Wei Che, Ph.D.
Affiliations: | 2005 | Iowa State University, Ames, IA, United States |
Area:
Mechanical Engineering, Applied MechanicsGoogle:
"Wei Che"Parents
Sign in to add mentorAbhijit Chandra | grad student | 2005 | Iowa State | |
(Synergy between chemical dissolution and mechanical abrasion during chemical mechanical polishing of copper.) |
BETA: Related publications
See more...
Publications
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
Bastawros A, Che W, Chandra A. (2008) Measurement of ultrathin film mechanical properties by integrated nanoscratch/indentation approach Materials Research Society Symposium Proceedings. 1049: 57-62 |
Bastawros A, Che W, Chandra A. (2007) Measurement of Ultrathin Film Mechanical Properties by Integrated Nano-scratch/indentation Approach Mrs Proceedings. 1049 |
Che W, Bastawros A, Chandra A. (2006) Surface evolution during the chemical mechanical planarization of copper Cirp Annals - Manufacturing Technology. 55: 605-608 |
Che W, Guo Y, Chandra A, et al. (2005) A scratch intersection model of material removal during Chemical Mechanical Planarization (CMP) Journal of Manufacturing Science and Engineering, Transactions of the Asme. 127: 545-554 |
Che W, Bastawros A, Chandra A. (2005) Synergy between chemical dissolution and mechanical abrasion during chemical mechanical polishing of copper Materials Research Society Symposium Proceedings. 867: 275-280 |
Che W, Bastawros A, Chandra A. (2005) Synergy between chemical dissolution and mechanical abrasion during chemical mechanical polishing of copper Materials Research Society Symposium Proceedings. 867: 275-280 |
Che W, Guo Y, Chandra A, et al. (2003) Mechanistic Understanding of Material Detachment During Micro-Scale Polishing Journal of Manufacturing Science and Engineering. 125: 731-735 |
Che W, Guo Y, Bastawros A, et al. (2002) Mechanistic understanding of material detachment during CMP processing Materials Research Society Symposium Proceedings. 732: 90-95 |