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Yu-Ting Cheng, Ph.D.

Affiliations: 
2000 University of Michigan, Ann Arbor, Ann Arbor, MI 
Area:
micromachining technologies, micromachined sensors, actuators, and MEMS; analog integrated circuits; implantable biomedical microsystems; micropackaging; and low-power wireless sensing/actuating systems
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"Yu-Ting Cheng"
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Khalil Najafi grad student 2000 University of Michigan
 (Localized heating and bonding technique for MEMS packaging.)

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Publications

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Cheng YH, Zhang CY, Ren J, et al. (2016) Hydrogen storage in Li-doped fullerene-intercalated hexagonal boron nitrogen layers Frontiers of Physics. 11
Wang C, Lee I, Wu C, et al. (2013) High-performance polycrystalline silicon thin-film transistors prepared via the laser crystallization of the prepatterned channel layer on the bottom-gate structure Thin Solid Films. 529: 421-425
Wang CL, Lee IC, Wu CY, et al. (2012) High-performance polycrystalline silicon thin-film transistors with two-dimensional location control of the grain boundary via excimer laser crystallization. Journal of Nanoscience and Nanotechnology. 12: 5505-9
Wang C, Cheng H, Lee I, et al. (2012) High-performance excimer-laser-crystallized polycrystalline silicon thin-film transistors with the pre-patterned recessed channel Japanese Journal of Applied Physics. 51: 66502
Wang C, Lee I, Wu C, et al. (2012) High-Performance Polycrystalline-Silicon Nanowire Thin-Film Transistors With Location-Controlled Grain Boundary via Excimer Laser Crystallization Ieee Electron Device Letters. 33: 1562-1564
Chao T, Li C, Chen YC, et al. (2010) An Interconnecting Technology for RF MEMS Heterogeneous Chip Integration Ieee Transactions On Electron Devices. 57: 928-938
Liu CM, Tseng YC, Chen C, et al. (2009) Superparamagnetic and ferromagnetic Ni nanorod arrays fabricated on Si substrates using electroless deposition. Nanotechnology. 20: 415703
Kou CT, Chao TY, Chiang IT, et al. (2007) Wafer level fabrication of hermetically sealed microcavity with robust metal interconnects for chip cooling application Sensors and Actuators a-Physical. 139: 259-264
Tsai L, Cheng Y, Hsu W, et al. (2006) Ni-carbon nanotubes nanocomposite for robust microelectromechanical systems fabrication Journal of Vacuum Science & Technology B. 24: 205-210
Liang Z, Cheng Y, Hsu W, et al. (2006) A wafer-level hermetic encapsulation for MEMS manufacture application Ieee Transactions On Advanced Packaging. 29: 513-519
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