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Warren C. Welch, Ph.D.

Affiliations: 
2008 University of Michigan, Ann Arbor, Ann Arbor, MI 
Area:
micromachining technologies, micromachined sensors, actuators, and MEMS; analog integrated circuits; implantable biomedical microsystems; micropackaging; and low-power wireless sensing/actuating systems
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"Warren Welch"
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Khalil Najafi grad student 2008 University of Michigan
 (Vacuum and hermetic packaging of MEMS using solder.)

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Publications

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Galchev TV, Welch WC, Najafi K. (2011) A new low-temperature high-aspect-ratio MEMS process using plasma activated wafer bonding Journal of Micromechanics and Microengineering. 21
Lee SH, Mitchell J, Welch W, et al. (2010) Wafer-level vacuum/hermetic packaging technologies for MEMS Proceedings of Spie - the International Society For Optical Engineering. 7592
Welch WC, Najafi K. (2008) Gold-indium transient liquid phase (TLP) wafer bonding for MEMS vacuum packaging Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 806-809
Mitchell J, Welch W, Najafi K. (2008) Vacuum packaging of MEMS devices and the effects of outgassing and getter activation International Conference and Exhibition On Device Packaging 2009. 3: 1567-1606
Welch WC, Najafi K. (2007) Nickel-tin transient liquid phase (TLP) wafer bonding for MEMS vacuum packaging Transducers and Eurosensors '07 - 4th International Conference On Solid-State Sensors, Actuators and Microsystems. 1327-1328
Galchev T, Welch WC, Najafi K. (2007) Low-temperature MEMS process using plasma activated Silicon-On-Silicon (SOS) bonding Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 309-312
Welch WC, Chae J, Najafi K. (2005) Transfer of metal MEMS packages using a wafer-level solder transfer technique Ieee Transactions On Advanced Packaging. 28: 643-649
Welch WC, Najafi K. (2005) Transfer of metal MEMS packages using a wafer-level solder sacrificial layer Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 584-587
Welch W, Chae J, Lee SH, et al. (2005) Transient liquid phase (TLP) bonding for microsystem packaging applications Digest of Technical Papers - International Conference On Solid State Sensors and Actuators and Microsystems, Transducers '05. 2: 1350-1353
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