Robert B. Talevi, Ph.D.
Affiliations: | 2000 | State University of New York, Albany, Albany, NY, United States |
Area:
Condensed Matter Physics, Materials Science EngineeringGoogle:
"Robert Talevi"Parents
Sign in to add mentor| Alain E. Kaloyeros | grad student | 2000 | SUNY Albany | |
| (Development of an aluminum/0.5 wt. % copper all-CVD process with results of integration with benzocylobutene (BCB) for the 0.25 micrometer generation and beyond.) | ||||
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| Talevi R, Gundlach H, Bian Z, et al. (2000) Material and process studies in the integration of plasma-promoted chemical-vapor deposition of aluminum with benzocyclobutene low-dielectric constant polymer Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 18: 252-261 |
| Faltermeier J, Knorr A, Talevi R, et al. (1997) Integrated plasma-promoted chemical vapor deposition route to aluminum interconnect and plug technologies for emerging computer chip metallization Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 15: 1758-1766 |
| Knorr A, Faltermeier J, Talevi R, et al. (1996) Metal CVD Technology for ULSI Applications: The Aluminum Route The Japan Society of Applied Physics. 1996: 109-111 |