Morris Eugene Fine

Affiliations: 
1954-1988 Materials science Northwestern University, Evanston, IL 
Area:
physical metallurgy
Website:
http://www.mccormick.northwestern.edu/news/articles/2015/10/morris-fine-materials-science-pioneer-passes-away.html
Google:
"Morris Eugene Fine"
Bio:

(1918 - 2015)
http://www.nae.edu/29388.aspx

Mean distance: 19.47
 
SNBCP

Parents

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Ralph Lewis Dowdell grad student 1943 UMN
 (Solderability of Ordinary and Substitute Soft Solders)
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Publications

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Kapoor M, Isheim D, Vaynman S, et al. (2016) Effects of increased alloying element content on NiAl-type precipitate formation, loading rate sensitivity, and ductility of Cu- and NiAl-precipitation-strengthened ferritic steels Acta Materialia. 104: 166-171
Song G, Sun Z, Li L, et al. (2015) Ferritic Alloys with Extreme Creep Resistance via Coherent Hierarchical Precipitates. Scientific Reports. 5: 16327
Yao Y, Wang Y, Keer LM, et al. (2015) An analytical method to predict electromigration-induced finger-shaped void growth in SnAgCu solder interconnect Scripta Materialia. 95: 7-10
Qiao JC, Wang YJ, Pelletier JM, et al. (2015) Characteristics of stress relaxation kinetics of La60Ni15Al25 bulk metallic glass Acta Materialia. 98: 43-50
Yao Y, He X, Keer LM, et al. (2015) A continuum damage mechanics-based unified creep and plasticity model for solder materials Acta Materialia. 83: 160-168
Kapoor M, Isheim D, Ghosh G, et al. (2014) Aging characteristics and mechanical properties of 1600 MPa body-centered cubic Cu and B2-NiAl precipitation-strengthened ferritic steel Acta Materialia. 73: 56-74
Yablinsky CA, Tippey KE, Vaynman S, et al. (2014) Concepts for the Development of Nanoscale Stable Precipitation-Strengthened Steels Manufactured by Conventional Methods Jom. 66: 2467-2475
Sun Z, Liebscher CH, Huang S, et al. (2013) New design aspects of creep-resistant NiAl-strengthened ferritic alloys Scripta Materialia. 68: 384-388
Yao Y, Fry J, Fine ME, et al. (2013) The Wiedemann-Franz-Lorenz relation for lead-free solder and intermetallic materials Acta Materialia. 61: 1525-1536
Yao Y, Fry J, Fine M, et al. (2012) Numerical analysis to lead free solder/intermetallic interconnect with application of wiedemann-franz-lorenz relation Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 3: 1275-1284
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