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Annie T. Huang, Ph.D. - Publications

Affiliations: 
2006 University of California, Los Angeles, Los Angeles, CA 
Area:
3D IC packaging and joule heating, metal-silicon interfaces, electromigration, pb-free solder joints
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2 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2006 Huang AT, Tu KN, Lai YS. Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints Journal of Applied Physics. 100. DOI: 10.1063/1.2227621  0.406
2006 Huang AT, Gusak AM, Tu KN, Lai YS. Thermomigration in SnPb composite flip chip solder joints Applied Physics Letters. 88. DOI: 10.1063/1.2192694  0.398
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