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Bowen Cheng, Ph.D. - Publications

Affiliations: 
2011 University of Washington, Seattle, Seattle, WA 
Area:
Electronics and Electrical Engineering
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1 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2013 Cheng B, De Bruyker D, Chua C, Sahasrabuddhe K, Shubin I, Cunningham JE, Luo Y, Bohringer KF, Krishnamoorthy AV, Chow EM. Microspring characterization and flip-chip assembly reliability Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 187-196. DOI: 10.1109/Tcpmt.2012.2213250  0.501
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