Dennis Kam - Publications

Affiliations: 
University of Miami, Coral Gables, FL 
Area:
Music, English Literature

64 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2016 Yeon S, Kam DG. Reduction of P/G impedance by edge plating 2015 Ieee Electrical Design of Advanced Packaging and Systems Symposium, Ieee Edaps 2015. 221-224. DOI: 10.1109/EDAPS.2015.7383715  0.36
2016 Park W, Kam DG. Quantifying the impact of differential-to-common mode conversion on RFI 2015 Ieee Electrical Design of Advanced Packaging and Systems Symposium, Ieee Edaps 2015. 121-124. DOI: 10.1109/EDAPS.2015.7383682  0.36
2016 Seo H, Kam DG. Gain variation of 60-GHz patch antennas due to ground plane dimensions 2015 Ieee Electrical Design of Advanced Packaging and Systems Symposium, Ieee Edaps 2015. 117-120. DOI: 10.1109/EDAPS.2015.7383681  0.36
2016 Seo J, Park J, Lee J, Lee JH, Lee JJ, Kam DK, Seo S. Enhancement of daily gain and feed efficiency of growing heifers by dietary supplementation of β-mannanase in Hanwoo (Bos taurus coreanae) Livestock Science. 188: 21-24. DOI: 10.1016/j.livsci.2016.04.001  0.64
2015 Hwang C, Park W, Kam DG. Complex permittivity extraction from PCB stripline measurement using recessed probe launch Ieice Electronics Express. 12. DOI: 10.1587/elex.12.20150023  0.36
2015 Kwon M, Gun Kam D. Removal of Specific Harmonics by Rise Time Control Ieee Transactions On Electromagnetic Compatibility. DOI: 10.1109/TEMC.2015.2426202  0.36
2015 Kim M, Kam DG. Wideband and Compact EBG Structure With Balanced Slots Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/TCPMT.2015.2436404  0.36
2015 Park HH, Kam DG, Park YB, Kim J, Lim JD, Park HB, Song E. RF interference evaluation of flexible flat cables for high-speed data transmission in mobile devices Emc Compo 2015 - 2015 10th International Workshop On the Electromagnetic Compatibility of Integrated Circuits. 169-173. DOI: 10.1109/EMCCompo.2015.7358351  0.36
2015 Kam DH, Kim J, Song L, Mazumder J. Formation mechanism of micro-spikes on AISI 4340 steel with femtosecond laser pulses at near-threshold fluence Journal of Micromechanics and Microengineering. 25. DOI: 10.1088/0960-1317/25/4/045007  0.36
2015 Lee JH, Kam DH, Jeong YH. The effect of nanofluid stability on critical heat flux using magnetite-water nanofluids Nuclear Engineering and Design. 292: 187-192. DOI: 10.1016/j.nucengdes.2015.05.026  0.4
2015 Kam DH, Lee JH, Lee T, Jeong YH. Critical heat flux for SiC- and Cr-coated plates under atmospheric condition Annals of Nuclear Energy. 76: 335-342. DOI: 10.1016/j.anucene.2014.09.046  0.4
2015 Kam DH, Park HM, Choi YJ, Jeong YH. CHF measurement for downward facing SUS 304 and carbon steel plates under atmospheric and pool boiling conditions International Topical Meeting On Nuclear Reactor Thermal Hydraulics 2015, Nureth 2015. 4: 2881-2891.  0.4
2014 Kam DG. Optimization of flip-chip transitions for 60-GHz packages Ieice Electronics Express. 11. DOI: 10.1587/elex.11.20140256  0.36
2014 Kim M, Kam DG. A wideband and compact EBG structure with a circular defected ground structure Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 496-503. DOI: 10.1109/TCPMT.2013.2285407  0.36
2014 Lee T, Kam DH, Lee JH, Jeong YH. Effects of two-phase flow conditions on flow boiling CHF enhancement of magnetite-water nanofluids International Journal of Heat and Mass Transfer. 74: 278-284. DOI: 10.1016/j.ijheatmasstransfer.2014.03.028  0.4
2014 Park S, Kwon M, Kam DG. Design of a 77-GHz radar frontend module Microwave and Optical Technology Letters. 56: 3015-3020. DOI: 10.1002/mop.28760  0.36
2014 Kam DH, Lee JH, Lee T, Jeong YH. Measurement of critical heat flux for SiC-coated stainless steel plate and α-SiC tube with short-heated length under atmospheric condition International Congress On Advances in Nuclear Power Plants, Icapp 2014. 3: 1735-1742.  0.4
2013 Gu X, Kam DG, Liu D, Piz M, Valdes-Garcia A, Natarajan A, Baks C, Sadhu B, Reynolds SK. Enhanced multilayer organic packages with embedded phased-array antennas for 60-GHz wireless communications Proceedings - Electronic Components and Technology Conference. 1650-1655. DOI: 10.1109/ECTC.2013.6575794  0.36
2013 Kam DH, Lee JH, Lee T, Jeong YH. Assessment of critical heat flux (chf) performance in water using sic-coated plate and -sic pipe under atmospheric pressure International Congress On Advances in Nuclear Power Plants, Icapp 2013: Nuclear Power - a Safe and Sustainable Choice For Green Future, Held With the 28th Kaif/Kns Annual Conference. 1693-1700.  0.4
2011 Kim K, Kam D, Nguyen CC, Song SW, Kostecki R. Study on the dominant film-forming site among components of Li(Ni 1/3Co1/3Mn1/3)O2 cathode in Li-ion batteries Bulletin of the Korean Chemical Society. 32: 2571-2576. DOI: 10.5012/bkcs.2011.32.8.2571  0.52
2011 Kam DG, Liu D, Natarajan A, Reynolds SK, Floyd BA. Organic packages with embedded phased-array antennas for 60-GHz wireless chipsets Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 1806-1814. DOI: 10.1109/TCPMT.2011.2169064  0.36
2011 Kam DG, Kim J. Foreword special section on through silicon vias Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 152-153. DOI: 10.1109/TCPMT.2011.2116970  0.36
2011 Kam DG, Liu D, Natarajan A, Reynolds S, Chen HC, Floyd BA. LTCC packages with embedded phased-array antennas for 60 GHz communications Ieee Microwave and Wireless Components Letters. 21: 142-144. DOI: 10.1109/LMWC.2010.2103932  0.36
2011 Natarajan A, Reynolds SK, Tsai MD, Nicolson ST, Zhan JHC, Kam DG, Liu D, Huang YLO, Valdes-Garcia A, Floyd BA. A fully-integrated 16-element phased-array receiver in SiGe BiCMOS for 60-GHz communications Ieee Journal of Solid-State Circuits. 46: 1059-1075. DOI: 10.1109/JSSC.2011.2118110  0.36
2011 Kam DG, Liu D, Natarajan A, Reynolds S, Floyd BA. Low-cost antenna-in-package solutions for 60-GHz phased-array systems 2010 Ieee 19th Conference On Electrical Performance of Electronic Packaging and Systems, Epeps 2010. 93-96. DOI: 10.1109/EPEPS.2010.5642554  0.36
2011 Lee SY, Lee SM, Cho YB, Kam DK, Lee SC, Kim CH, Seo S. Glycerol as a feed supplement for ruminants: In vitro fermentation characteristics and methane production Animal Feed Science and Technology. 166: 269-274. DOI: 10.1016/j.anifeedsci.2011.04.070  0.64
2011 Kim HS, Kam DW, Kim WS, Koo HJ. Synthesis of the LiFePO4 by a solid-state reaction using organic acids as a reducing agent Ionics. 17: 293-297. DOI: 10.1007/s11581-011-0518-6  0.52
2010 Shim J, Kam DG, Kwon JH, Kim J. Circuital modeling and measurement of shielding effectiveness against oblique incident plane wave on apertures in multiple sides of rectangular enclosure Ieee Transactions On Electromagnetic Compatibility. 52: 566-577. DOI: 10.1109/TEMC.2009.2039483  0.36
2010 Reynolds SK, Natarajan AS, Tsai MD, Nicolson S, Zhan JHC, Liu D, Kam DG, Huang O, Valdes-Garcia A, Floyd BA. A 16-element phased-array receiver IC for 60-GHz communications in SiGe BiCMOS Digest of Papers - Ieee Radio Frequency Integrated Circuits Symposium. 461-464. DOI: 10.1109/RFIC.2010.5477306  0.36
2010 Valdes-Garcia A, Nicolson ST, Lai JW, Natarajan A, Chen PY, Reynolds SK, Zhan JHC, Kam DG, Liu D, Floyd B. A fully integrated 16-element phased-array transmitter in SiGe BiCMOS for 60-GHz communications Ieee Journal of Solid-State Circuits. 45: 2757-2773. DOI: 10.1109/JSSC.2010.2074951  0.36
2010 Kim K, Cho YH, Kam D, Kim HS, Lee JW. Effects of organic acids as reducing agents in the synthesis of LiFePO 4 Journal of Alloys and Compounds. 504: 166-170. DOI: 10.1016/j.jallcom.2010.05.078  0.52
2009 Kash JA, Pepeljugoski P, Doany FE, Schow CL, Kuchta DM, Schares L, Budd R, Libsch F, Dangel R, Horst F, Offrein BJ, Vlasov Y, Green W, Xia F, Baks CW, ... ... Kam DG, et al. Communication technologies for exascale systems Proceedings of Spie - the International Society For Optical Engineering. 7221. DOI: 10.1117/12.815329  0.36
2009 Kam DG, Ritter MB, Beukema TJ, Bulzacchelli JF, Pepeljugoski PK, Kwark YH, Shan L, Gu X, Baks CW, John RA, Hougham G, Schuster C, Rimolo-Donadio R, Wu B. Is 25 Gb/s on-board signaling viable? Ieee Transactions On Advanced Packaging. 32: 328-344. DOI: 10.1109/TADVP.2008.2011138  0.36
2009 Kam D, Kim K, Kim HS, Liu HK. Studies on film formation on cathodes using pyrazole derivatives as electrolyte additives in the Li-ion battery Electrochemistry Communications. 11: 1657-1660. DOI: 10.1016/j.elecom.2009.06.020  0.52
2008 Kim G, Kam DG, Lee SJ, Kim J, Ha M, Koo K, Pak JS. Modeling of eye-diagram distortion and data-dependent jitter in meander delay lines on high-speed Printed Circuit Boards (PCBs) based on a time-domain even-mode and odd-mode analysis Ieee Transactions On Microwave Theory and Techniques. 56: 1962-1972. DOI: 10.1109/TMTT.2008.927543  0.36
2008 Kam DG, Kim J. 40-Gb/s package design using wire-bonded plastic ball grid array Ieee Transactions On Advanced Packaging. 31: 258-266. DOI: 10.1109/TADVP.2008.923381  0.36
2008 Kam DG, Beukema TJ, Kwark YH, Shan L, Gu X, Pepeljugoski PK, Ritter MB. Multi-level signaling in high-density, high-speed electrical links International Engineering Consortium - Designcon 2008. 1115-1135.  0.36
2007 Choi J, Kam DG, Chung D, Srinivasan K, Govind V, Kim J, Swaminathan M. Near-field and far-field analyses of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications Ieee Transactions On Advanced Packaging. 30: 180-190. DOI: 10.1109/TADVP.2007.896921  0.36
2007 Kam DG, Kim J. Multiport measurement method using a two-port network analyzer with remaining ports unterminated Ieee Microwave and Wireless Components Letters. 17: 694-696. DOI: 10.1109/LMWC.2007.903467  0.36
2007 Song E, Lee J, Kim J, Kam DG, Ryu C. Estimation of data-dependent jitter using single pulse analysis method in high-speed differential signaling Estc 2006 - 1st Electronics Systemintegration Technology Conference. 2: 741-746. DOI: 10.1109/ESTC.2006.280094  0.36
2007 Hwang SW, Lee DH, Shin CH, Tokashiki K, Min GJ, Kang CJ, Cho HK, Moon JT, Lee J, Jeon Y, Lee Y, Kam D. Development and evaluation of highly efficient neutral beam source Surface and Coatings Technology. 201: 8601-8605. DOI: 10.1016/j.surfcoat.2006.01.084  0.64
2007 Kam DG, Kim J. Discontinuity cancellation to boost package bandwidth up to material's limitations - 40 Gbps package design using wire-bonded PBGA Proceedings - 2007 International Symposium On Microelectronics, Imaps 2007. 224-231.  0.36
2006 Park J, Kim H, Jeong Y, Kim J, Pak JS, Kam DG. Modeling and measurement of simultaneous switching noise coupling through signal via transition Ieee Transactions On Advanced Packaging. 29: 548-559. DOI: 10.1109/TADVP.2006.872996  0.36
2006 Kam DG, Kim J, Yu J, Choi H, Bae K, Lee C. Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array Ieee Design and Test of Computers. 23: 212-219. DOI: 10.1109/MDT.2006.78  0.36
2006 Kim G, Kam DG, Kim J. TDR/TDT analysis by crosstalk in single and differential meander delay lines for high speed PCB applications Ieee International Symposium On Electromagnetic Compatibility. 3: 657-662.  0.36
2005 Kim J, Kam DG, Jun PJ. Spread spectrum clock generator with delay cell array to reduce electromagnetic interference Ieee Transactions On Electromagnetic Compatibility. 47: 908-920. DOI: 10.1109/TEMC.2005.859063  0.36
2005 Lee H, Hong YS, Kam DG, Kim J. Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole Ieee Transactions On Advanced Packaging. 28: 168-173. DOI: 10.1109/TADVP.2005.846949  0.36
2005 Choi J, Kam DG, Chung D, Srinivasan K, Govind V, Kim J, Swaminathan M. Near field and far field analysis of Alternating Impedance Electromagnetic Bandgap (AI-EBG) structure for mixed-signal applications Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 2005: 69-72. DOI: 10.1109/EPEP.2005.1563703  0.36
2005 Song E, Lee J, Kim J, Kam DG, Ryu C. Data-dependent jitter estimation using single pulse analysis method Proceedings of 7th Electronics Packaging Technology Conference, Eptc 2005. 2: 810-813.  0.36
2005 Park H, Kim H, Kam DG, Kim J. Co-modeling and co-simulation of package and on-chip decoupling capacitor for resonant free power/ground network design Proceedings - Electronic Components and Technology Conference. 1: 727-731.  0.36
2004 Kam DG, Lee H, Kim J. Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission Ieee Transactions On Advanced Packaging. 27: 590-596. DOI: 10.1109/TADVP.2004.831838  0.36
2004 Kim G, Kam DG, Chung D, Kim J. Chip-package co-design of power distribution network for system-in-package applications Proceedings of 6th Electronics Packaging Technology Conference, Eptc 2004. 499-501.  0.36
2004 Kim J, Kam DG. Spread spectrum clock generator with delay cell array to reduce the EMI from a high-speed digital system Ieee International Symposium On Electromagnetic Compatibility. 3: 820-825.  0.36
2003 Kam DG, Lee H, Kim J. A new twisted differential line structure on high-speed printed circuit boards to enhance immunity to crosstalk and external noise Ieee Microwave and Wireless Components Letters. 13: 411-413. DOI: 10.1109/LMWC.2003.815181  0.36
2003 Kam DG, Kim J, Jun P. Suppressed carrier clock for reduction of electromagnetic radiated emission from high-speed digital system Ieee International Symposium On Electromagnetic Compatibility. 1: 394-397.  0.36
2002 Kam DG, Lee H, Ryu W, Kim J, Park B. An evaluation of differential impedance in PCBs using two single-ended probes only Proceedings - 6th Ieee Workshop On Signal Propagation On Interconnects, Spi. 169-171. DOI: 10.1109/SPI.2002.258307  0.36
2002 Lee H, Park C, Kam D, Kim J. Unit-cell modeling of high-speed interconnect with adjacent metal-filled via array using FDTD method Proceedings - 6th Ieee Workshop On Signal Propagation On Interconnects, Spi. 41-43. DOI: 10.1109/SPI.2002.258271  0.36
2002 Baek S, Park BC, Kam DG, Kim J. Over GHz frequency model of commercial 2mm hard metric connector using on-board calibration standards Proceedings of 4th Electronics Packaging Technology Conference, Eptc 2002. 189-193. DOI: 10.1109/EPTC.2002.1185666  0.36
2002 Kam DG, Ahn S, Baek S, Park B, Sung M, Kim J. A novel twisted differential line for high-speed on-chip interconnections with reduced crosstalk Proceedings of 4th Electronics Packaging Technology Conference, Eptc 2002. 180-183. DOI: 10.1109/EPTC.2002.1185664  0.36
2002 Kam DG, Kim J. A novel twisted differential line on PCB: Crosstalk model and its application to high-speed interconnect circuit design Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 2002: 153-156. DOI: 10.1109/EPEP.2002.1057904  0.36
2002 Baek S, Kam DG, Park B, Kim J, Byun JG, Choi CS. Increased radiated emission and impedance change by edge placement of high-speed differential lines on printed circuit board Ieee International Symposium On Electromagnetic Compatibility. 1: 200-204.  0.36
2002 Kam DG, Lee H, Baek S, Park B, Kim J. Enhanced immunity against crosstalk and EMI using GHz twisted differential line structure on PCB Ieee International Symposium On Electromagnetic Compatibility. 2: 643-647.  0.36
2002 Kam DG, Lee H, Baek S, Park B, Kim J. GHz twisted differential line structure on printed circuit board to minimize EMI and crosstalk noises Proceedings - Electronic Components and Technology Conference. 1058-1065.  0.36
2000 Ryu W, Lee J, Kim H, Ahn S, Kim N, Choi B, Kam D, Kim J. RF interconnect for multi-Gbit/s board-level clock distribution Ieee Transactions On Advanced Packaging. 23: 398-407.  0.36
Show low-probability matches.