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Lei Nie, Ph.D. - Publications

Affiliations: 
2010 Mechanical Engineering University of Maryland, College Park, College Park, MD 
Area:
Mechanical Engineering
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6 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2014 Nie L, Kumar A, Zhan S. Periocular recognition using unsupervised convolutional RBM feature learning Proceedings - International Conference On Pattern Recognition. 399-404. DOI: 10.1109/ICPR.2014.77  0.444
2010 Nie L, Osterman M, Pecht MG. Microstructural Analysis of Reworked Ball Grid Array Assemblies Under Thermomechanical Loading Conditions Ieee Transactions On Device and Materials Reliability. 10: 276-286. DOI: 10.1109/Tdmr.2010.2048327  0.449
2010 Nie L, Mueller M, Osterman M, Pecht M. Microstructural Analysis of Reballed Tin-Lead, Lead-Free, and Mixed Ball Grid Array Assemblies Under Temperature Cycling Test Journal of Electronic Materials. 39: 1218-1232. DOI: 10.1007/S11664-010-1209-1  0.471
2009 Nie L, Osterman M, Song F, Lo J, Lee SWR, Pecht M. Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages Ieee Transactions On Components and Packaging Technologies. 32: 901-908. DOI: 10.1109/Tcapt.2009.2021392  0.487
2007 Nie L, Azaruan MH, Keimasi M, Pecht M. Prognostics of ceramic capacitor temperature-humidity-bias reliability using Mahalanobis distance analysis Circuit World. 33: 21-28. DOI: 10.1108/03056120710776988  0.586
2007 Nie L, Pecht M, Ciocci R. Regulations and market trends in lead-free and halogen-free electronics Circuit World. 33: 4-9. DOI: 10.1108/03056120710750201  0.581
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