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Hung-Yun Lin, Ph.D. - Publications

Affiliations: 
2014 Mechanical Engineering Purdue University, West Lafayette, IN, United States 
Area:
Mechanical Engineering, Applied Mechanics
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11 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2018 Song T, Chen C, Subbarayan G, Lin H, Gurrum S. Estimating the Modulus and Yield Strength of the Top-Layer Film on Multilayer BEOL Stacks Ieee Transactions On Device and Materials Reliability. 18: 438-449. DOI: 10.1109/Tdmr.2018.2865904  0.539
2016 Upreti K, Lin HY, Subbarayan G, Jung DY, Sammakia BG. An Assessment of Risk of Fracture during Wirebond over Active Circuits on ULK Dies Ieee Transactions On Components, Packaging and Manufacturing Technology. 6: 314-325. DOI: 10.1109/Tcpmt.2015.2466679  0.574
2016 Song T, Subbarayan G, Lin HY, Gurrum S. Estimation of passivated metal stack modulus through simulations of Micro-indentation Proceedings of the 15th Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2016. 1326-1332. DOI: 10.1109/ITHERM.2016.7517702  0.504
2015 Lin HY, Rayasam M, Subbarayan G. ISOCOMP: Unified geometric and material composition for optimal topology design Structural and Multidisciplinary Optimization. 51: 687-703. DOI: 10.1007/S00158-014-1164-1  0.599
2014 Upreti K, Lin HY, Subbarayan G, Jung DY, Sammakia B. Simulations of damage and fracture in ULK under pad structures during Cu wirebond process Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 609-615. DOI: 10.1109/ITHERM.2014.6892337  0.547
2014 Paranjothy SS, Singh Y, Tippman A, Lin HY, Subbarayan G, Jung DY, Sammakia B. Characterization of cu free air ball constitutive behavior using microscale compression test Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 365-368. DOI: 10.1109/ITHERM.2014.6892303  0.497
2013 Lin HY, Upreti K, Tippmann A, Subbarayan G, Jung DY, Sammakia B. Simulations of deformation and stress during copper wirebond on ULK chips Asme 2013 International Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Microsystems, Interpack 2013. 1. DOI: 10.1115/IPACK2013-73178  0.555
2013 Lin HY, Subbarayan G. Optimal topological design through insertion and configuration of finite-sized heterogeneities International Journal of Solids and Structures. 50: 429-446. DOI: 10.1016/J.Ijsolstr.2012.10.006  0.575
2012 Tambat A, Lin HY, Subbarayan G, Jung DY, Sammakia B. Simulations of damage, crack initiation, and propagation in interlayer dielectric structures: Understanding assembly-induced fracture in dies Ieee Transactions On Device and Materials Reliability. 12: 241-254. DOI: 10.1109/Tdmr.2012.2195006  0.61
2011 Lin HY, Tambat A, Claydon I, Subbarayan G, Jung DY, Sammakia B. Nature of package-induced deformation and the risk of fracture in low-k dielectric stacks Asme 2011 Pacific Rim Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Systems, Interpack 2011. 1: 351-356. DOI: 10.1115/IPACK2011-52258  0.541
2011 Tambat A, Lin HY, Claydon I, Subbarayan G, Jung DY, Sammakia B. Modeling fracture in dielectric stacks due to chip-package interaction: Impact of dielectric material selection Asme 2011 Pacific Rim Technical Conference and Exhibition On Packaging and Integration of Electronic and Photonic Systems, Interpack 2011. 1: 317-323. DOI: 10.1115/IPACK2011-52237  0.566
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