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Gregory A. Ten Eyck, Ph.D. - Publications

Affiliations: 
2007 Rensselaer Polytechnic Institute, Troy, NY, United States 
Area:
Electronics and Electrical Engineering, Materials Science Engineering
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8 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2007 Lay NE, Ten Eyck GA, Duquette DJ, Lu TM. Direct plating of Cu on Pd plasma enhanced atomic layer deposition coated TaN Barrier Electrochemical and Solid-State Letters. 10. DOI: 10.1149/1.2388249  0.736
2007 Gedelian CA, Ten Eyck GA, Lu TM. Onset of thermal degradation in poly(p-phenylene vinylene) films deposited by chemical vapor deposition Synthetic Metals. 157: 48-52. DOI: 10.1016/J.Synthmet.2006.12.003  0.547
2007 Ten Eyck GA, Pimanpang S, Juneja JS, Bakhru H, Lu TM, Wang GC. Plasma-enhanced atomic layer deposition of palladium on a polymer substrate Chemical Vapor Deposition. 13: 307-311. DOI: 10.1002/Cvde.200606508  0.663
2006 Karabacak T, Deluca JS, Wang PI, Ten Eyck GA, Ye D, Wang GC, Lu TM. Low temperature melting of copper nanorod arrays Journal of Applied Physics. 99. DOI: 10.1063/1.2180437  0.649
2006 Kim YS, Shin J, Cho JH, Ten Eyck GA, Liu DL, Pimanpang S, Lu TM, Senkevich JJ, Shin HS. Surface characterization of copper electroless deposition on atomic layer deposited palladium on iridium and tungsten Surface and Coatings Technology. 200: 5760-5766. DOI: 10.1016/J.Surfcoat.2005.08.142  0.726
2006 Kim YS, Kim HI, Cho JH, Seo HK, Dar MA, Shin HS, Ten Eyck GA, Lu TM, Senkevich JJ. Electroless copper on refractory and noble metal substrates with an ultra-thin plasma-assisted atomic layer deposited palladium layer Electrochimica Acta. 51: 2400-2406. DOI: 10.1016/J.Electacta.2005.07.018  0.728
2006 Ten Eyck GA, Pimanpang S, Bakhru H, Lu TM, Wang GC. Atomic layer deposition of Pd on an oxidized metal substrate Chemical Vapor Deposition. 12: 290-294. DOI: 10.1002/Cvde.200506456  0.601
2005 Kim YS, Ten Eyck GA, Ye D, Jezewski C, Karabacak T, Shin HS, Senkevich JJ, Lu TM. Atomic layer deposition of Pd on TaN for Cu electroless plating Journal of the Electrochemical Society. 152. DOI: 10.1149/1.1899285  0.69
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