Chad B. O'Neal, Ph.D.
Affiliations: | 2004 | University of Arkansas, Little Rock, AR |
Area:
Mechanical Engineering, Electronics and Electrical EngineeringGoogle:
"Chad O'Neal"Parents
Sign in to add mentorAjay Malshe | grad student | 2004 | University of Arkansas | |
(MEMS-based nanomechanical machining system -on -a -chip: Design, fabrication, and functional testing for feasibility.) |
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Publications
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Cole Z, McGee B, Stabach J, et al. (2015) A high temperature, high power density package for SiC and GaN power devices Imaps International Conference On High Temperature Electronics Network, Hiten 2015. 208-213 |
O'Neal CB, Passmore B, Feurtado M, et al. (2014) Temperature dependence of high dielectric strength potting materials for medium voltage power modules International Conference and Exhibition On High Temperature Electronics, Hitec 2014. 355-361 |
O'Neal CB, Malshe AP, Schmidt WF, et al. (2009) Effects of die attachment induced stress on the reliability of a packaged MEMS device Journal of Microelectronics and Electronic Packaging. 6: 164-171 |
Raut B, Chambers DK, O'Neal CB, et al. (2006) Reactive ion etching of light emitting MEH-PPV and conducting PEDOT:PSS polymer materials American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp |
Mohan A, O'Neal CB, Malshe AP, et al. (2005) A wafer-level packaging approach for MEMS & related microsystems using selective Laser-Assisted Bonding (LAB) Proceedings - Electronic Components and Technology Conference. 2: 1099-1102 |
Spencer D, Malshe AP, Foster RB, et al. (2003) Novel Method for Wafer-Scale Packaging of Opto-electronic Devices Proceedings of Spie - the International Society For Optical Engineering. 5288: 708-713 |
O'Neal CB, Malshe AP, Virwani K, et al. (2002) Design consideration, process and mechanical modeling, and tolerance analysis of a MEMS-based mechanical machining system-on-a-chip (SOAC) for nanomanufacturing American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 2: 529-534 |
O'Neal CB, Malshe AP, Virwani K, et al. (2002) Design consideration, process and mechanical modeling, and tolerance analysis of a MEMS-based mechanical machining system-on-a-chip (SOAC) for nanomanufacturing American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 2: 529-534 |
O'Neal CB, Malshe AP, Schmidt WF, et al. (2001) A study of the effects of packaging induced stress on the reliability of the sandia MEMS microengine Advances in Electronic Packaging. 1: 129-135 |
O'Neal CB, Malshe AP, Eaton WP. (2000) Effect of storage life and drive signals on the reliability of the Sandia Microengine Proceedings of Spie. 4180: 123-132 |