Yinfeng Zong, Ph.D. - Publications
Affiliations: | 2005 | University of Massachusetts, Amherst, Amherst, MA |
Year | Citation | Score | |||
---|---|---|---|---|---|
2005 | Zong Y, Watkins JJ. Deposition of copper by the H2-assisted reduction of Cu(tmod)2 in supercritical carbon dioxide: Kinetics and reaction mechanism Chemistry of Materials. 17: 560-565. DOI: 10.1021/Cm048665D | 0.585 | |||
2004 | Zong Y, Shan X, Watkins JJ. Sacrificial adhesion promotion layers for copper metallization of device structures. Langmuir : the Acs Journal of Surfaces and Colloids. 20: 9210-6. PMID 15461508 DOI: 10.1021/La048731Q | 0.601 | |||
2004 | Zong Y, Watkins JJ. The influence of temperature and concentration on copper deposition kinetics in supercritical carbon dioxide Materials Research Society Symposium Proceedings. 812: 267-272. DOI: 10.1557/Proc-812-F8.6 | 0.557 | |||
2004 | Zong Y, Shan X, Watkins JJ. Sacrificial adhesion promotion layer for cu deposition in supercritical carbon dioxide Advanced Metallization Conference (Amc). 633-637. | 0.608 | |||
2004 | Zong Y, Watkins JJ. Kinetics of Cu deposition by the hydrogen reduction of Cu (II)(tmod) 2 in supercritical CO 2 Advanced Metallization Conference (Amc). 353-358. | 0.53 | |||
2001 | Blackburn JM, Cabanas A, Zong Y, Quinn JD, Watkins JJ. Reactive deposition of device quality conformal copper films from supercritical CO2 Advanced Metallization Conference (Amc). 177-183. | 0.58 | |||
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