Alan Lee, Ph.D. - Publications
Affiliations: | 2005 | Stanford University, Palo Alto, CA |
Area:
materials scienceYear | Citation | Score | |||
---|---|---|---|---|---|
2005 | Lee A, Litteken CS, Dauskardt RH, Nix WD. Comparison of the telephone cord delamination method for measuring interfacial adhesion with the four-point bending method Acta Materialia. 53: 609-616. DOI: 10.1016/J.Actamat.2004.10.014 | 0.42 | |||
2004 | Lee A, Clemens BM, Nix WD. Stress induced delamination methods for the study of adhesion of Pt thin films to Si Acta Materialia. 52: 2081-2093. DOI: 10.1016/J.Actamat.2004.01.003 | 0.418 | |||
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