Lei Nie, Ph.D. - Publications
Affiliations: | 2010 | Mechanical Engineering | University of Maryland, College Park, College Park, MD |
Area:
Mechanical EngineeringYear | Citation | Score | |||
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2014 | Nie L, Kumar A, Zhan S. Periocular recognition using unsupervised convolutional RBM feature learning Proceedings - International Conference On Pattern Recognition. 399-404. DOI: 10.1109/ICPR.2014.77 | 0.444 | |||
2010 | Nie L, Osterman M, Pecht MG. Microstructural Analysis of Reworked Ball Grid Array Assemblies Under Thermomechanical Loading Conditions Ieee Transactions On Device and Materials Reliability. 10: 276-286. DOI: 10.1109/Tdmr.2010.2048327 | 0.449 | |||
2010 | Nie L, Mueller M, Osterman M, Pecht M. Microstructural Analysis of Reballed Tin-Lead, Lead-Free, and Mixed Ball Grid Array Assemblies Under Temperature Cycling Test Journal of Electronic Materials. 39: 1218-1232. DOI: 10.1007/S11664-010-1209-1 | 0.471 | |||
2009 | Nie L, Osterman M, Song F, Lo J, Lee SWR, Pecht M. Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages Ieee Transactions On Components and Packaging Technologies. 32: 901-908. DOI: 10.1109/Tcapt.2009.2021392 | 0.487 | |||
2007 | Nie L, Azaruan MH, Keimasi M, Pecht M. Prognostics of ceramic capacitor temperature-humidity-bias reliability using Mahalanobis distance analysis Circuit World. 33: 21-28. DOI: 10.1108/03056120710776988 | 0.586 | |||
2007 | Nie L, Pecht M, Ciocci R. Regulations and market trends in lead-free and halogen-free electronics Circuit World. 33: 4-9. DOI: 10.1108/03056120710750201 | 0.581 | |||
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