Joshua B. Bostwick, Ph.D.
Affiliations: | 2011 | Cornell University, Ithaca, NY, United States |
Area:
Mechanical Engineering, Applied Mechanics, Applied MathematicsGoogle:
"Joshua Bostwick"Parents
Sign in to add mentorPaul Steen | grad student | 2011 | Cornell | |
(Stability of constrained capillary interfaces.) |
Children
Sign in to add traineeXingchen Shao | grad student | 2016-2020 | Clemson University |
Saiful Islam Tamim | grad student | 2017-2021 | Clemson University |
Dingqian Ding | grad student | 2020-2024 | Clemson University |
BETA: Related publications
See more...
Publications
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
Ludwicki JM, Kern VR, McCraney J, et al. (2022) Is contact-line mobility a material parameter? Npj Microgravity. 8: 6 |
Tamim SI, Bostwick JB. (2021) Oscillations of a soft viscoelastic drop. Npj Microgravity. 7: 42 |
Raihan MK, Jagdale PP, Wu S, et al. (2021) Flow of Non-Newtonian Fluids in a Single-Cavity Microchannel. Micromachines. 12 |
Bevilacqua G, Shao X, Saylor JR, et al. (2020) Faraday waves in soft elastic solids. Proceedings. Mathematical, Physical, and Engineering Sciences. 476: 20200129 |
Shao X, Fredericks SA, Saylor JR, et al. (2020) A method for determining surface tension, viscosity, and elasticity of gels via ultrasonic levitation of gel drops. The Journal of the Acoustical Society of America. 147: 2488 |
Jagdale PP, Li D, Shao X, et al. (2020) Fluid Rheological Effects on the Flow of Polymer Solutions in a Contraction-Expansion Microchannel. Micromachines. 11 |
Tamim SI, Bostwick JB. (2020) A dynamic analysis of the Rayleigh–Taylor instability in soft solids Extreme Mechanics Letters. 40: 100940 |
Shao X, Fredericks SA, Saylor JR, et al. (2019) Elastocapillary Transition in Gel Drop Oscillations. Physical Review Letters. 123: 188002 |
Tamim SI, Bostwick JB. (2019) The elastic Rayleigh drop. Soft Matter. 15: 9244-9252 |
Maassen KF, Brown JS, Choi H, et al. (2019) Acoustic analysis of ultrasonic assisted soldering for enhanced adhesion. Ultrasonics. 101: 106003 |