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Nurrachman C. Liu, Ph.D. - Publications

Affiliations: 
2011 University of Michigan, Ann Arbor, Ann Arbor, MI 
Area:
Electronics and Electrical Engineering

6 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2019 Li L, Yi J, Fang Z, Wang X, Liu N, Chen Y, Liu T, Cao R. Creating Giant Secondary Building Layers via Alkali-Etching Exfoliation for Precise Synthesis of Metal–Organic Frameworks Chemistry of Materials. 31: 7584-7589. DOI: 10.1021/Acs.Chemmater.9B02375  0.383
2013 Dreslinski RG, Fick D, Giridhar B, Kim G, Seo S, Fojtik M, Satpathy S, Lee Y, Kim D, Liu N, Wieckowski M, Chen G, Sylvester D, Blaauw D, Mudge T. Centip3De: A many-core prototype exploring 3d integration and near-threshold computing Communications of the Acm. 56: 97-104. DOI: 10.1145/2524713.2524725  0.656
2013 Dreslinski RG, Fick D, Giridhar B, Kim G, Seo S, Fojtik M, Satpathy S, Lee Y, Kim D, Liu N, Wieckowski M, Chen G, Sylvester D, Blaauw D, Mudge T. Centip3De: A 64-Core, 3D stacked near-threshold system Ieee Micro. 33: 8-16. DOI: 10.1109/Mm.2013.4  0.651
2013 Fick D, Dreslinski RG, Giridhar B, Kim G, Seo S, Fojtik M, Satpathy S, Lee Y, Kim D, Liu N, Wieckowski M, Chen G, Mudge T, Blaauw D, Sylvester D. Centip3De: A cluster-based NTC architecture with 64 ARM cortex-M3 cores in 3D stacked 130 nm CMOS Ieee Journal of Solid-State Circuits. 48: 104-117. DOI: 10.1109/Jssc.2012.2222814  0.653
2009 Hanson S, Seok M, Lin YS, Foo Z, Kim D, Lee Y, Liu N, Sylvester D, Blaauw Dr. D. A low-voltage processor for sensing applications with picowatt standby mode Ieee Journal of Solid-State Circuits. 44: 1145-1155. DOI: 10.1109/Jssc.2009.2014205  0.553
2002 Yin JP, Gao WJ, Hu JJ, Liu NC. Atomic magnetic lattices and their applications Chinese Physics Letters. 19: 327-330. DOI: 10.1088/0256-307X/19/3/313  0.302
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