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Hang Ren, Ph.D. - Publications

Affiliations: 
2014 hkust Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong 
Area:
Mechanical Engineering
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9 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2015 Zhou XY, Ren H, Huang BL, Zhang TY. Surface-induced size-dependent ultimate tensile strength of thin films Physics Letters, Section a: General, Atomic and Solid State Physics. 379: 471-481. DOI: 10.1016/J.Physleta.2014.10.054  0.533
2015 Cao SG, Wu HH, Ren H, Chen LQ, Wang J, Li J, Zhang TY. A novel mechanism to reduce coercive field of ferroelectric materials via {1 1 1} twin engineering Acta Materialia. 97: 404-412. DOI: 10.1016/J.Actamat.2015.07.009  0.305
2014 Ren H, Zhang T. H concentrations and stresses in Pd nanoparticles Materials Letters. 130: 176-179. DOI: 10.1016/J.Matlet.2014.05.104  0.509
2013 Zhang T, Ren H. Solute Concentrations and Strains in Nanoparticles Journal of Thermal Stresses. 36: 626-645. DOI: 10.1080/01495739.2013.784123  0.528
2013 Ren H, Yang X, Gao Y, Zhang T. Solute concentrations and stresses in nanograined H–Pd solid solution Acta Materialia. 61: 5487-5495. DOI: 10.1016/J.Actamat.2013.05.037  0.498
2013 Zhang T, Ren H. Solute Concentrations and Strains in Nanograined Materials Acta Materialia. 61: 477-493. DOI: 10.1016/J.Actamat.2012.09.060  0.521
2012 Lu J, Ren H, Deng D, Wang Y, Chen KJ, Lau K, Zhang T. Thermally activated pop-in and indentation size effects in GaN films Journal of Physics D: Applied Physics. 45: 085301. DOI: 10.1088/0022-3727/45/8/085301  0.47
2011 Zhang T, Ren H, Wang Z, Sun S. Surface eigen-displacement and surface Poisson’s ratios of solids Acta Materialia. 59: 4437-4447. DOI: 10.1016/J.Actamat.2011.03.067  0.513
2009 Gu C, Ren H, Tu J, Zhang TY. Micro/nanobinary structure of silver films on copper alloys with stable water-repellent property under dynamic conditions. Langmuir : the Acs Journal of Surfaces and Colloids. 25: 12299-307. PMID 19754194 DOI: 10.1021/La902936U  0.49
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