Imin Kao - Publications

Affiliations: 
Mechanical Engineering Stony Brook University, Stony Brook, NY, United States 
Area:
Mechanical Engineering, Robotics Engineering

23 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2013 Nishiyama J, Kao I, Kaneko M. IOP measurement using air-puff tonometry: Dynamic modeling of human eyeball with experimental results 2013 10th International Conference On Ubiquitous Robots and Ambient Intelligence, Urai 2013. 134-139. DOI: 10.1109/URAI.2013.6677496  0.523
2013 Zhu X, Chung C, Korach CS, Kao I. Experimental study and modeling of the effect of mixed size abrasive grits on surface topology and removal rate in wafer lapping Wear. 305: 14-22. DOI: 10.1016/J.Wear.2013.05.007  0.664
2012 Chung C, Kao I. Green's function and forced vibration response of damped axially moving wire Jvc/Journal of Vibration and Control. 18: 1798-1808. DOI: 10.1177/1077546311428632  0.578
2012 Ramirez-Alpizar IG, Higashimori M, Kaneko M, Tsai CD, Kao I. Dynamic Nonprehensile Manipulation for Rotating a Thin Deformable Object: An Analogy to Bipedal Gaits Ieee Transactions On Robotics. 28: 607-618. DOI: 10.1109/Tro.2011.2181098  0.615
2011 Chung C, Korach CS, Kao I. Experimental study and modeling of lapping using abrasive grits with mixed sizes Journal of Manufacturing Science and Engineering, Transactions of the Asme. 133. DOI: 10.1115/1.4004137  0.689
2011 Nishiyama J, Tsai CHD, Quigley M, Kao I, Shibata A, Higashimori M, Kaneko M. An experimental study of biologically inspired artificial skin sensor under static loading and dynamic stimuli Proceedings - Ieee International Conference On Robotics and Automation. 1778-1783. DOI: 10.1109/ICRA.2011.5980511  0.514
2011 Chung C, Kao I. Modeling of axially moving wire with damping: Eigenfunctions, orthogonality and applications in slurry wiresaws Journal of Sound and Vibration. 330: 2947-2963. DOI: 10.1016/J.Jsv.2011.01.008  0.591
2011 Cao C, Reiner A, Chung C, Chang SH, Kao I, Kukta RV, Korach CS. Buckling initiation and displacement dependence in compression of vertically aligned carbon nanotube arrays Carbon. 49: 3190-3199. DOI: 10.1016/J.Carbon.2011.03.043  0.595
2010 Tsai CHD, Nishiyama J, Kao I, Higashimori M, Kaneko M. Study of the relationship between the strain and strain rate for viscoelastic contact interface in robotic grasping Ieee/Rsj 2010 International Conference On Intelligent Robots and Systems, Iros 2010 - Conference Proceedings. 592-597. DOI: 10.1109/IROS.2010.5649734  0.516
2010 Bhagavat S, Liberato JC, Chung C, Kao I. Effects of mixed abrasive grits in slurries on free abrasive machining (FAM) processes International Journal of Machine Tools and Manufacture. 50: 843-847. DOI: 10.1016/J.Ijmachtools.2010.04.006  0.747
2009 Chung C, Melendez G, Kao I. Experimental study of lapping using mixed abrasive grits Proceedings of the Asme International Manufacturing Science and Engineering Conference 2009, Msec2009. 1: 729-736. DOI: 10.1115/MSEC2009-84210  0.388
2008 Bhagavat S, Kao I. A finite element analysis of temperature variation in silicon wafers during wiresaw slicing International Journal of Machine Tools and Manufacture. 48: 95-106. DOI: 10.1016/J.Ijmachtools.2007.07.009  0.735
2007 Bhagavat S, Kao I. Ultra-low load multiple indentation response of materials: In purview of wiresaw slicing and other free abrasive machining (FAM) processes International Journal of Machine Tools and Manufacture. 47: 666-672. DOI: 10.1016/J.Ijmachtools.2006.04.015  0.764
2006 Bhagavat S, Kao I. Theoretical analysis on the effects of crystal anisotropy on wiresawing process and application to wafer slicing International Journal of Machine Tools and Manufacture. 46: 531-541. DOI: 10.1016/J.Ijmachtools.2005.07.003  0.747
2005 Xydas N, Tsi D, Gurevich V, Krichever M, Kao I. Dynamic Taguchi methods and parameter design as applied in barcode scanning and scanners Concurrent Engineering Research and Applications. 13: 69-80. DOI: 10.1177/1063293X05050913  0.717
2005 Bhagavat S, Kao I. Nanoindentation of lithium niobate: Hardness anisotropy and pop-in phenomenon Materials Science and Engineering A. 393: 327-331. DOI: 10.1016/J.Msea.2004.11.027  0.739
2005 Zhu L, Kao I. Galerkin-based modal analysis on the vibration of wire-slurry system in wafer slicing using a wiresaw Journal of Sound and Vibration. 283: 589-620. DOI: 10.1016/J.Jsv.2004.04.018  0.411
2005 Bhagavat S, Liberato J, Kao I. Effects of mixed abrasive slurries on free abrasive machining processes Proceedings of the 20th Annual Aspe Meeting, Aspe 2005 0.741
2003 Kao I, Chen SF, Li Y, Wang G. SACST: Smart anthropomorphic contact surface technology Ieee Robotics and Automation Magazine. 10: 47-53. DOI: 10.1109/Mra.2003.1191710  0.728
2000 WEI S, KAO I. VIBRATION ANALYSIS OF WIRE AND FREQUENCY RESPONSE IN THE MODERN WIRESAW MANUFACTURING PROCESS Journal of Sound and Vibration. 231: 1383-1395. DOI: 10.1006/Jsvi.1999.2471  0.5
2000 Xydas N, Kao I. Influence of material properties and fingertip size on the power-law equation for soft fingers Ieee International Conference On Intelligent Robots and Systems. 2: 1285-1290.  0.756
1999 Xydas N, Kao I. Modeling of contact mechanics and friction limit surfaces for soft fingers in robotics, with experimental results International Journal of Robotics Research. 18: 941-950.  0.758
1998 Sahoo RK, Prasad V, Kao I, Talbott J, Gupta KP. Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw Journal of Electronic Packaging, Transactions of the Asme. 120: 35-40.  0.309
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