Konrad Rykaczewski, Ph.D.

Affiliations: 
2009 Georgia Institute of Technology, Atlanta, GA 
Area:
Mechanical Engineering
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"Konrad Rykaczewski"

Parents

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Andrei Fedorov grad student 2009 Georgia Tech
 (Electron beam induced deposition (EBID) of carbon interface between carbon nanotube interconnect and metal electrode.)
John Henry J. Scott post-doc (Neurotree)

Children

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Viraj Damle grad student 2017 Arizona State
Xiaoda Sun grad student 2017 Arizona State
Wilson Kong grad student 2017-2021 Arizona State (Physics Tree)
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Publications

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Shah NUH, Kanetkar S, Uppal A, et al. (2022) Mechanism of Oil-in-Liquid Metal Emulsion Formation. Langmuir : the Acs Journal of Surfaces and Colloids. 38: 13279-13287
Uppal A, Kong W, Rana A, et al. (2021) Enhancing Thermal Transport in Silicone Composites via Bridging Liquid Metal Fillers with Reactive Metal Co-Fillers and Matrix Viscosity Tuning. Acs Applied Materials & Interfaces
Shah NUH, Kong W, Casey N, et al. (2021) Gallium oxide-stabilized oil in liquid metal emulsions. Soft Matter
Kotagama P, Manning KC, Rykaczewski K. (2020) Fundamentals of soft thermofluidic system design. Soft Matter
Kong W, Shah NUH, Neumann TV, et al. (2020) Oxide-mediated mechanisms of gallium foam generation and stabilization during shear mixing in air. Soft Matter
Rykaczewski K. (2020) Rational design of sun and wind shaded evaporative cooling vests for enhanced personal cooling in hot and dry climates Applied Thermal Engineering. 171: 115122
Uppal A, Ralphs M, Kong W, et al. (2019) Pressure-Activated Thermal Transport via Oxide Shell Rupture in Liquid Metal Capsule Beds. Acs Applied Materials & Interfaces
Kong W, Wang Z, Wang M, et al. (2019) Oxide-Mediated Formation of Chemically Stable Tungsten-Liquid Metal Mixtures for Enhanced Thermal Interfaces. Advanced Materials (Deerfield Beach, Fla.). e1904309
Kotagama P, Phadnis A, Manning KC, et al. (2019) Rational Design of Soft, Thermally Conductive Composite Liquid‐Cooled Tubes for Enhanced Personal, Robotics, and Wearable Electronics Cooling Advanced Materials Technologies. 4: 1800690
Ralphs M, Kong W, Wang RY, et al. (2019) Thermal Conductivity Enhancement of Soft Polymer Composites through Magnetically Induced Percolation and Particle–Particle Contact Engineering Advanced Materials Interfaces. 6: 1801857
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