John J. Senkevich, Ph.D.
Affiliations: | 2002 | Rensselaer Polytechnic Institute, Troy, NY, United States |
Area:
Materials Science Engineering, Condensed Matter PhysicsGoogle:
"John Senkevich"Mean distance: (not calculated yet)
Parents
Sign in to add mentorToh-Ming Lu | grad student | 2002 | RPI | |
(Atomic and molecular layer activation of dielectric surfaces.) |
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Publications
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Senkevich JJ. (2014) Oxidative chemical vapor deposition of polyacenaphthylene, polyacenaphthene, and polyindane via benzoyl peroxide Thin Solid Films. 556: 23-27 |
Senkevich JJ. (2011) Non-halogen liquid precursor route to parylene Chemical Vapor Deposition. 17: 76-79 |
Senkevich JJ. (2011) Stability of CVD-produced polymer thin films Chemical Vapor Deposition. 17: 170-172 |
Geil RD, Senkevich JJ, Rogers BR. (2009) Method for measuring solvent permeation through polymer film on porous dielectric films Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 27: 1825-1828 |
Mitchell CJ, Yang GR, Senkevich JJ. (2006) Adhesion aspects of poly(p-xylylene) to SiO2 surfaces using γ-methacryloxypropyltrimethoxysilane as an adhesion promoter Journal of Adhesion Science and Technology. 20: 1637-1647 |
Kim YS, Kim HI, Dar MA, et al. (2006) Electrochemically deposited ruthenium seed layer followed by copper electrochemical plating Electrochemical and Solid-State Letters. 9 |
Senkevich JJ, Karabacak T, Bae DL, et al. (2006) Formation of body-centered-cubic tantalum via sputtering on low- κ dielectrics at low temperatures Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 24: 534-538 |
Kim YS, Shin J, Cho JH, et al. (2006) Surface characterization of copper electroless deposition on atomic layer deposited palladium on iridium and tungsten Surface and Coatings Technology. 200: 5760-5766 |
Kim YS, Kim HI, Cho JH, et al. (2006) Electrochemical deposition of copper and ruthenium on titanium Electrochimica Acta. 51: 5445-5451 |
Kim YS, Kim HI, Cho JH, et al. (2006) Electroless copper on refractory and noble metal substrates with an ultra-thin plasma-assisted atomic layer deposited palladium layer Electrochimica Acta. 51: 2400-2406 |