors' reply to the comment on ‘Novel synthesis of highly durable and active Pt catalyst encapsulated in nitrogen containing carbon for polymer electrolyte membrane fuel cell’ Journal of Power Sources. 363: 482. DOI: 10.1016/J.Jpowsour.2017.08.032 |
0.551 |
|
2017 |
Kim Y, Lee H, Lim T, Kim H, Kwon OJ. Non-conventional Pt-Cu alloy/carbon paper electrochemical catalyst formed by electrodeposition using hydrogen bubble as template Journal of Power Sources. 364: 16-22. DOI: 10.1016/J.Jpowsour.2017.08.016 |
0.478 |
|
2017 |
Lee H, Sung Y, Choi I, Lim T, Kwon OJ. Novel synthesis of highly durable and active Pt catalyst encapsulated in nitrogen containing carbon for polymer electrolyte membrane fuel cell Journal of Power Sources. 362: 228-235. DOI: 10.1016/J.Jpowsour.2017.07.040 |
0.571 |
|
2017 |
Ham YS, Choe S, Kim MJ, Lim T, Kim S, Kim JJ. Electrodeposited Ag catalysts for the electrochemical reduction of CO2 to CO Applied Catalysis B-Environmental. 208: 35-43. DOI: 10.1016/J.Apcatb.2017.02.040 |
0.682 |
|
2016 |
Choe S, Kim MJ, Lim T, Ham YS, Kim S, Kim JJ. Communication—Monitoring the Average Molecular Weight of Polyethylene Glycol in an Acidic Cu Plating Bath Journal of the Electrochemical Society. 163. DOI: 10.1149/2.0641614Jes |
0.71 |
|
2016 |
Lim T, Kim OH, Sung YE, Kim HJ, Lee HN, Cho YH, Kwon OJ. Preparation of onion-like Pt-terminated Pt-Cu bimetallic nano-sized electrocatalysts for oxygen reduction reaction in fuel cells Journal of Power Sources. 316: 124-131. DOI: 10.1016/J.Jpowsour.2016.03.068 |
0.424 |
|
2016 |
Kim KH, Lim T, Kim MJ, Choe S, Baek S, Kim JJ. Porous indium electrode with large surface area for effective electroreduction of N2O Electrochemistry Communications. 62: 13-16. DOI: 10.1016/J.Elecom.2015.11.002 |
0.571 |
|
2015 |
Kim KH, Lim T, Park KJ, Koo HC, Kim MJ, Kim JJ. Investigation of Cu growth phenomena on Ru substrate during electroless deposition using hydrazine as a reducing agent Electrochimica Acta. 151: 249-255. DOI: 10.1016/J.Electacta.2014.11.036 |
0.688 |
|
2014 |
Lim T, Kim KH, Kim K, Lee H, Kim HJ, Lee HN, Kim JJ, Kwon OJ. Pd seeding with the sonochemical method for application of Cu electroless deposition to Cu metallization Journal of the Electrochemical Society. 161. DOI: 10.1149/2.1081409Jes |
0.648 |
|
2014 |
Kim KH, Lim T, Kim MJ, Choe S, Park KJ, Ahn SH, Kwon OJ, Kim JJ. Direct Cu electrodeposition on electroless deposited NiWP barrier layer on SiO2 substrate for all-wet metallization process Journal of the Electrochemical Society. 161: D756-D760. DOI: 10.1149/2.0291414Jes |
0.63 |
|
2014 |
Lim T, Park KJ, Kim MJ, Koo HC, Kim KH, Choe S, Kim JJ. Real-time observation of cu electroless deposition: Synergetic suppression effect of 2,2'-dipyridyl and 3-N,N-dimethylaminodithiocarbamoyl-1- propanesulfonic acid Journal of the Electrochemical Society. 161: D135-D140. DOI: 10.1149/2.028404Jes |
0.605 |
|
2014 |
Kim HC, Kim MJ, Choe S, Lim T, Park KJ, Kim KH, Ahn SH, Kim S, Kim JJ. Electrodeposition of Cu Films with Low Resistivity and Improved Hardness Using Additive Derivatization Journal of the Electrochemical Society. 161. DOI: 10.1149/2.0271414Jes |
0.734 |
|
2014 |
Lim T, Kim MJ, Park KJ, Kim KH, Choe S, Lee YS, Kim JJ. The effect of inducing uniform Cu growth on formation of electroless Cu seed layer Thin Solid Films. 564: 299-305. DOI: 10.1016/J.Tsf.2014.06.023 |
0.672 |
|
2014 |
Kim HC, Kim MJ, Lim T, Park KJ, Kim KH, Choe S, Kim S, Kim JJ. Effects of nitrogen atoms of benzotriazole and its derivatives on the properties of electrodeposited Cu films Thin Solid Films. 550: 421-427. DOI: 10.1016/J.Tsf.2013.10.124 |
0.739 |
|
2014 |
Park KJ, Lim T, Kim MJ, Kim KH, Hwang SM, Kim JJ. In-situ transmittance measurement for characterization of organic additives in Cu electroless deposition Journal of Electroanalytical Chemistry. 731: 157-162. DOI: 10.1016/J.Jelechem.2014.08.019 |
0.685 |
|
2014 |
Choe S, Kim MJ, Kim HC, Lim T, Park KJ, Kim KH, Ahn SH, Lee A, Kim SK, Kim JJ. Degradation of poly(ethylene glycol-propylene glycol) copolymer and its influences on copper electrodeposition Journal of Electroanalytical Chemistry. 714: 85-91. DOI: 10.1016/J.Jelechem.2013.12.023 |
0.739 |
|
2014 |
Park J, Choi I, Lee MJ, Kim MH, Lim T, Park KH, Jang J, Oh SM, Cho SK, Kim JJ. Effect of fluoroethylene carbonate on electrochemical battery performance and the surface chemistry of amorphous MoO2 lithium-ion secondary battery negative electrodes Electrochimica Acta. 132: 338-346. DOI: 10.1016/J.Electacta.2014.03.173 |
0.653 |
|
2013 |
Kim KH, Lim T, Choe S, Choi I, Ahn SH, Kim MJ, Park KJ, Lee MH, Kim JJ, Kwon OJ. Direct Cu electrodeposition on ta using Pd Nanocolloids: Effect of allyl alcohol on the formation of seed layer Journal of the Electrochemical Society. 160. DOI: 10.1149/2.028312Jes |
0.734 |
|
2013 |
Choe S, Kim MJ, Kim HC, Lim T, Park KJ, Cho SK, Kim S, Kim JJ. Seed Repair by Electrodeposition in Pyrophosphate Solution for Acid Cu Superfilling Journal of the Electrochemical Society. 160. DOI: 10.1149/2.028306Jes |
0.735 |
|
2013 |
Lim T, Park KJ, Kim MJ, Koo H, Kim KH, Choe S, Kim JJ. Real-Time Observation of Cu Electroless Deposition: Effect of EDTA on Removing of Cu Oxide and Adsorption of Formaldehyde Journal of the Electrochemical Society. 160. DOI: 10.1149/2.022312Jes |
0.657 |
|
2013 |
Kim MJ, Park KJ, Lim T, Kwon OJ, Kim JJ. Fabrication of Cu-Ag Interconnection Using Electrodeposition: The Mechanism of Superfilling and the Properties of Cu-Ag Film Journal of the Electrochemical Society. 160. DOI: 10.1149/2.020312Jes |
0.656 |
|
2013 |
Kim MJ, Lim T, Park KJ, Kim S, Kim JJ. Pulse-Reverse Electrodeposition of Cu for the Fabrication of Metal Interconnection II. Enhancement of Cu Superfilling and Leveling Journal of the Electrochemical Society. 160. DOI: 10.1149/2.016312Jes |
0.742 |
|
2013 |
Kim MJ, Lim T, Park KJ, Kim S, Kim JJ. Pulse-Reverse Electrodeposition of Cu for the Fabrication of Metal Interconnection I. Effects of Anodic Steps on the Competitive Adsorption of the Additives Used for Superfilling Journal of the Electrochemical Society. 160. DOI: 10.1149/2.015312Jes |
0.721 |
|
2013 |
Lim T, Park KJ, Kim MJ, Koo H, Kim KH, Choe S, Lee Y, Kim JJ. Real-Time Observation of Cu Electroless Deposition: Adsorption Behavior of PEG during Cu Electroless Deposition Journal of the Electrochemical Society. 160. DOI: 10.1149/2.004312Jes |
0.659 |
|
2012 |
Lim T, Park KJ, Kim MJ, Koo H, Kim JJ. Real-Time Observation of Cu Electroless Deposition Using OCP Measurement Assisted by QCM Journal of the Electrochemical Society. 159. DOI: 10.1149/2.056212Jes |
0.65 |
|
2012 |
Kim MJ, Yong SH, Ko HS, Lim T, Park KJ, Kwon OJ, Kim JJ. Superfilling of Cu-Ag using electrodeposition in cyanide-based electrolyte Journal of the Electrochemical Society. 159. DOI: 10.1149/2.051211Jes |
0.632 |
|
2012 |
Kim MJ, Lim T, Park KJ, Kwon OJ, Kim S, Kim JJ. Characteristics of Pulse-Reverse Electrodeposited Cu Thin Film II. Effects of Organic Additives Journal of the Electrochemical Society. 159. DOI: 10.1149/2.046209Jes |
0.735 |
|
2012 |
Kim MJ, Lim T, Park KJ, Cho SK, Kim S, Kim JJ. Characteristics of Pulse-Reverse Electrodeposited Cu Thin Films I. Effects of the Anodic Step in the Absence of an Organic Additive Journal of the Electrochemical Society. 159. DOI: 10.1149/2.045209Jes |
0.742 |
|
2012 |
Kim MJ, Park KJ, Lim T, Choe S, Yu T, Kim JJ. One-Pot Synthesis of PdAu-Au Core-Shell Bimetallic Nanoparticles Using Electrodeposition and Their Optical Property Journal of the Electrochemical Society. 160: E1-E4. DOI: 10.1149/2.033301Jes |
0.478 |
|
2012 |
Park KJ, Kim MJ, Lim T, Koo H, Kim JJ. Conformal Cu Seed Layer Formation by Electroless Deposition in Non-Bosch through Silicon Vias Electrochemical and Solid State Letters. 15. DOI: 10.1149/2.009206Esl |
0.629 |
|
2012 |
Lim T, Koo H, Park KJ, Kim MJ, Kim S, Kim JJ. Optimization of Catalyzing Process on Ta Substrate for Copper Electroless Deposition Using Electrochemical Method Journal of the Electrochemical Society. 159. DOI: 10.1149/2.009203Jes |
0.631 |
|
2012 |
Ahn SH, Hwang SJ, Yoo SJ, Choi I, Kim HJ, Jang JH, Nam S, Lim TH, Lim T, Kim SK, Kim JJ. Electrodeposited Ni dendrites with high activity and durability for hydrogen evolution reaction in alkaline water electrolysis Journal of Materials Chemistry. 22: 15153-15159. DOI: 10.1039/C2Jm31439H |
0.744 |
|
2012 |
Ahn SH, Choi I, Kwon OJ, Lim T, Kim JJ. Electrochemical preparation of Pt-based catalysts on carbon paper treated with Sn sensitization and Pd activation International Journal of Hydrogen Energy. 37: 41-50. DOI: 10.1016/J.Ijhydene.2011.09.074 |
0.68 |
|
2011 |
Park KJ, Koo H, Lim T, Kim MJ, Kwon OJ, Kim JJ. Evaluation of Stability and Reactivity of Cu Electroless Deposition Solution by In-Situ Transmittance Measurement Journal of the Electrochemical Society. 158. DOI: 10.1149/1.3606532 |
0.639 |
|
2011 |
Lim T, Koo H, Kim KH, Park KJ, Kim MJ, Kwon OJ, Kim JJ. Room-Temperature Electroless Deposition of CoB Film and its Application as In Situ Capping during Buffing Process Electrochemical and Solid State Letters. 14. DOI: 10.1149/1.3600759 |
0.544 |
|
2011 |
Cho SK, Kim MJ, Lim T, Kwon OJ, Kim JJ. Deposit profiles characterized by the seed layer in Cu pulse-reverse plating on a patterned substrate Journal of Vacuum Science & Technology B. 29: 11004. DOI: 10.1116/1.3521508 |
0.639 |
|
2010 |
Kim MJ, Cho SK, Koo H, Lim T, Park KJ, Kim JJ. Pulse Electrodeposition for Improving Electrical Properties of Cu Thin Film Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3481564 |
0.67 |
|
2010 |
Park KJ, Koo HC, Lim T, Kim JJ. Evaluation of stability and reactivity of solutions by in situ transmittance in electroless deposition Ecs Transactions. 25: 145-153. DOI: 10.1149/1.3390667 |
0.56 |
|
2010 |
Cho SK, Lim T, Lee H, Kim JJ. A Study on Seed Damage in Plating Electrolyte and Its Repairing in Cu Damascene Metallization Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3291985 |
0.65 |
|
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