☰

Fei Ren, Ph.D. - Publications

Affiliations: 
2006 University of California, Los Angeles, Los Angeles, CA 
Area:
3D IC packaging and joule heating, metal-silicon interfaces, electromigration, pb-free solder joints
Tree Info Similar researchers PubMed Report error

6 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2006 Nah JW, Ren F, PaiK KW, Tu KN. Effect of electromigration on mechanical shear behavior of flip chip solder joints Journal of Materials Research. 21: 698-702. DOI: 10.1557/Jmr.2006.0086  0.488
2006 Ren F, Nah J, Tu KN, Xiong B, Xu L, Pang JHL. Electromigration induced ductile-to-brittle transition in lead-free solder joints Applied Physics Letters. 89: 141914. DOI: 10.1063/1.2358113  0.306
2006 Nah JW, Ren F, Tu K, Venk S, Camara G. Electromigration in Pb-free flip chip solder joints on flexible substrates Journal of Applied Physics. 99: 23520. DOI: 10.1063/1.2163982  0.472
2006 Zhang X, Ren F, Goorsky MS, Tu KN. Study of the initial stage of electroless Ni deposition on Si (100) substrates in aqueous alkaline solution Surface and Coatings Technology. 201: 2724-2732. DOI: 10.1016/J.Surfcoat.2006.05.025  0.434
2006 Xu L, Pang JHL, Ren F, Tu KN. Electromigration Effect on Intermetallic Growth and Young's Modulus in SAC Solder Joint Journal of Electronic Materials. 35: 2116-2125. DOI: 10.1007/S11664-006-0321-8  0.335
2005 Yan MY, Suh JO, Ren F, Tu K, Vairagar AV, Mhaisalkar SG, Krishnamoorthy A. Effect of Cu3Sn coatings on electromigration lifetime improvement of Cu dual-damascene interconnects Applied Physics Letters. 87: 211103. DOI: 10.1063/1.2132536  0.47
Show low-probability matches.