Xingsheng Liu, Ph.D. - Publications
Affiliations: | 2001 | Virginia Polytechnic Institute and State University, Blacksburg, VA, United States |
Area:
Packaging Engineering, Materials Science Engineering, Electronics and Electrical EngineeringYear | Citation | Score | |||
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2005 | Lin Y, Chen X, Liu X, Lu G. Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling Microelectronics Reliability. 45: 143-154. DOI: 10.1016/J.Microrel.2004.06.009 | 0.562 | |||
2002 | Liu X, Xu S, Lu G, Dillard DA. Effect of substrate flexibility on solder joint reliability Microelectronics Reliability. 42: 1883-1891. DOI: 10.1016/S0026-2714(02)00269-X | 0.566 | |||
2001 | Liu X, Xu S, Lu G, Dillard DA. Stacked solder bumping technology for improved solder joint reliability Microelectronics Reliability. 41: 1979-1992. DOI: 10.1016/S0026-2714(01)00117-2 | 0.551 | |||
2001 | Haque S, Siddabattula K, Craven M, Wen S, Liu X, Boroyevich D, Lu G. Design issues of a three-dimensional packaging scheme for power modules Microelectronics Reliability. 41: 295-305. DOI: 10.1016/S0026-2714(00)00208-0 | 0.51 | |||
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