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Sungwook Moon, Ph.D. - Publications

Affiliations: 
2010 Electrical and Computer Engineering Purdue University, West Lafayette, IN, United States 
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15 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2016 Kim KG, Park DW, Kang GR, Kim TS, Yang Y, Moon SJ, Choi EA, Ha DR, Kim ES, Cho BS. Simultaneous determination of plant growth regulator and pesticides in bean sprouts by liquid chromatography-tandem mass spectrometry. Food Chemistry. 208: 239-44. PMID 27132845 DOI: 10.1016/j.foodchem.2016.04.002  0.46
2016 Park JY, Noh YM, Chung SW, Moon SG, Ha DH, Lee KS, Chung SW. Bennett lesions in baseball players detected by magnetic resonance imaging: assessment of association factors. Journal of Shoulder and Elbow Surgery / American Shoulder and Elbow Surgeons ... [Et Al.]. PMID 26897315 DOI: 10.1016/j.jse.2015.11.062  0.479
2015 Park DW, Kim KG, Choi EA, Kang GR, Kim TS, Yang YS, Moon SJ, Ha DR, Kim ES, Cho BS. Pesticide residues in leafy vegetables, stalk and stem vegetables from South Korea: a long-term study on safety and health risk assessment. Food Additives & Contaminants. Part a, Chemistry, Analysis, Control, Exposure & Risk Assessment. 1-14. PMID 26571090 DOI: 10.1080/19440049.2015.1108524  0.456
2013 Moon S. Effect on radio-frequency characteristics of pad-to-pad interconnection by varying vertical interconnect density in magnetically-aligned anisotropic conductive adhesive Ieee Transactions On Components, Packaging and Manufacturing Technology. 3. DOI: 10.1109/Tcpmt.2013.2247794  0.37
2012 Moon S, Chappell WJ. Novel self-assembly process using magnetically aligned z-axis anisotropic conductive adhesive for high-density vertical interconnection Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 756-763. DOI: 10.1109/Tcpmt.2012.2186138  0.553
2012 Moon S. Pad-to-pad isolation of vertical interconnects using magnetically aligned anisotropic conductive adhesive Microwave and Optical Technology Letters. 54: 2606-2610. DOI: 10.1002/Mop.27153  0.361
2011 Moon S, Chappell WJ. Analysis of failure rate by column distribution in magnetically aligned anisotropic conductive adhesive Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 784-791. DOI: 10.1109/Tcpmt.2011.2111374  0.531
2010 Moon S, Chappell WJ. Novel three-dimensional packaging approaches using magnetically aligned anisotropic conductive adhesive for microwave applications Ieee Transactions On Microwave Theory and Techniques. 58: 3815-3823. DOI: 10.1109/Tmtt.2010.2086630  0.578
2010 Moon S, Sigmarsson HH, Joshi H, Chappell WJ. Substrate integrated evanescent-mode cavity filter with a 3.5 to 1 tuning ratio Ieee Microwave and Wireless Components Letters. 20: 450-452. DOI: 10.1109/Lmwc.2010.2050680  0.66
2009 Joshi H, Sigmarsson HH, Moon S, Peroulis D, Chappell WJ. High-Q fully reconfigurable tunable bandpass filters Ieee Transactions On Microwave Theory and Techniques. 57: 3525-3533. DOI: 10.1109/Tmtt.2009.2034309  0.662
2008 Chow EY, Yang CL, Chlebowski A, Moon S, Chappell WJ, Irazoqui PP. Implantable wireless telemetry boards for in Vivo transocular transmission Ieee Transactions On Microwave Theory and Techniques. 56: 3200-3208. DOI: 10.1109/Tmtt.2008.2007338  0.609
2008 Moon S, Sigmarsson HH, Huang Y, Bruemmer T, Khanna SK, Chappell WJ. Magnetically aligned anisotropic conductive adhesive for microwave applications Ieee Transactions On Microwave Theory and Techniques. 56: 2942-2949. DOI: 10.1109/Tmtt.2008.2007309  0.661
2006 Moon S, Han S, Choi J, Shin S, Margalit M, Avni E, Rogovsky G. Packaging for a FP‐LD hybrid transceiver using filter‐integrated PLC platform with PD insertion trench Microwave and Optical Technology Letters. 48: 489-491. DOI: 10.1002/Mop.21387  0.347
2005 Moon S, Han J. Packaging of CWDM bidirectional transceiver using robust tuning scheme of thin-film filter Ieice Electronics Express. 2: 536-541. DOI: 10.1587/Elex.2.536  0.358
2005 Moon S, Han S, Choi J, Shin S, Ryu G, Park S, Song S, Margalit M, Avni E, Rogovsky G. Hybrid packaging for a 1.25-Gb/s bidirectional transceiver using a filter-integrated planar lightwave circuit platform Microwave and Optical Technology Letters. 47: 34-36. DOI: 10.1002/Mop.21073  0.379
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