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John F. Wager

Affiliations: 
Oregon State University, Corvallis, OR 
Area:
Materials Science Engineering, Condensed Matter Physics, Electronics and Electrical Engineering
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Children

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Beau A. Baukol grad student 2001 Oregon State
Jeffrey P. Bender grad student 2004 Oregon State
Benjamin J. Norris grad student 2004 Oregon State
E. W. Cowell grad student 2012 Oregon State
Ken Hoshino grad student 2012 Oregon State
Eric S. Sundholm grad student 2013 Oregon State

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Publications

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Wager JF. (2020) Corrections to ``Electronic Conduction Mechanisms in Insulators'' Ieee Transactions On Electron Devices. 1-1
Mohd Daut MH, Wager JF, Nathan A. (2019) ZnON MIS Thin-Film Diodes Ieee Journal of the Electron Devices Society. 7: 375-381
Jenkins MA, McGlone JM, Wager JF, et al. (2019) Internal photoemission spectroscopy determination of barrier heights between Ta-based amorphous metals and atomic layer deposited insulators Journal of Applied Physics. 125: 55301
Pelatt BD, Wager JF, Keszler DA. (2019) Elucidation of bonding trends from variability in Atomic Solid State Energies Journal of Solid State Chemistry. 274: 337-351
Perkins CK, Jenkins M, Chiang TH, et al. (2018) Demonstration of Fowler-Nordheim tunneling in simple solution-processed thin film. Acs Applied Materials & Interfaces
Chiang T, Wager JF. (2018) Electronic Conduction Mechanisms in Insulators Ieee Transactions On Electron Devices. 65: 223-230
Mcglone JM, Pommerenck JK, Graham MW, et al. (2018) Amorphous Metal Thin Films for Thermal Inkjet Printing Journal of Microelectromechanical Systems. 27: 289-295
McGlone JM, Olsen KR, Stickle WF, et al. (2017) TaWSi amorphous metal thin films: composition tuning to improve thermal stability Mrs Communications. 7: 715-720
Stewart KA, Gouliouk V, McGlone JM, et al. (2017) Side-by-Side Comparison of Single- and Dual-Active Layer Oxide TFTs: Experiment and TCAD Simulation Ieee Transactions On Electron Devices. 64: 4131-4136
Heo J, Yu L, Altschul E, et al. (2017) CuTaS3: Intermetal d–d Transitions Enable High Solar Absorption Chemistry of Materials. 29: 2594-2598
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