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Daijiao Wang, Ph.D. - Publications

Affiliations: 
2005 University of Texas at Austin, Austin, Texas, U.S.A. 
Area:
Mechanical Engineering
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3 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2006 Wang D, Panton RL. Experimental Study of Void Formation in Eutectic and Lead-Free Solder Bumps of Flip-Chip Assemblies Journal of Electronic Packaging. 128: 202-207. DOI: 10.1115/1.2229215  0.636
2005 Wang D, Panton RL. Effect of Reversing Heat Flux Direction During Reflow on Void Formation in High-Lead Solder Bumps Journal of Electronic Packaging. 127: 440-445. DOI: 10.1115/1.2070047  0.617
2005 Wang D, Panton RL. Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies Journal of Electronic Packaging. 127: 120-126. DOI: 10.1115/1.1876472  0.628
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