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Xiaoxiong Gu, Ph.D. - Publications

Affiliations: 
2006 University of Washington, Seattle, Seattle, WA 
Area:
Electronics and Electrical Engineering
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18 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Sadhu B, Valdes-Garcia A, Plouchart J, Ainspan H, Gupta AK, Ferriss M, Yeck M, Sanduleanu M, Gu X, Baks CW, Liu D, Friedman D. A 250-mW 60-GHz CMOS Transceiver SoC Integrated With a Four-Element AiP Providing Broad Angular Link Coverage Ieee Journal of Solid-State Circuits. 55: 1516-1529. DOI: 10.1109/Jssc.2019.2943918  0.328
2019 Gu X, Liu D, Baks C, Tageman O, Sadhu B, Hallin J, Rexberg L, Parida P, Kwark Y, Valdes-Garcia A. Development, Implementation, and Characterization of a 64-Element Dual-Polarized Phased-Array Antenna Module for 28-GHz High-Speed Data Communications Ieee Transactions On Microwave Theory and Techniques. 67: 2975-2984. DOI: 10.1109/Tmtt.2019.2912819  0.334
2016 Wu B, Wang RC, Yang JH, Wu FY, Zhang WL, Gu XP, Zhang AC. Zr and REE mineralization in sodic lujavrite from the Saima alkaline complex, northeastern China: A mineralogical study and comparison with potassic rocks Lithos. 262: 232-246. DOI: 10.1016/j.lithos.2016.07.013  0.357
2013 Gu X, Silberman JA, Young AM, Jenkins KA, Dang B, Liu Y, Duan X, Gordin R, Shlafman S, Goren D. Characterization of TSV-induced loss and substrate noise coupling in advanced three-dimensional CMOS SOI technology Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1917-1925. DOI: 10.1109/Tcpmt.2013.2264755  0.329
2012 Kotzev M, Rimolo-Donadio R, Kwark YH, Baks CW, Gu X, Schuster C. Electrical performance of the recessed probe launch technique for measurement of embedded multilayer structures Ieee Transactions On Instrumentation and Measurement. 61: 3198-3206. DOI: 10.1109/Tim.2012.2211471  0.352
2012 Müller S, Duan X, Kotzev M, Zhang YJ, Fan J, Gu X, Kwark YH, Rimolo-Donadio R, Brüns HD, Schuster C. Accuracy of physics-based via models for simulation of dense via arrays Ieee Transactions On Electromagnetic Compatibility. 54: 1125-1136. DOI: 10.1109/Temc.2012.2192123  0.342
2012 Rimolo-Donadio R, Selli G, De Paulis F, Gu X, Kwark YH, Drewniak JL, Bruens HD, Schuster C. Signal integrity: Efficient, physics-based via modeling: Integration of striplines Ieee Electromagnetic Compatibility Magazine. 1: 74-81. DOI: 10.1109/Memc.2012.6244976  0.335
2011 Gordin R, Goren D, Shlafman S, Elad D, Scheuermann M, Young A, Liu F, Gu X, Tyberg C. Design and modeling methodology of vertical interconnects for 3DI applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 163-167. DOI: 10.1109/Tcpmt.2010.2101751  0.349
2011 Wu B, Gu X, Tsang L, Ritter MB. Electromagnetic modeling of massively coupled through silicon vias for 3D interconnects Microwave and Optical Technology Letters. 53: 1204-1206. DOI: 10.1002/Mop.26021  0.594
2010 Tsang L, Braunisch H, Ding R, Gu X. Random Rough Surface Effects on Wave Propagation in Interconnects Ieee Transactions On Advanced Packaging. 33: 839-856. DOI: 10.1109/Tadvp.2010.2089789  0.636
2009 Rimolo-Donadio R, Gu X, Kwark YH, Ritter MB, Archambeault B, Paulis Fd, Zhang Y, Fan J, Bruns H-, Schuster C. Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz Ieee Transactions On Microwave Theory and Techniques. 57: 2072-2083. DOI: 10.1109/Tmtt.2009.2025470  0.39
2009 Kam DG, Ritter MB, Beukema TJ, Bulzacchelli JF, Pepeljugoski PK, Kwark YH, Shan L, Gu X, Baks CW, John RA, Hougham G, Schuster C, Rimolo-Donadio R, Wu B. Is 25 Gb/s on-board signaling viable? Ieee Transactions On Advanced Packaging. 32: 328-344. DOI: 10.1109/Tadvp.2008.2011138  0.47
2008 Ong C, Wu B, Tsang L, Gu X. Full-Wave Solver for Microstrip Trace and Through-Hole Via in Layered Media Ieee Transactions On Advanced Packaging. 31: 292-302. DOI: 10.1109/Tadvp.2008.920374  0.566
2007 Gu X, Tsang L, Braunisch H. Modeling Effects of Random Rough Interface on Power Absorption Between Dielectric and Conductive Medium in 3-D Problem Ieee Transactions On Microwave Theory and Techniques. 55: 511-517. DOI: 10.1109/Tmtt.2007.891689  0.526
2007 Gu X, Tsang L, Braunisch H. Estimation of Roughness-Induced Power Absorption From Measured Surface Profile Data Ieee Microwave and Wireless Components Letters. 17: 486-488. DOI: 10.1109/Lmwc.2006.899296  0.508
2007 Gu X. Scattering and absorption of electromagnetic waves on a plane with hemispherical bosses Microwave and Optical Technology Letters. 49: 2681-2686. DOI: 10.1002/Mop.22855  0.363
2006 Tsang L, Gu X, Braunisch H. Effects of random rough surface on absorption by conductors at microwave frequencies Ieee Microwave and Wireless Components Letters. 16: 221-223. DOI: 10.1109/Lmwc.2006.872109  0.501
2006 Gu X, Tsang L, Braunisch H, Xu P. Modeling absorption of rough interface between dielectric and conductive medium Microwave and Optical Technology Letters. 49: 7-13. DOI: 10.1002/Mop.22023  0.547
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