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Zhen Mei, Ph.D. - Publications

Affiliations: 
2001 State University of New York, Buffalo, Buffalo, NY, United States 
Area:
Materials Science Engineering
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12 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2002 Mei Z, Chung DDL. Improving the Flexural Modulus and Thermal Stability of Pitch by the Addition of Silica Fume Journal of Reinforced Plastics and Composites. 21: 91-95. DOI: 10.1106/073168402024284  0.32
2002 Mei Z, Chung DDL. Thermoplastic matrix phase transitions in a carbon fiber composite, studied by contact electrical resistivity measurement of the interface between two unbonded laminae Polymer Composites. 23: 824-827. DOI: 10.1002/Pc.10480  0.435
2002 Mei Z, Guerrero VH, Kowalik DP, Chung DDL. Reverse piezoelectric behavior of carbon fiber thermoplastic‐matrix composite Polymer Composites. 23: 697-701. DOI: 10.1002/Pc.10470  0.381
2002 Mei Z, Guerrero VH, Kowalik DP, Chung DDL. Mechanical damage and strain in carbon fiber thermoplastic‐matrix composite, sensed by electrical resistivity measurement Polymer Composites. 23: 425-432. DOI: 10.1002/Pc.10444  0.447
2001 Mei Z, Chung DDL. Adhesion and Interfaces Involving Polymers, Studied by Electrical Resistance Measurement Mrs Proceedings. 710. DOI: 10.1557/Proc-710-Dd10.8.1  0.476
2001 Wang S, Mei Z, Chung DDL. Interlaminar damage in carbon fiber polymer-matrix composites, studied by electrical resistance measurement International Journal of Adhesion and Adhesives. 21: 465-471. DOI: 10.1016/S0143-7496(01)00023-9  0.548
2001 Mei Z, Chung DDL. Thermal history of carbon-fiber polymer-matrix composite, evaluated by electrical resistance measurement Thermochimica Acta. 369: 87-93. DOI: 10.1016/S0040-6031(00)00735-8  0.492
2000 Mei Z, Chung DDL. Thermal stress-induced thermoplastic composite debonding, studied by contact electrical resistance measurement International Journal of Adhesion and Adhesives. 20: 135-139. DOI: 10.1016/S0143-7496(99)00026-3  0.451
2000 Mei Z, Chung DDL. Kinetics of autohesion of thermoplastic carbon-fiber prepregs International Journal of Adhesion and Adhesives. 20: 173-175. DOI: 10.1016/S0143-7496(99)00023-8  0.45
2000 Mei Z, Chung DDL. Effects of temperature and stress on the interface between concrete and its carbon fiber epoxy-matrix composite retrofit, studied by electrical resistance measurement Cement and Concrete Research. 30: 799-802. DOI: 10.1016/S0008-8846(00)00238-6  0.496
2000 Mei Z, Chung DDL. Glass transition and melting behavior of carbon fiber reinforced thermoplastic composite, studied by electrical resistance measurement Polymer Composites. 21: 711-715. DOI: 10.1002/Pc.10224  0.475
1998 Mei Z, Chung DDL. Effect of heating on the structure of carbon fiber polyphenylenesulfide‐matrix composite, as studied by electrical resistance measurement Polymer Composites. 19: 709-713. DOI: 10.1002/Pc.10144  0.48
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