Lei Nie, Ph.D.
Affiliations: | 2010 | Mechanical Engineering | University of Maryland, College Park, College Park, MD |
Area:
Mechanical EngineeringGoogle:
"Lei Nie"Parents
Sign in to add mentor| Michael G. Pecht | grad student | 2010 | University of Maryland | |
| (Temperature cycling reliability of reballed and reworked ball grid array packages in tin-lead and SAC assembly.) | ||||
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Publications
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| Nie L, Kumar A, Zhan S. (2014) Periocular recognition using unsupervised convolutional RBM feature learning Proceedings - International Conference On Pattern Recognition. 399-404 |
| Nie L, Osterman M, Pecht MG. (2010) Microstructural Analysis of Reworked Ball Grid Array Assemblies Under Thermomechanical Loading Conditions Ieee Transactions On Device and Materials Reliability. 10: 276-286 |
| Nie L, Mueller M, Osterman M, et al. (2010) Microstructural Analysis of Reballed Tin-Lead, Lead-Free, and Mixed Ball Grid Array Assemblies Under Temperature Cycling Test Journal of Electronic Materials. 39: 1218-1232 |
| Nie L, Osterman M, Song F, et al. (2009) Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages Ieee Transactions On Components and Packaging Technologies. 32: 901-908 |
| Nie L, Azaruan MH, Keimasi M, et al. (2007) Prognostics of ceramic capacitor temperature-humidity-bias reliability using Mahalanobis distance analysis Circuit World. 33: 21-28 |
| Nie L, Pecht M, Ciocci R. (2007) Regulations and market trends in lead-free and halogen-free electronics Circuit World. 33: 4-9 |