Timothy O. Drews, Ph.D.
Affiliations: | 2004 | University of Illinois, Urbana-Champaign, Urbana-Champaign, IL |
Area:
Chemical Engineering, Materials Science EngineeringGoogle:
"Timothy Drews"Parents
Sign in to add mentor| Richard D. Braatz | grad student | 2004 | UIUC | |
| (Multiscale simulations of nanofabricated structures: Application to copper electrodeposition for electronic devices.) | ||||
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Publications
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| Drews TO, Braatz RD, Alkire RC. (2007) Monte Carlo simulation of kinetically limited electrodeposition on a surface with metal seed clusters Zeitschrift Fur Physikalische Chemie. 221: 1287-1305 |
| Rusli E, Xue F, Drews TO, et al. (2007) Effect of Additives on Shape Evolution during Electrodeposition Journal of the Electrochemical Society. 154: D584 |
| Li X, Drews TO, Rusli E, et al. (2007) Erratum: Effect of Additives on Shape Evolution during Electrodeposition: I. Multiscale Simulation with Dynamically Coupled Kinetic Monte Carlo and Moving-Boundary Finite-Volume Codes [J. Electrochem. Soc., 154, D230 (2007)] Journal of the Electrochemical Society. 154: S15 |
| Li X, Drews TO, Rusli E, et al. (2007) Effect of additives on shape evolution during electrodeposition Journal of the Electrochemical Society. 154 |
| Drews TO, Tsapatsis M. (2007) Model of the evolution of nanoparticles to crystals via an aggregative growth mechanism Microporous and Mesoporous Materials. 101: 97-107 |
| Drews TO, Radisic A, Erlebacher J, et al. (2006) Stochastic simulation of the early stages of kinetically limited electrodeposition Journal of the Electrochemical Society. 153 |
| Braatz RD, Alkire RC, Seebauer E, et al. (2006) Perspectives on the design and control of multiscale systems Journal of Process Control. 16: 193-204 |
| Rusli E, Drews TO, Ma DL, et al. (2006) Robust nonlinear feedback-feedforward control of a coupled kinetic Monte Carlo-finite difference simulation Journal of Process Control. 16: 409-417 |
| Braatz RD, Alkire RC, Seebauer EG, et al. (2006) A multiscale systems approach to microelectronic processes Computers and Chemical Engineering. 30: 1643-1656 |
| Drews TO, Krishnan S, Alameda JC, et al. (2005) Multiscale simulations of copper electrodeposition onto a resistive substrate Ibm Journal of Research and Development. 49: 49-63 |