Children
Sign in to add trainee| Nailong Zhang | grad student | 2015 | Wayne State |
| Wujun Si | grad student | 2018 | Wayne State |
| Mohammad Aminisharifabad | grad student | 2019 | Wayne State |
BETA: Related publications
See more...
Publications
|
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
| Li X, Yang Q, Wang Y, et al. (2021) Development of surrogate models in reliability-based design optimization: A review. Mathematical Biosciences and Engineering : Mbe. 18: 6386-6409 |
| Ding Y, Yang Q, King CB, et al. (2019) A General Accelerated Destructive Degradation Testing Model for Reliability Analysis Ieee Transactions On Reliability. 68: 1272-1282 |
| Zhang N, Yang Q, Kelleher A, et al. (2019) A new mixture cure model under competing risks to score online consumer loans Quantitative Finance. 19: 1243-1253 |
| Si W, Yang Q, Wu X. (2019) Material Degradation Modeling and Failure Prediction Using Microstructure Images Technometrics. 61: 246-258 |
| Aminisharifabad M, Yang Q, Wu X. (2019) A penalized autologistic regression with application for modeling the microstructure of dual-phase high-strength steel Journal of Quality Technology. 1-14 |
| Si W, Yang Q, Monplaisir L, et al. (2018) Reliability Analysis of Repairable Systems With Incomplete Failure Time Data Ieee Transactions On Reliability. 67: 1043-1059 |
| Si W, Yang Q, Wu X, et al. (2018) Reliability analysis considering dynamic material local deformation Journal of Quality Technology. 50: 183-197 |
| Si W, Love E, Yang Q. (2018) Two-state optimal maintenance planning of repairable systems with covariate effects Computers & Operations Research. 92: 17-25 |
| Si W, Yang Q. (2017) Accelerated Life Testing With Semiparametric Modeling of Stress Effects Ieee Transactions On Reliability. 66: 989-996 |
| Yang Q, Hong Y, Zhang N, et al. (2017) A Copula-Based Trend-Renewal Process Model for Analysis of Repairable Systems With Multitype Failures Ieee Transactions On Reliability. 66: 590-602 |