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Taeyun Kim, Ph.D. - Publications

Affiliations: 
2003 North Carolina State University, Raleigh, NC 
Area:
Ferroelectrics, Thin Film Oxides
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8 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2008 Zohni O, Buckner G, Kim T, Kingon A, Maranchi J, Siergiej R. Effects of adhesion layers on the ferroelectric properties of lead zirconium titanate thin films deposited on silicon nitride coated silicon substrates Thin Solid Films. 516: 6052-6057. DOI: 10.1016/J.Tsf.2007.10.130  0.586
2007 Zohni O, Buckner G, Kim T, Kingon A, Maranchi J, Siergiej R. Investigating thin film stresses in stacked silicon dioxide/silicon nitride structures and quantifying their effects on frequency response Journal of Micromechanics and Microengineering. 17: 1042-1051. DOI: 10.1088/0960-1317/17/5/026  0.551
2007 Kim T, Kingon AI, Maria JP, Croswell RT. Lead zirconate titanate thin film capacitors on electroless nickel coated copper foils for embedded passive applications Thin Solid Films. 515: 7331-7336. DOI: 10.1016/J.Tsf.2007.02.085  0.647
2006 Kim T, Kingon AI, Maria JP, Croswell RT. Electrical properties of lead zirconate titanate thin films with a ZrO 2 buffer layer on an electroless Ni-coated Cu foil Journal of the American Ceramic Society. 89: 3426-3430. DOI: 10.1111/J.1551-2916.2006.01240.X  0.64
2006 Kim T, Hanson JN, Gruverman A, Kingon AI, Streiffer SK. Ferroelectric behavior in nominally relaxor lead lanthanum zirconate titanate thin films prepared by chemical solution deposition on copper foil Applied Physics Letters. 88. DOI: 10.1063/1.2217254  0.573
2005 Kim T, Srinivasan S, Kingon AI. PZT and PLZT thin films on Cu substrates for dielectric and piezoelectric applications: Effect of processing atmosphere and film strain Mrs Proceedings. 902. DOI: 10.1557/Proc-0902-T02-05  0.554
2004 Kim T, Nath J, Wilson J, Mick S, Franzon PD, Steer MB, Kingon AI. A High K Nanocomposite for High Density Chip-to-Package Interconnections Mrs Proceedings. 833. DOI: 10.1557/Proc-833-G5.9  0.523
2004 Kim T, Kingon AI, Maria JP, Croswell RT. Ca-doped lead zirconate titanate thin film capacitors on base metal nickel on copper foil Journal of Materials Research. 19: 2841-2848. DOI: 10.1557/Jmr.2004.0387  0.627
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