Kaustubh S. Gadre, Ph.D.
Affiliations: | 2002 | Arizona State University, Tempe, AZ, United States |
Google:
"Kaustubh Gadre"Mean distance: 15.09 | S | N | B | C | P |
Parents
Sign in to add mentor| Terry L. Alford | grad student | 2002 | Arizona State | |
| (Integration of silver and copper metallization with low dielectric parylene-N, physical and electrical characterization.) | ||||
BETA: Related publications
See more...
Publications
|
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
| Theodore ND, Kim HC, Gadre KS, et al. (2004) Morphology of Ti37Al63 thin-films deposited by magnetron sputtering Materials Research Society Symposium Proceedings. 812: 215-220 |
| Kim HC, Theodore ND, Gadre KS, et al. (2004) Investigation of thermal stability, phase formation, electrical, and microstructural properties of sputter-deposited titanium aluminide thin films Thin Solid Films. 460: 17-24 |
| Kim HC, Theodore ND, Gadre KS, et al. (2004) Microstructure and stability of sputtered titanium aluminides on SiO 2 Scripta Materialia. 50: 517-521 |
| Alford TL, Gadre KS, Kim HC, et al. (2003) Abnormal electrical resistivity in γ-TiAl thin films deposited by magnetron sputtering Applied Physics Letters. 83: 455-457 |
| Gadre KS, Alford TL. (2003) Contact angle measurements for adhesion energy evaluation of silver and copper films on parylene-n and SiO2 substrates Journal of Applied Physics. 93: 919-923 |
| Alford TL, Chen L, Gadre KS. (2003) Stability of silver thin films on various underlying layers at elevated temperatures Thin Solid Films. 429: 248-254 |
| Alford TL, Zou YL, Gadre KS, et al. (2001) Characterization of thin photosensitive polyimide films for future metallization schemes Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 19: 1253-1258 |
| Alford TL, Zou YL, Gadre KS, et al. (2001) Integration and electrical characterization of photosensitive polyimide Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 19: 774-779 |
| Gadre KS, Alford TL, Mayer JW. (2001) Use of TiN(O)Ti as an effective intermediate stress buffer and diffusion barrier for Cu/parylene-n interconnects Applied Physics Letters. 79: 3260-3262 |
| Gadre KS, Alford TL. (2001) Crack formation in TiN films deposited on Pa-n due to large thermal mismatch Thin Solid Films. 394: 125-130 |