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Weidong Xie, Ph.D. - Publications

Affiliations: 
2001 Georgia Institute of Technology, Atlanta, GA 
Area:
Mechanical Engineering
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4 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2003 Xie W, Sitaraman SK. Investigation of interfacial delamination of a copper-epoxy interface under monotonic and cyclic loading: Experimental characterization Ieee Transactions On Advanced Packaging. 26: 447-452. DOI: 10.1109/Tadvp.2003.821091  0.489
2003 Xie W, Sitaraman SK. Investigation of interfacial delamination of a copper-epoxy interface under monotonic and cyclic loading: Modeling and evaluation Ieee Transactions On Advanced Packaging. 26: 441-446. DOI: 10.1109/Tadvp.2003.821087  0.499
2003 Xie W, Sitaraman SK. An experimental technique to determine critical stress intensity factors for delamination initiation Engineering Fracture Mechanics. 70: 1193-1201. DOI: 10.1016/S0013-7944(02)00090-5  0.471
1999 Variyam MN, Xie W, Sitaraman SK. Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling Journal of Electronic Packaging. 122: 121-127. DOI: 10.1115/1.483143  0.462
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