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Haiying Li - Publications

Affiliations: 
Henkel Corp. 
Area:
Adhesives
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1 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2003 Li H, Jacob K, Wong C. An improvement of thermal conductivity of underfill materials for flip-chip packages Ieee Transactions On Advanced Packaging. 26: 25-32. DOI: 10.1109/Tadvp.2003.811546  0.377
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