Gang Huang, Ph.D.
Affiliations: | 2008 | Georgia Institute of Technology, Atlanta, GA |
Area:
Microelectronics/MicrosystemsGoogle:
"Gang Huang"Mean distance: 20.07
Parents
Sign in to add mentor| James D. Meindl | grad student | 2008 | Georgia Tech | |
| (Compact physical models for power supply noise and chip/package co-design in gigascale integration (GSI) and three-dimensional integration systems.) | ||||
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Publications
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| Zheng L, Zhang Y, Huang G, et al. (2014) Novel electrical and fluidic microbumps for silicon interposer and 3-D ICs Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 777-785 |
| Huang G, Bakir MS, Naeemi A, et al. (2012) Power delivery for 3-D chip stacks: Physical modeling and design implication Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 852-859 |
| Bakir M, Huang G, Sekar D, et al. (2009) 3D integrated circuits: Liquid cooling and power delivery Iete Technical Review (Institution of Electronics and Telecommunication Engineers, India). 26: 407-416 |
| Bakir MS, Huang G. (2009) Power delivery, signaling and cooling for 3D integrated systems Materials Research Society Symposium Proceedings. 1156: 169-179 |