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John William Morris, Jr.

Affiliations: 
Materials Science and Mineral Engineering University of California, Berkeley, Berkeley, CA 
Area:
design and behavior analysis of metals and alloys
Website:
http://www.mse.berkeley.edu/faculty/Morris/morris.html
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"John William Morris, Jr."
Bio:

http://www.worldcat.org/oclc/25043373

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Parents

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Philip Louis De Bruyn grad student 1964-1969 MIT (Chemistry Tree)

Children

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David Mitlin grad student UC Berkeley (E-Tree)
Sungho Jin grad student 1970-1974 UC Berkeley (BME Tree)
Brent Thomas Fultz grad student 1982 UC Berkeley
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Publications

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de Jong M, Kacher J, Sluiter MH, et al. (2015) Electronic Origins of Anomalous Twin Boundary Energies in Hexagonal Close Packed Transition Metals. Physical Review Letters. 115: 065501
Yu Q, Qi L, Tsuru T, et al. (2015) Metallurgy. Origin of dramatic oxygen solute strengthening effect in titanium. Science (New York, N.Y.). 347: 635-9
Sankaran RP, Ophus C, Ozdol B, et al. (2014) HAADF imaging of the omega (ω) phase in a gum metal-related alloy Philosophical Magazine. 94: 2900-2912
Qi L, Khachaturyan AG, Morris JW. (2014) The microstructure of dislocated martensitic steel: Theory Acta Materialia. 76: 23-39
Kinney CC, Pytlewski KR, Khachaturyan AG, et al. (2014) The microstructure of lath martensite in quenched 9Ni steel Acta Materialia. 69: 372-385
Linares X, Kinney C, Lee KO, et al. (2014) The influence of Sn orientation on intermetallic compound evolution in idealized Sn-Ag-Cu 305 interconnects: An electron backscatter diffraction study of electromigration Journal of Electronic Materials. 43: 43-51
Furuta T, Kuramoto S, Morris JW, et al. (2013) The mechanism of strength and deformation in Gum Metal Scripta Materialia. 68: 767-772
Lee KO, Morris JW, Hua F. (2013) Mechanisms of creep deformation in pure Sn solder joints Journal of Electronic Materials. 42: 516-526
Lee KO, Morris JW, Hua F. (2013) Transformation-induced plasticity in Sn-In solder joints Journal of Electronic Materials. 42: 168-178
Kinney C, Linares X, Lee KO, et al. (2013) The effect of Sn orientation on intermetallic compound growth in idealized Sn-Cu-Ag interconnects Journal of Electronic Materials. 42: 607-615
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