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Eui K. Kim, Ph.D. - Publications

Affiliations: 
2005 University of Texas at Austin, Austin, Texas, U.S.A. 
Area:
design and synthesis of functional organic materials
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12 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2015 Kim EK, Lee SC, Hwang JW, Chang SA, Park SJ, On YK, Park KM, Choe YH, Kim SM, Park SW, Oh JK. Differences in apical and non-apical types of hypertrophic cardiomyopathy: a prospective analysis of clinical, echocardiographic, and cardiac magnetic resonance findings and outcome from 350 patients. European Heart Journal Cardiovascular Imaging. PMID 26245912 DOI: 10.1093/ehjci/jev192  0.449
2008 Lin MW, Hellebusch DJ, Wu K, Kim EK, Lu K, Tao L, Liechti KM, Ekerdt JG, Ho PS, Hu W, Willson CG. Interfacial adhesion studies for step and flash imprint lithography Proceedings of Spie - the International Society For Optical Engineering. 6921. DOI: 10.1117/12.772797  0.538
2008 Lin MW, Hellebusch DJ, Wu K, Kim EK, Lu KH, Liechti KM, Ekerdt JG, Ho PS, Willson CG. Role of surfactants in adhesion reduction for step and flash imprint lithography Journal of Micro/Nanolithography, Mems, and Moems. 7. DOI: 10.1117/1.2968269  0.544
2007 Wu K, Wang X, Kim EK, Willson CG, Ekerdt JG. Experimental and theoretical investigation on surfactant segregation in imprint lithography. Langmuir : the Acs Journal of Surfaces and Colloids. 23: 1166-70. PMID 17241028 DOI: 10.1021/la061736y  0.476
2006 Schmid GM, Stewart MD, Wetzel J, Palmieri F, Hao J, Nishimura Y, Jen K, Kim EK, Resnick DJ, Liddle JA, Willson CG. Implementation of an imprint damascene process for interconnect fabrication Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 24: 1283-1291. DOI: 10.1116/1.2197508  0.713
2006 Kim EK, Willson CG. Thermal analysis for step and flash imprint lithography during UV curing process Microelectronic Engineering. 83: 213-217. DOI: 10.1016/J.Mee.2005.08.007  0.588
2005 Kim EK, Stewart MD, Wu K, Palmieri FL, Dickey MD, Ekerdt JG, Willson CG. Vinyl ether formulations for step and flash imprint lithography Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 23: 2967-2971. DOI: 10.1116/1.2131881  0.735
2005 Johnson S, Burns R, Kim EK, Dickey M, Schmid G, Meiring J, Burns S, Willson CG, Convey D, Wei Y, Fejes P, Gehoski K, Mancini D, Nordquist K, Dauksher WJ, et al. Effects of etch barrier densification on step and flash imprint lithography Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 23: 2553-2556. DOI: 10.1116/1.2102971  0.661
2005 Kim EK, Ekerdt JG, Willson CG. Importance of evaporation in the design of materials for step and flash imprint lithography Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 23: 1515-1520. DOI: 10.1116/1.1990162  0.591
2005 Dickey MD, Burns RL, Kim EK, Johnson SC, Stacey NA, Willson CG. Study of the kinetics of step and flash imprint lithography photopolymerization Aiche Journal. 51: 2547-2555. DOI: 10.1002/Aic.10477  0.724
2004 Johnson S, Burns R, Kim EK, Schmid G, Dickey M, Meiring J, Burns S, Stacey N, Willson CG, Convey D, Wei Y, Fejes P, Gehoski K, Mancini D, Nordquist K, et al. Step and Flash Imprint Lithography modeling and process development Journal of Photopolymer Science and Technology. 17: 417-419. DOI: 10.2494/Photopolymer.17.417  0.676
2004 Kim EK, Stacey NA, Smith BJ, Dickey MD, Johnson SC, Trinque BC, Willson CG. Vinyl ethers in ultraviolet curable formulations for step and flash imprint lithography Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 22: 131-135. DOI: 10.1116/1.1635849  0.767
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