John William Morris, Jr.
|Materials Science and Mineral Engineering||University of California, Berkeley, Berkeley, CA|
Area:design and behavior analysis of metals and alloys
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|de Jong M, Kacher J, Sluiter MH, et al. (2015) Electronic Origins of Anomalous Twin Boundary Energies in Hexagonal Close Packed Transition Metals. Physical Review Letters. 115: 065501|
|Yu Q, Qi L, Tsuru T, et al. (2015) Metallurgy. Origin of dramatic oxygen solute strengthening effect in titanium. Science (New York, N.Y.). 347: 635-9|
|Sankaran RP, Ophus C, Ozdol B, et al. (2014) HAADF imaging of the omega (ω) phase in a gum metal-related alloy Philosophical Magazine. 94: 2900-2912|
|Qi L, Khachaturyan AG, Morris JW. (2014) The microstructure of dislocated martensitic steel: Theory Acta Materialia. 76: 23-39|
|Kinney CC, Pytlewski KR, Khachaturyan AG, et al. (2014) The microstructure of lath martensite in quenched 9Ni steel Acta Materialia. 69: 372-385|
|Linares X, Kinney C, Lee KO, et al. (2014) The influence of Sn orientation on intermetallic compound evolution in idealized Sn-Ag-Cu 305 interconnects: An electron backscatter diffraction study of electromigration Journal of Electronic Materials. 43: 43-51|
|Furuta T, Kuramoto S, Morris JW, et al. (2013) The mechanism of strength and deformation in Gum Metal Scripta Materialia. 68: 767-772|
|Lee KO, Morris JW, Hua F. (2013) Mechanisms of creep deformation in pure Sn solder joints Journal of Electronic Materials. 42: 516-526|
|Lee KO, Morris JW, Hua F. (2013) Transformation-induced plasticity in Sn-In solder joints Journal of Electronic Materials. 42: 168-178|
|Kinney C, Linares X, Lee KO, et al. (2013) The effect of Sn orientation on intermetallic compound growth in idealized Sn-Cu-Ag interconnects Journal of Electronic Materials. 42: 607-615|