Timothy J. Harpster, Ph.D.
Affiliations: | 2005 | University of Michigan, Ann Arbor, Ann Arbor, MI |
Area:
micromachining technologies, micromachined sensors, actuators, and MEMS; analog integrated circuits; implantable biomedical microsystems; micropackaging; and low-power wireless sensing/actuating systemsGoogle:
"Timothy Harpster"Mean distance: 14.67 | S | N | B | C | P |
Parents
Sign in to add mentorKhalil Najafi | grad student | 2005 | University of Michigan | |
(Hermetic packaging and bonding technologies for implantable microsystems.) |
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Publications
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Harpster TJ, Nikles SA, Dokmeci MR, et al. (2005) Long-term hermeticity and biological performance of anodically bonded glass-silicon implantable packages Ieee Transactions On Device and Materials Reliability. 5: 458-465 |
Harpster TJ, Hauvespre S, Dokmeci MR, et al. (2002) A passive humidity monitoring system for in situ remote wireless testing of micropackages Journal of Microelectromechanical Systems. 11: 61-67 |
Harpster TJ, Stark B, Najafi K. (2002) A passive wireless integrated humidity sensor Sensors and Actuators, a: Physical. 95: 100-107 |
Harpster TJ, Najafi K. (2002) Long-term testing of hermetic anodically bonded glass-silicon packages Proceedings of the Ieee Micro Electro Mechanical Systems (Mems). 423-426 |
Stark BH, Dokmeci MR, Harpster TJ, et al. (2001) Improving corrosion-resistance of silicon-glass micropackages using boron doping and/or self-induced galvanic bias Annual Proceedings - Reliability Physics (Symposium). 112-119 |
Stark BH, Dokmeci MR, Harpster TJ, et al. (2001) Improving corrosion-resistance of silicon-glass micropackages using boron doping and/or self-induced galvanic bias Annual Proceedings - Reliability Physics (Symposium). 112-119 |
Harpster T, Hauvespre S, Dokmeci M, et al. (2000) Passive humidity monitoring system for in-situ remote wireless testing of micropackages Proceedings of the Ieee Micro Electro Mechanical Systems (Mems). 335-340 |