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Patrick McCluskey - Publications

Affiliations: 
Mechanical Engineering University of Maryland, College Park, College Park, MD 
Area:
Mechanical Engineering
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28 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2019 Li NMJ, Das D, McCluskey P. Review of shelf life evaluation methods and a physics of failure approach for shelf life estimation for electronic components Microelectronics Reliability. 99: 152-160. DOI: 10.1016/J.Microrel.2019.05.022  0.413
2019 Manoharan S, Patel C, Dunford S, Beshears J, McCluskey P. Life prediction of copper wire bonds in commercial devices using principal component analysis (PCA) Microelectronics Reliability. 99: 137-151. DOI: 10.1016/J.Microrel.2019.05.013  0.435
2018 Greve H, Moeini SA, McCluskey P, Joshi S. Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermomechanical Simulation Journal of Electronic Packaging. 140: 20903. DOI: 10.1115/1.4039265  0.335
2018 Nishimoto S, Moeini SA, Ohashi T, Nagatomo Y, McCluskey P. Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications Microelectronics Reliability. 87: 232-237. DOI: 10.1016/J.Microrel.2018.06.010  0.354
2017 Khanna S, McCluskey P, Bar-Cohen A, Yang B, Ohadi M. Thin Thermally Efficient ICECool Defense Semiconductor Power Amplifiers Journal of Microelectronics and Electronic Packaging. 14: 77-93. DOI: 10.4071/Imaps.456518  0.326
2016 Fish M, McCluskey P, Bar-Cohen A. Modeling thermal microspreading resistance in via arrays Journal of Electronic Packaging, Transactions of the Asme. 138. DOI: 10.1115/1.4032348  0.357
2015 Oh H, Han B, McCluskey P, Han C, Youn BD. Physics-of-failure, condition monitoring, and prognostics of insulated gate bipolar transistor modules: A review Ieee Transactions On Power Electronics. 30: 2413-2426. DOI: 10.1109/Tpel.2014.2346485  0.321
2015 Manno M, Yang B, Khanna S, McCluskey P, Bar-Cohen A. Microcontact-Enhanced Thermoelectric Cooling of Ultrahigh Heat Flux Hotspots Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2015.2495350  0.351
2014 Squiller D, Mengotti E, McCluskey P. Assessing solder interconnect reliability of control boards in power electronic systems using Physics-of-Failure models Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 1154-1163. DOI: 10.1109/ITHERM.2014.6892410  0.354
2014 Quintero P, McCluskey P, Koene B. Thermomechanical reliability of a silver nano-colloid die attach for high temperature applications Microelectronics Reliability. 54: 220-225. DOI: 10.1016/J.Microrel.2013.08.002  0.329
2013 Wang P, Mccluskey P, Bar-Cohen A. Two-phase liquid cooling for thermal management of igbt power electronic module Journal of Electronic Packaging, Transactions of the Asme. 135. DOI: 10.1115/1.4023215  0.371
2013 Wang P, McCluskey P, Bar-Cohen A. Hybrid solid-and liquid-cooling solution for isothermalization of insulated gate bipolar transistor power electronic devices Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 601-611. DOI: 10.1109/Tcpmt.2012.2227056  0.375
2012 England TD, Diestelhorst RM, Kenyon EW, Cressler JD, Ramachandran V, Alles M, Reed R, Berger R, Garbos R, Blalock B, Mantooth A, Barlow M, Dai F, Johnson W, Ellis C, ... ... McCluskey P, et al. A new approach to designing electronic systems for operation in extreme environments: Part II-The SiGe remote electronics unit Ieee Aerospace and Electronic Systems Magazine. 27: 29-41. DOI: 10.1109/Maes.2012.6328839  0.302
2012 Diestelhorst RM, England TD, Berger R, Garbos R, Ulaganathan C, Blalock B, Cornett K, Mantooth A, Geng X, Dai F, Johnson W, Holmes J, Alles M, Reed R, McCluskey P, et al. A new approach to designing electronic systems for operation in extreme environments: Part i-The SiGe Remote Sensor Interface Ieee Aerospace and Electronic Systems Magazine. 27: 25-34. DOI: 10.1109/Maes.2012.6328550  0.309
2012 Boteler L, Jankowski N, McCluskey P, Morgan B. Numerical investigation and sensitivity analysis of manifold microchannel coolers International Journal of Heat and Mass Transfer. 55: 7698-7708. DOI: 10.1016/J.Ijheatmasstransfer.2012.07.073  0.69
2008 Quintero P, Obere T, McCluskey P. Reliability assessment of high temperature lead-free device attach technologies Proceedings - Electronic Components and Technology Conference. 2131-2138. DOI: 10.1109/ECTC.2008.4550280  0.366
2007 Hansen P, McCluskey P. Failure models in power device interconnects 2007 European Conference On Power Electronics and Applications, Epe. DOI: 10.1109/EPE.2007.4417406  0.433
2007 Wu R, McCluskey P. Packaging reliability of indium attach in SiGe electronic module for space exploration applications Proceedings - 2007 International Symposium On Microelectronics, Imaps 2007. 867-871.  0.432
2003 Meyyappan KN, Hansen P, McCluskey P. Wire fatigue model for power electronic modules American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 3: 257-265. DOI: 10.1115/IMECE2003-42007  0.629
2003 Meyyappan K, McCluskey P, Chen L. Thermomechanical analysis of gold-based SiC die-attach assembly Ieee Transactions On Device and Materials Reliability. 3: 152-158. DOI: 10.1109/Tdmr.2003.821538  0.348
2003 Meyyappan KN, Hansen P, McCluskey P. Wire flexure fatigue model for asymmetric bond height Advances in Electronic Packaging. 1: 769-776.  0.628
2000 McCluskey P, Mensah K, O'Connor C, Gallo A. Reliable use of commercial technology in high temperature environments Microelectronics Reliability. 40: 1671-1678. DOI: 10.1016/S0026-2714(00)00188-8  0.362
1999 Sundararajan R, Azarm S, McCluskey P, Palli N. A Stress Model for Multiobjective Design Optimization of a Power Electronic Module Mechanics of Structures and Machines. 27: 163-183. DOI: 10.1080/08905459908915694  0.445
1999 Sundararajan R, Azarm S, McCluskey P, Palli N. Stress model for multiobjective design optimization of a power electronic module Mechanics of Structures and Machines. 27: 163-183.  0.346
1998 McCluskey P, Lilie F, Beysser O, Gallo A. Low temperature delamination of plastic encapsulated microcircuits Microelectronics Reliability. 38: 1829-1834. DOI: 10.1016/S0026-2714(98)00183-8  0.351
1997 McCluskey P, Munamarty R, Pecht M. Popcorning in PBGA Packages During IR Reflow Soldering Microelectronics International. 14: 20-23. DOI: 10.1108/13565369710800439  0.348
1997 Hakim EB, Fink J, Tam SM, Mccluskey P, Pecht M. Plastic-encapsulated Microcircuits (PEMs): Long-term Dormancy Studies Circuit World. 23: 26-29. DOI: 10.1108/03056129710370286  0.344
1996 Munamarty R, McCluskey P, Pecht M, Yip L. Popcorning in Fully Populated and Perimeter Plastic Ball Grid Array Packages Soldering & Surface Mount Technology. 8: 46-50. DOI: 10.1108/09540919610777591  0.309
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