Bing Shi, Ph.D. - Publications
Affiliations: | 2013 | Electrical Engineering | University of Maryland, College Park, College Park, MD |
Year | Citation | Score | |||
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2014 | Zhang Y, Shi B, Srivastava A. Statistical Framework for Designing On-Chip Thermal Sensing Infrastructure in Nanoscale Systems Ieee Transactions On Very Large Scale Integration Systems. 22: 270-279. DOI: 10.1109/Tvlsi.2013.2244926 | 0.494 | |||
2014 | Shi B, Srivastava A. Optimized Micro-Channel Design for Stacked 3-D-ICs Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 33: 90-100. DOI: 10.1109/Tcad.2013.2279514 | 0.542 | |||
2014 | Serafy C, Shi B, Srivastava A. A geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs Integration. 47: 307-317. DOI: 10.1016/J.Vlsi.2013.11.004 | 0.487 | |||
2013 | Bar-Cohen A, Srivastava A, Shi B. Thermo-electrical co-design of three-dimensional integrated circuits: Challenges and opportunities Computational Thermal Sciences. 5: 441-458. DOI: 10.1615/Computthermalscien.2013007643 | 0.55 | |||
2013 | Shi B, Zhang Y, Srivastava A. Dynamic Thermal Management Under Soft Thermal Constraints Ieee Transactions On Very Large Scale Integration Systems. 21: 2045-2054. DOI: 10.1109/Tvlsi.2012.2227854 | 0.512 | |||
2013 | Shi B, Srivastava A, Bar-Cohen A. Co-design of micro-fluidic heat sink and thermal through-silicon-vias for cooling of three-dimensional integrated circuit Iet Circuits, Devices and Systems. 7: 223-231. DOI: 10.1049/Iet-Cds.2013.0026 | 0.536 | |||
2013 | Shi B, Srivastava A. Micro-Fluidic Cooling for Stacked 3D-ICs: Fundamentals, Modeling and Design Advances in Computers. 88: 79-124. DOI: 10.1016/B978-0-12-407725-6.00002-2 | 0.536 | |||
2012 | Shi B, Zhang Y, Srivastava A. Accelerating Gate Sizing Using Graphics Processing Units Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 31: 160-164. DOI: 10.1109/Tcad.2011.2164539 | 0.47 | |||
2011 | Shi B, Srivastava A. Unified Datacenter Power Management Considering On-Chip and Air Temperature Constraints Sustainable Computing: Informatics and Systems. 1: 91-98. DOI: 10.1016/J.Suscom.2011.02.001 | 0.495 | |||
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