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Taek-Soo Kim, Ph.D. - Publications

Affiliations: 
Stanford University, Palo Alto, CA 
Area:
biophysics, genomics
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39 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Han Y, Han HJ, Rah Y, Kim C, Kim M, Lim H, Ahn KH, Jang H, Yu K, Kim TS, Cho EN, Jung YS. Desolvation-Triggered Versatile Transfer-Printing of Pure BN Films with Thermal-Optical Dual Functionality. Advanced Materials (Deerfield Beach, Fla.). 32: e2002099. PMID 33617118 DOI: 10.1002/Adma.202002099  0.333
2020 Pan Y, Oh S, Kim J, Kim T, Paik K. A Study on the Dynamic Bending Property of Chip-on-Flex Assembly Using Anchoring Polymer Layer Anisotropic Conductive Films Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 941-948. DOI: 10.1109/Tcpmt.2020.2990404  0.355
2020 Kim G, Lee YW, Ma BS, Kim J, Park JS, Lee S, Nguyen TL, Song M, Kim T, Woo HY, Kim BJ. Triad-type, multi-functional compatibilizers for enhancing efficiency, stability and mechanical robustness of polymer solar cells Journal of Materials Chemistry. 8: 13522-13531. DOI: 10.1039/D0Ta03924A  0.305
2020 Koo J, Lee S, Kim J, Kim DH, Choi B, Kim T, Shim JH. Evaluating mechanical properties of 100nm-thick atomic layer deposited Al2O3 as a free-standing film Scripta Materialia. 187: 256-261. DOI: 10.1016/J.Scriptamat.2020.06.028  0.319
2019 Kim JH, Jang KL, Ahn K, Yoon T, Lee TI, Kim TS. Thermal expansion behavior of thin films expanding freely on water surface. Scientific Reports. 9: 7071. PMID 31068646 DOI: 10.1038/S41598-019-43592-X  0.311
2019 Choi J, Kim W, Kim D, Kim S, Chae J, Choi SQ, Kim FS, Kim T, Kim BJ. Importance of Critical Molecular Weight of Semicrystalline n-Type Polymers for Mechanically Robust, Efficient Electroactive Thin Films Chemistry of Materials. 31: 3163-3173. DOI: 10.1021/Acs.Chemmater.8B05114  0.31
2018 Park IJ, Kim TI, Kang S, Shim GW, Woo Y, Kim TS, Choi SY. Stretchable thin-film transistors with molybdenum disulfide channels and graphene electrodes. Nanoscale. PMID 30109335 DOI: 10.1039/C8Nr03173H  0.33
2018 Kang S, Pyo JB, Kim TS. Layer-by-Layer Assembly of Free-Standing Nanofilms by Controlled Rolling. Langmuir : the Acs Journal of Surfaces and Colloids. PMID 29708348 DOI: 10.1021/Acs.Langmuir.8B01063  0.308
2017 Jang S, Kim C, Park JJ, Jin ML, Kim SJ, Park OO, Kim TS, Jung HT. A High Aspect Ratio Serpentine Structure for Use As a Strain-Insensitive, Stretchable Transparent Conductor. Small (Weinheim An Der Bergstrasse, Germany). PMID 29280274 DOI: 10.1002/Smll.201702818  0.305
2017 Han HJ, Jeong JW, Yang SR, Kim C, Yoo HG, Yoon JB, Park JH, Lee KJ, Kim TS, Kim SW, Jung YS. Nanotransplantation Printing of Crystallographic-Orientation-Controlled Single-Crystalline Nanowire Arrays on Diverse Surfaces. Acs Nano. PMID 29131582 DOI: 10.1021/Acsnano.7B06696  0.306
2017 Oh YS, Choi H, Lee J, Lee H, Choi DY, Lee SU, Yun KS, Yoo S, Kim TS, Park I, Sung HJ. Temperature-Controlled Direct Imprinting of Ag Ionic Ink: Flexible Metal Grid Transparent Conductors with Enhanced Electromechanical Durability. Scientific Reports. 7: 11220. PMID 28894221 DOI: 10.1038/S41598-017-11475-8  0.331
2017 Kim W, Lee I, Yoon Kim D, Yu YY, Jung HY, Kwon S, Seo Park W, Kim TS. Controlled multiple neutral planes by low elastic modulus adhesive for flexible organic photovoltaics. Nanotechnology. 28: 194002. PMID 28422747 DOI: 10.1088/1361-6528/Aa6A44  0.306
2017 Kim HJ, Lee MY, Kim JS, Kim JH, Yu H, Yun H, Liao K, Kim TS, Oh JH, Kim BJ. Solution-Assembled Blends of Regioregularity Controlled Polythiophenes for Coexistence of Mechanical Resilience and Electronic Performance. Acs Applied Materials & Interfaces. PMID 28363015 DOI: 10.1021/Acsami.6B16703  0.34
2017 Rodriquez D, Kim JH, Root SE, Fei Z, Boufflet P, Heeney M, Kim TS, Lipomi DJ. Comparison of Methods for Determining the Mechanical Properties of Semiconducting Polymer Films for Stretchable Electronics. Acs Applied Materials & Interfaces. PMID 28220705 DOI: 10.1021/Acsami.6B16115  0.31
2017 Lee I, Yun JH, Son HJ, Kim TS. Accelerated degradation due to weakened adhesion from Li-TFSI additives in perovskite solar cells. Acs Applied Materials & Interfaces. PMID 28145110 DOI: 10.1021/Acsami.6B14089  0.319
2017 Seo JW, Joo M, Ahn J, Lee TI, Kim TS, Im SG, Lee JY. Facilitated embedding of silver nanowires into conformally-coated iCVD polymer films deposited on cloth for robust wearable electronics. Nanoscale. PMID 28054082 DOI: 10.1039/C6Nr08168A  0.327
2017 Kim J, Lee I, Kim T, Rolston N, Watson BL, Dauskardt RH. Understanding mechanical behavior and reliability of organic electronic materials Mrs Bulletin. 42: 115-123. DOI: 10.1557/Mrs.2017.3  0.309
2017 Kim J, Lee T, Kim T, Paik K. The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 1583-1591. DOI: 10.1109/Tcpmt.2017.2718186  0.332
2017 Kim Y, Yoon T, Kim T, Kim T, Paik K. Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn–Ag Microbump Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 371-378. DOI: 10.1109/Tcpmt.2016.2631540  0.321
2017 Kim J, Noh J, Choi H, Lee J, Kim T. Mechanical Properties of Polymer–Fullerene Bulk Heterojunction Films: Role of Nanomorphology of Composite Films Chemistry of Materials. 29: 3954-3961. DOI: 10.1021/Acs.Chemmater.7B00184  0.316
2017 Lee T, Kim C, Pyo J, Kim MS, Kim T. Effect of anisotropic thermo-elastic properties of woven-fabric laminates on diagonal warpage of thin package substrates Composite Structures. 176: 973-981. DOI: 10.1016/J.Compstruct.2017.06.014  0.323
2016 Park JH, Hwang GT, Kim S, Seo J, Park HJ, Yu K, Kim TS, Lee KJ. Flash-Induced Self-Limited Plasmonic Welding of Silver Nanowire Network for Transparent Flexible Energy Harvester. Advanced Materials (Deerfield Beach, Fla.). PMID 27892631 DOI: 10.1002/Adma.201603473  0.309
2016 Jang S, Jung WB, Kim C, Won P, Lee SG, Cho KM, Jin ML, An CJ, Jeon HJ, Ko SH, Kim TS, Jung HT. A three-dimensional metal grid mesh as a practical alternative to ITO. Nanoscale. PMID 27404907 DOI: 10.1039/C6Nr03060B  0.325
2016 Oh MS, Song YS, Kim CG, Kim J, You JB, Kim TS, Lee CS, Im SG. Control of reversible self-bending behavior in responsive Janus microstrips. Acs Applied Materials & Interfaces. PMID 26974225 DOI: 10.1021/Acsami.5B12704  0.301
2016 Kim T, Lee T, Pan Y, Kim W, Zhang S, Kim T, Paik K. Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly Ieee Transactions On Components, Packaging and Manufacturing Technology. 6: 1317-1329. DOI: 10.1109/Tcpmt.2016.2593046  0.326
2016 Kim YL, Lee TI, Kim JH, Kim W, Kim TS, Paik KW. Effects of the Mechanical Properties of Polymer Resin and the Conductive Ball Types of Anisotropic Conductive Films on the Bending Properties of Chip-in-Flex Package Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2015.2513072  0.362
2016 Kim JH, Lee TI, Shin JW, Kim TS, Paik KW. Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 6: 208-215. DOI: 10.1109/Tcpmt.2015.2513062  0.333
2016 Lee TI, Kim C, Kim MS, Kim TS. Flexural and tensile moduli of flexible FR4 substrates Polymer Testing. 53: 70-76. DOI: 10.1016/J.Polymertesting.2016.05.012  0.336
2015 Eom H, Kim JH, Hur J, Kim TS, Sung SK, Choi JH, Lee E, Jeong JH, Park I. Nanotextured polymer substrate for flexible and mechanically robust metal electrodes by nanoimprint lithography. Acs Applied Materials & Interfaces. PMID 26501554 DOI: 10.1021/Acsami.5B06631  0.35
2015 Kim C, Lee T, Kim MS, Kim T. Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates Polymers. 7: 985-1004. DOI: 10.3390/Polym7060985  0.315
2015 Kim JS, Kim JH, Lee W, Yu H, Kim HJ, Song I, Shin M, Oh JH, Jeong U, Kim TS, Kim BJ. Tuning Mechanical and Optoelectrical Properties of Poly(3-hexylthiophene) through Systematic Regioregularity Control Macromolecules. 48: 4339-4346. DOI: 10.1021/Acs.Macromol.5B00524  0.326
2015 Ko YH, Kim MS, Bang J, Kim TS, Lee CW. Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate Journal of Electronic Materials. 44: 2458-2466. DOI: 10.1007/S11664-015-3781-X  0.309
2014 Kim HJ, Kim JH, Ryu JH, Kim Y, Kang H, Lee WB, Kim TS, Kim BJ. Architectural engineering of rod-coil compatibilizers for producing mechanically and thermally stable polymer solar cells. Acs Nano. 8: 10461-70. PMID 25256674 DOI: 10.1021/Nn503823Z  0.328
2013 Lee YH, Kim JS, Noh J, Lee I, Kim HJ, Choi S, Seo J, Jeon S, Kim TS, Lee JY, Choi JW. Wearable textile battery rechargeable by solar energy. Nano Letters. 13: 5753-61. PMID 24164580 DOI: 10.1021/Nl403860K  0.301
2013 Lee CH, Kim JH, Zou C, Cho IS, Weisse JM, Nemeth W, Wang Q, van Duin AC, Kim TS, Zheng X. Peel-and-stick: mechanism study for efficient fabrication of flexible/transparent thin-film electronics. Scientific Reports. 3: 2917. PMID 24108063 DOI: 10.1038/Srep02917  0.333
2013 Lee J, Lee I, Kim TS, Lee JY. Efficient welding of silver nanowire networks without post-processing. Small (Weinheim An Der Bergstrasse, Germany). 9: 2887-94. PMID 23606676 DOI: 10.1002/Smll.201203142  0.303
2013 Lee J, Lee P, Lee HB, Hong S, Lee I, Yeo J, Lee SS, Kim T, Lee D, Ko SH. Room-Temperature Nanosoldering of a Very Long Metal Nanowire Network by Conducting-Polymer-Assisted Joining for a Flexible Touch-Panel Application Advanced Functional Materials. 23: 4171-4176. DOI: 10.1002/Adfm.201203802  0.347
2009 Kim TS, Chumakov D, Zschech E, Dauskardt RH. Tailoring UV cure depth profiles for optimal mechanical properties of organosilicate thin films Applied Physics Letters. 95. DOI: 10.1063/1.3190198  0.304
2005 Wang H, Li X, Kim T, Kim D. Inorganic polymer-derived tubular SiC arrays from sacrificial alumina templates Applied Physics Letters. 86: 173104. DOI: 10.1063/1.1915510  0.302
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