Oscar van der Straten, Ph.D.
Affiliations: | 2005 | State University of New York, Albany, Albany, NY, United States |
Area:
Condensed Matter PhysicsGoogle:
"Oscar van der Straten"Parents
Sign in to add mentor| Alain E. Kaloyeros | grad student | 2005 | SUNY Albany | |
| (Atomic layer deposition of tantalum nitride liner and indium surfactant materials for applications in nanoscale copper interconnect technology.) | ||||
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Publications
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| Motoyama K, Van Der Straten O, Maniscalco J, et al. (2013) PVD Cu reflow seed process optimization for defect reduction in nanoscale Cu/Low-k dual damascene interconnects Journal of the Electrochemical Society. 160 |
| Kelly J, Lin X, Nogami T, et al. (2013) Electrodeposited Cu film morphology on thin PVD Cu seed layers Journal of the Electrochemical Society. 160 |
| Kelly J, Lin X, Nogami T, et al. (2013) Electrodeposited Cu film morphology on thin PVD Cu seed layers Ecs Transactions. 58: 17-28 |
| Bolom T, Lee JY, Zhang X, et al. (2013) Electrical properties and reliability of ALD TaN barrier for sub-90nmPitch Cu interconnects Advanced Metallization Conference (Amc). 1-6 |
| Kelly J, Nogami T, Van Der Straten O, et al. (2012) Electrolyte additive chemistry and feature size-dependent impurity incorporation for Cu interconnects Journal of the Electrochemical Society. 159: D563-D569 |
| Motoyama K, Van Der Straten O, Tomizawa H, et al. (2012) Novel Cu reflow seed process for Cu/low-k 64nm pitch dual damascene interconnects and beyond 2012 Ieee International Interconnect Technology Conference, Iitc 2012 |
| Chen JHC, Waskiewicz C, Fan SSC, et al. (2012) 56 nm pitch copper dual-damascene interconnects with triple pitch split metal and double pitch split via 2012 Ieee International Interconnect Technology Conference, Iitc 2012 |
| Tomizawa H, Chen ST, Horak D, et al. (2011) Robust self-aligned via process for 64nm pitch Dual-Damascene interconnects using pitch split double exposure patterning scheme 2011 Ieee International Interconnect Technology Conference and 2011 Materials For Advanced Metallization, Iitc/Mam 2011 |
| Kaloyeros AE, Eisenbraun ET, Dunn K, et al. (2011) Zero thickness diffusion barriers and metallization liners for nanoscale device applications Chemical Engineering Communications. 198: 1453-1481 |
| Van Der Straten O, Shobha H, Demarest J, et al. (2010) Interactions of metal-organic PEALD TaN with ultra-low k dielectric materials Ecs Transactions. 33: 195-201 |