John William Morris, Jr.
Affiliations: | Materials Science and Mineral Engineering | University of California, Berkeley, Berkeley, CA |
Area:
design and behavior analysis of metals and alloysWebsite:
http://www.mse.berkeley.edu/faculty/Morris/morris.htmlGoogle:
"John William Morris, Jr."Bio:
http://www.worldcat.org/oclc/25043373
Mean distance: (not calculated yet)
Children
Sign in to add trainee| David Mitlin | grad student | UC Berkeley (E-Tree) | |
| Sungho Jin | grad student | 1970-1974 | UC Berkeley (BME Tree) |
| Brent Thomas Fultz | grad student | 1982 | UC Berkeley |
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Publications
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| de Jong M, Kacher J, Sluiter MH, et al. (2015) Electronic Origins of Anomalous Twin Boundary Energies in Hexagonal Close Packed Transition Metals. Physical Review Letters. 115: 065501 |
| Yu Q, Qi L, Tsuru T, et al. (2015) Metallurgy. Origin of dramatic oxygen solute strengthening effect in titanium. Science (New York, N.Y.). 347: 635-9 |
| Sankaran RP, Ophus C, Ozdol B, et al. (2014) HAADF imaging of the omega (ω) phase in a gum metal-related alloy Philosophical Magazine. 94: 2900-2912 |
| Qi L, Khachaturyan AG, Morris JW. (2014) The microstructure of dislocated martensitic steel: Theory Acta Materialia. 76: 23-39 |
| Kinney CC, Pytlewski KR, Khachaturyan AG, et al. (2014) The microstructure of lath martensite in quenched 9Ni steel Acta Materialia. 69: 372-385 |
| Linares X, Kinney C, Lee KO, et al. (2014) The influence of Sn orientation on intermetallic compound evolution in idealized Sn-Ag-Cu 305 interconnects: An electron backscatter diffraction study of electromigration Journal of Electronic Materials. 43: 43-51 |
| Furuta T, Kuramoto S, Morris JW, et al. (2013) The mechanism of strength and deformation in Gum Metal Scripta Materialia. 68: 767-772 |
| Lee KO, Morris JW, Hua F. (2013) Mechanisms of creep deformation in pure Sn solder joints Journal of Electronic Materials. 42: 516-526 |
| Lee KO, Morris JW, Hua F. (2013) Transformation-induced plasticity in Sn-In solder joints Journal of Electronic Materials. 42: 168-178 |
| Kinney C, Linares X, Lee KO, et al. (2013) The effect of Sn orientation on intermetallic compound growth in idealized Sn-Cu-Ag interconnects Journal of Electronic Materials. 42: 607-615 |