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Jimin Maeng, Ph.D. - Publications

Affiliations: 
2014 Electrical and Computer Engineering Purdue University, West Lafayette, IN, United States 
Area:
Implantable Devices, Epilepsy, Prosthetics, Implantable Electrodes
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18 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Chakraborty B, Joshi-Imre A, Maeng J, Cogan SF. Sputtered ruthenium oxide coatings for neural stimulation and recording electrodes. Journal of Biomedical Materials Research. Part B, Applied Biomaterials. PMID 32945088 DOI: 10.1002/Jbm.B.34728  0.331
2020 Rihani RT, Stiller AM, Usoro JO, Lawson J, Kim H, Black BJ, Danda VR, Maeng J, Varner VD, Ware TH, Pancrazio JJ. Deployable, liquid crystal elastomer-based intracortical probes. Acta Biomaterialia. PMID 32428679 DOI: 10.1016/J.Actbio.2020.04.032  0.365
2020 Maeng J, Rihani RT, Javed M, Rajput JS, Kim H, Bouton IG, Criss TA, Pancrazio JJ, Black BJ, Ware TH. Liquid crystal elastomers as substrates for 3D, robust, implantable electronics. Journal of Materials Chemistry. B. PMID 32315020 DOI: 10.1039/D0Tb00471E  0.387
2019 Ghazavi A, Maeng J, Black M, Salvi S, Cogan S. Electrochemical characteristics of ultramicro-dimensioned SIROF electrodes for neural stimulation and recording. Journal of Neural Engineering. PMID 31665712 DOI: 10.1088/1741-2552/Ab52Ab  0.309
2019 Maeng J, Chakraborty B, Geramifard N, Kang T, Rihani RT, Joshi-Imre A, Cogan SF. High-charge-capacity sputtered iridium oxide neural stimulation electrodes deposited using water vapor as a reactive plasma constituent. Journal of Biomedical Materials Research. Part B, Applied Biomaterials. PMID 31353822 DOI: 10.1002/Jbm.B.34442  0.33
2019 Kim H, Gibson J, Maeng J, Saed M, Pimentel K, Rihani R, Pancrazio JJ, Georgakopoulos S, Ware TH. Responsive, 3D Electronics Enabled by Liquid Crystal Elastomer Substrates. Acs Applied Materials & Interfaces. PMID 31070344 DOI: 10.1021/Acsami.9B04189  0.351
2019 Joshi-Imre A, Black BJ, Abbott J, Kanneganti A, Rihani R, Chakraborty B, Danda VR, Maeng J, Sharma R, Rieth L, Negi S, Pancrazio JJ, Cogan S. Chronic recording and electrochemical performance of amorphous silicon carbide-coated Utah electrode arrays implanted in rat motor cortex. Journal of Neural Engineering. PMID 31013489 DOI: 10.1088/1741-2552/Ab1Bc8  0.395
2018 Deku F, Mohammed S, Joshi-Imre A, Maeng J, Danda V, Gardner TJ, Cogan SF. Effect of oxidation on intrinsic residual stress in amorphous silicon carbide films. Journal of Biomedical Materials Research. Part B, Applied Biomaterials. PMID 30321479 DOI: 10.1002/Jbm.B.34258  0.34
2018 Gutierrez-Heredia G, Maeng J, Conde J, Rodriguez-Lopez O, Voit WE. Effect of annealing atmosphere on IGZO thin film transistors on a deformable softening polymer substrate Semiconductor Science and Technology. 33: 095001. DOI: 10.1088/1361-6641/Aad293  0.347
2016 Maeng J, Kim YJ, Meng C, Irazoqui PP. Three-Dimensional Microcavity Array Electrodes for High-Capacitance All-Solid-State Flexible Micro-Supercapacitors. Acs Applied Materials & Interfaces. PMID 27176134 DOI: 10.1021/Acsami.6B03559  0.61
2015 Kim YJ, Maeng J, Irazoqui PP. Eyeglasses-powered, contact lens-like platform with high power transfer efficiency. Biomedical Microdevices. 17: 9979. PMID 26149695 DOI: 10.1007/S10544-015-9979-0  0.55
2015 Maeng J, Meng C, Irazoqui PP. Wafer-scale integrated micro-supercapacitors on an ultrathin and highly flexible biomedical platform. Biomedical Microdevices. 17: 7. PMID 25653069 DOI: 10.1007/S10544-015-9930-4  0.61
2014 Meng C, Maeng J, John SWM, Irazoqui PP. Ultrasmall integrated 3d micro-supercapacitors solve energy storage for miniature devices Advanced Energy Materials. 4. DOI: 10.1002/Aenm.201301269  0.564
2012 Maeng J, Ha D, Chappell WJ, Irazoqui PP. Parylene as thin flexible 3-D packaging enabler for biomedical implants Proceedings - 2012 45th International Symposium On Microelectronics, Imaps 2012. 176-185.  0.533
2011 Maeng J, Kim B, Ha D, Chappell WJ. Parylene interposer as thin flexible 3-D packaging enabler for wireless applications Ieee Transactions On Microwave Theory and Techniques. 59: 3410-3418. DOI: 10.1109/Tmtt.2011.2172626  0.424
2009 Song S, Kim Y, Maeng J, Lee H, Kwon Y, Seo K. A Millimeter-Wave System-on-Package Technology Using a Thin-Film Substrate With a Flip-Chip Interconnection Ieee Transactions On Advanced Packaging. 32: 101-108. DOI: 10.1109/Tadvp.2008.2006626  0.361
2008 Maeng J, Song S, Jeon N, Yoo C, Lee H, Seo K. Embedded Decoupling Capacitors up to 80 nF on Multichip Module-Deposited with Quasi-Three-Dimensional Metal–Insulator–Metal Structure Japanese Journal of Applied Physics. 47: 2535-2537. DOI: 10.1143/Jjap.47.2535  0.388
2007 Maeng J, Song S, Yoo C, Lee H, Seo K. Integration of MIM Capacitors on BCB with Thin-Film MCM-D Technology The Japan Society of Applied Physics. 2007: 384-385. DOI: 10.7567/Ssdm.2007.P-2-4  0.355
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